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Flexible Printed Circuit (FPC) Built on 2oz Polyimide With Immersion Gold and Yellow Coverlay  for Interface Module

Flexible Printed Circuit (FPC) Built on 2oz Polyimide With Immersion Gold and Yellow Coverlay for Interface Module

  • NUMBER OF LAYERS
    2
  • BOARD MATERIAL
    Polyimide 25μm
  • BOARD THICKNESS
    0.25mm
  • SURFACE CU THICKNESS
    2oz
  • SURFACE FINISH
    Immersion Gold
  • COVERLAY COLOUR
    Yellow
  • COLOR OF SILKSCREEN
    NO
  • TEST
    100% Electrical Test Prior Shipment
  • Place of Origin
    China
  • Brand Name
    Bicheng Technologies Limited
  • Certification
    UL
  • Model Number
    BIC-313-N0.313
  • Minimum Order Quantity
    1
  • Price
    USD9.99-99.99
  • Packaging Details
    Plastic Bag
  • Delivery Time
    10 working days
  • Payment Terms
    T/T/Paypal
  • Supply Ability
    50000 pieces per month

Flexible Printed Circuit (FPC) Built on 2oz Polyimide With Immersion Gold and Yellow Coverlay for Interface Module

Flexible Printed Circuit (FPC) Built on 2oz Polyimide With Immersion Gold and Yellow Coverlay for Interface Module

(Flexible printed circuits are custom-made products, the picture and parameters shown are just for reference)

 

General description

This is a type of 2 Layer flexible printed circuit (FPC) built on 2oz polyimide for the application of Interface Module.

 

Basic specifications

Base material: Polyimide 25μm

Layer count: 2 layers

Type: Individual FPC

Format: 105mm x 42.3mm = 1 type = 1 piece

Surface finish: Immersion gold

Copper weight: Outer layer 70μm/ Inner layer 0 μm

Solder mask / Legend: Yellow coverlay / No.

Final PCB height: 0.25 mm

Standard: IPC 6012 Class 2

Packing: 100 pieces are packed for shipment.

Lead time: 10 working days

Shelf life: 6 months

 

Flexible Printed Circuit (FPC) Built on 2oz Polyimide With Immersion Gold and Yellow Coverlay  for Interface Module 0

 

Features and benefits

Reliability increased;

Controllability of electrical parameter design;

The end can be whole soldered;

SMT process is resistant to reflow soldering, resistant to rework;

Professional and experienced engineers check your production files

Competitive price;

No MOQ, low cost for prototypes and small runs quantity;

8000 types of PCB's per month;

 

Applications

Thin-film switch, contact belt of inkjet printer, industrial control interphone, medical keypad soft board, contact belt

of inkjet printer projector soft board

 

Specifications of Standard 2 Layer FCCL

 

Specifications Thickness (µm) Copper Type Applications
Polyimide Film Copper Foil
SF202 0512DT 12.5 12 RTF Camera, LCM, TP etc..
SF202 0812DT 20 12 RTF
SF202 1012DT 25 12 RTF
SF202 0518DT 12.5 18 RTF Batter FPC
SF202 0818DT 20 18 RTF
SF2021018DT 25 18 RTF
SF202 0512DR 12.5 12 RA Camera, LCM, TP etc..
SF202 0812DR 20 12 RA
SF202 1012DR 25 12 RA
SF202 0518DR 12.5 18 RA
SF202 0818DR 20 18 RA
SF202 1018DR 25 18 RA
SF202 0535DT 12.5 35 RTF Batter FPC
SF202 1035DT 25 35 RTF
SF202 0535DR 12.5 35 RA
SF202 1035DR 25 35 RA

 

Specifications of New FCCL
Double sided adhesiveless flexible copper clad laminate (SF202)
 
Specifications Thickness (µm) Copper Type Applications
Polyimide Film Copper Foil
SF202 0506DR 12.5 6 RA Fine-line
SF20200509DR 12 9 RA
SF202 0509DT 12 9 RTF
SF202 0812DR 20 12 RA Side switch
SF202 1012DR 25 12 RA
SF202 0545DT 12.5 45 RTF Wireless Charge
SF202 1045DT 25 45 RTF
SF202 0550DT 12.5 50 RTF
SF202 1050DT 25 50 RTF
SF202 0570DT 12.5 70 RTF
SF202 1070DT 25 70 RTF
SF202 101850DT 25 18, 50 RTF
SF202 101870DT 25 18,70 RTF
Product Code Description
SF202 05 12 D T
SF202: Shengyi Adhesiveless FCCL Designation
05: PI Film Thickness, 05- 12.5µm; 08-20µm
12: Copper Foil Thickness, 12-12µm, 18-18µm
D: Double Sided
T:RTF copper; R- RA Copper; E- ED copper
 
 

Clarifications of FPC

According to the combination of base material and copper foil, flexible circuit board can be divided into two types:

flexible board with adhesive and flexible board without adhesive. The price of non-adhesive flexible PCB is much

higher than that of adhesive flexible PCB, but its flexibility, bonding force between copper foil and substrate and

flatness of solder are also better than that of adhesive flexible PCB. So it is only used in the high demand situations,

such as the: COF (CHIP ON FLEX, flexible board with bare chip, the high flatness of the pad) and so on. Because its

price is high, most of the flexible PCBs used in the market are still adhesive flexible circuit board. Because the flexible

circuit board is mainly used in the situation where bending is required, if the design or process is not reasonable, it is

easy to produce micro-cracks, welding and other defects.

 

Economy of using FPC

If the circuit design is relatively simple, the total volume is small, and the space is suitable, the traditional internal

connection is much cheaper. Flexible circuits are a good design option if the circuit is complex, processes many

signals or has special electrical or mechanical requirements. When the size and performance of applications

exceed the capacity of rigid circuits, flexible assembly is the most economical. A 12mil pad with a 5mil through

hole and a flexible circuit with 3mil lines and spacing can be fabricated on a thin film. Therefore, it is more reliable

to mount the chip directly on the film. There is no flame retardant that could be an ion source. These films may be

protective and solidified at higher temperatures to obtain higher glass transition temperatures. Flexible materials

are less costly than rigid materials because they are free of connectors.

 

Flexible Printed Circuit (FPC) Built on 2oz Polyimide With Immersion Gold and Yellow Coverlay  for Interface Module 1