Advanced TLY 5Z High Frequency PCB Manufacturing for Aerospace and RF Applications

August 22, 2025

Introduction

TLY-5Z laminates represent a cutting-edge composite material technology, combining glass-filled PTFE with woven fiberglass reinforcement. Designed specifically for low-density applications, these high-performance laminates deliver exceptional dimensional stability and reduced Z-axis expansion, making them ideal for weight-sensitive applications in aerospace and advanced RF systems.

Key Material Properties

Specific gravity of 1.92 g/cm³ ensures lightweight performance
Low dielectric constant of 2.20±0.04 at 10 GHz maintains signal integrity
Ultra-low dissipation factor of 0.0015 minimizes signal loss
Reduced CTE values (X: 30 ppm/°C, Y: 40 ppm/°C) enhance thermal stability
Minimal moisture absorption rate of 0.03% ensures reliability in varying environments
UL-94 V-0 flammability rating meets stringent safety requirements
Half the thermal expansion of traditional PTFE substrates improves plated through-hole reliability

PCB Manufacturing Capabilities

Our TLY-5Z PCB fabrication services include:
Single-sided, double-sided, multilayer and hybrid constructions
Copper weight options of 1 oz (35 µm) and 2 oz (70 µm)
Laminate thickness selections from 10 mil to 60 mil
Maximum board dimensions of 400 x 500 mm
Comprehensive solder mask color options including green, black, blue, yellow and red
Full range of surface finishes including ENIG, HASL, immersion silver, immersion tin, ENEPIG, OSP and pure gold

Applications

TLY-5Z circuit boards excel in demanding applications including
Aerospace avionics and communication systems
Lightweight aircraft and satellite antennas
RF passive components and microwave circuits
High-frequency military and defense systems
Weight-sensitive wireless communication devices

Thank you for reading. For more information, stay tuned for our next update.