Need High-Power RF Circuit Boards? Discover RT/duroid 6035HTC's Superior Thermal Performance

June 30, 2025

Why RT/duroid 6035HTC PCBs Excel in High-Power Applications?

RT/duroid 6035HTC is a ceramic-filled PTFE composite engineered for high-power RF/microwave systems. With 2.4× higher thermal conductivity than standard RT/duroid 6000 materials, it delivers exceptional heat dissipation and stable electrical performance under extreme conditions.

Key Advantages:

High Thermal Conductivity (1.44 W/m/K) – Ideal for power-hungry applications
Stable Dielectric Constant (3.50±0.05) – Ensures signal consistency
Low Loss Tangent (0.0013 @ 10GHz) – Minimizes RF signal degradation
Thermally Stable Copper Foil – Reduces insertion loss & maintains trace integrity
Enhanced Drillability – Lowers manufacturing costs vs. alumina-filled laminates

PCB Manufacturing Capabilities

1. Custom Design Flexibility
Layers: Single, Double, Multilayer & Hybrid PCBs
Copper Weights: 1oz (35µm) & 2oz (70µm)
Thickness Options: 10mil (0.254mm) to 60mil (1.524mm)
Max Panel Size: 400mm × 500mm

2.Aesthetic & Functional Finishes
Solder Mask Colors: Green, Black, Blue, Yellow, Red + Custom
Surface Treatments: ENIG, HASL, Immersion Silver/Tin, OSP, ENEPIG, Pure Gold

Ideal Applications for RT/duroid 6035HTC

This high-performance material is critical for:
High-Power RF/Microwave Amplifiers
5G Base Stations & Power Dividers
Satellite Communication Systems
Military Radar & EW Systems
Filters, Couplers & Combiners

Why Choose RT/duroid 6035HTC?

Unmatched Thermal Management – Prevents overheating in power-dense designs
Reliable High-Frequency Operation – Stable Dk even at elevated temperatures
Cost-Effective Machining – Easier drilling reduces production expenses

Ready for High-Power RF Solutions?

RT/duroid 6035HTC PCBs combine thermal resilience with RF precision for demanding applications. Contact us to optimize your design!