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| Design For Manufacture （1） | 1-JAN-2023 | ||||
| Serial NO. | Procedure | Item | Large volume （S<100 m²） | Middle volume （S<10 m²） | Prototype（S<1m²） |
| 1 | Inner layer (18um, 35um, 70um etc are finished copper. If not mentioned copper, finished 1oz is the default value ) | Min.dielectric layer | 0.1mm | 0.1mm | 0.05mm |
| 2 | Min.track and spacing | 5/5mil(18um) | 4/4mil(18um) | 3/3.5mil(18um) | |
| 3 | 5/5mil(35um) | 4/4mil(35um) | 3/4mil(35um) | ||
| 4 | 7/9mil(70um) | 6/8mil(70um) | 6/7mil(70um) | ||
| 5 | 9/11mil(105um) | 8/10mil(105um) | 8/9mil(105um) | ||
| 6 | 13/13mil(140um) | 12/12mil(140um) | 12/11mil(140um) | ||
| 7 | Min.distance from drill to conductor | 4 Layer 10mil，6 layer 10mil，8-12 layer 12mil | 4 layer 8mil，6 layer 8mil，8-12 layer 10mil，14-20 layer 14mil，22-32 layer 18mil | 4 layer 6mil，6 layer 6mil，8-14 layer 8mil，16-22 layer 12mil，24-32 layer 14mil | |
| 8 | Min.width of annular ring on inner layer | 4 Layer 10mil（35um），≥6 Layer 14mil（35um） | 4 Layer 8mil(35um)，≥6 layer 12mil（35um） | 4 Layer 6mil（35um），≥6 Layer 10mil（35um） | |
| 9 | Inner layer isolation ring width(Min) | 10mil （35um） | 8mil （35um） | 6mil （35um） | |
| 10 | Min.via pad diameter | 20mil （35um） | 16mil （35um） | 16mil （35um） | |
| 11 | Min. distance from board edge to conductor(no copper exposured) | 14 mil（35um） | 12 mil（35um） | 8 mil（35um） | |
| 12 | Maximum copper weight (Inner layer) | 12 OZ( 420 um ) | 12 OZ ( 420 um ) | 12 OZ ( 420 um ) | |
| 13 | Different copper foil between layers | 17.5 / 210 um | 17.5 / 210 um | 17.5 / 210 um | |
| 14 | Inner layer BGA channel | Above 5 mil (18 um, 35 um coppper), above 6.5 mil (70um copper) | |||
| 15 | AOI | Copper weight | 105um | ||
| 16 | Test capability | 2mil /2mil | |||
| Serial NO. | Procedure | Item | Manufacturing capability | ||
| Large volume （S<100 m²） | Middle volume （S<10 m²） | Prototype（S<1m²） | |||
| 17 | Laminating | Tolerance of laminating thickness | ±10% PCB thick | ±10% PCB thick | ±8% PCB thick |
| 18 | Maximum laminating thickness | 10.0mm | 10.0mm | 10.0mm | |
| 19 | Laminating alignment accuracy | ≤±4 mil | ≤±3 mil | ≤±3 mil | |
| 20 | Drill (18um, 35um, 70um etc are finished copper. If not mentioned copper, finished 1oz is the default value ) | Min.diameter of drill bit | 0.1mm | 0.1mm | 0.1mm |
| 21 | Min.diameter of slot router | 0.50mm | 0.50mm | 0.50mm | |
| 22 | Min.tolerance of PTH slots | ±0.102mm | ±0.102mm | ±0.102mm | |
| 23 | Max.aspect ratio | 1:16 | 1:16 | 1:16 | |
| 24 | Hole tolerance | ±3mil | ±3mil | ±3mil | |
| 25 | Space of via to via | 6mil(same net)，12mil(different net) | 6mil(same net)，12mil(different net) | 6mil(same net)，12mil(different net) | |
| 26 | Space of component hole to component hole | 10mil(same net)，10mil(different net) | 10mil(same net)，10mil(different net) | 10mil(same net)，10mil(different net) | |
| 27 | Controlled drill | Tolerance of depth | +/- 2mil | ||
| 28 | Concentric Accuracy of Back drill hole | +/- 2mil | |||
| 29 | Dielectric thickness of Back drill | ≥4mil | |||
| 30 | Diameter of back drill | 0.3mm ~ 6.5mm | |||
| 31 | Back drill STUB | 2~6 mil | |||
| 32 | Laser drill | Surface copper | 9-12um | ||
| 33 | Diameter | 4mil, 5mil | |||
| 34 | Material | Epoxy(106, 1080, 2113), Hydracarbon, PPO/PPE | |||
| 35 | Etching | Min.width of etching logo | 8mil(12um,18um base copper)，10 mil (35um base copper)，12 mil(70um） | ||
| 36 | Etch factor | 1.6-2.2 | 1.6-2.2 | 1.6-2.2 | |
| 37 | Outer layer(18um, 35um, 70um etc are finished copper. If not mentioned copper, finished 1oz is the default value ) | Min.via pad diameter | 20mil | 16mil | 16mil |
| 38 | Min.BGA pad diameter | 8mil | 8mil | 8mil | |
| 39 | Min.track and spacing | base copper 12um, finished 30um | 2.5mil / 2.5mil | ||
| base copper 17um, finished 35um | 2.8mil / 2.8mil | ||||
| base copper 35um, finished 53um | 3.5mil / 3.5mil | ||||
| base copper 53um, finihsed 70um | 5.0mil / 5.0mil | ||||
| base copper 70um, finished 87.5um | 5.0mil / 6.0mil | ||||
| 40 | base copper 87.5um | 7.0mil / 7.0mil | |||
| 41 | base copper 105um | 8.0mil / 8.0mil | |||
| 42 | base copper 140um | 10.0mil / 10.0mil | |||
| 43 | base copper 175um | 11mil / 11mil | |||
| 44 | base copper 210um | 12mil / 12mil | |||
| 45 | 6oz ~ ≤12oz: For each additional 1 oz, the capacity increases by 1.5/1.5 mil. | ||||
| 46 | Minimum grid | 10/10mil(35um) | 8/8mil(35um) | 4/8mil(35um) | |
| 47 | Min.space (conductor to pad, pad to pad) | 6mil(18um) | 5mil(18um) | 4mil(18um) | |
| 6mil(35um) | 5mil(35um) | 4mil(35um) | |||
| 9mil(70um) | 8mil(70um) | 7mil(70um) | |||
| 11mil(105um) | 10mil(105um) | 9mil(105um) | |||
| 13mil(140um) | 12mil(140um) | 11mil(140um) | |||
| 48 | Different copper foil between layers | 17.5 / 210 um | |||
| Serial NO. | Procedure | Item | Manufacturing capability | ||
| Large volume （S<100 m²） | Middle volume （S<10 m²） | Prototype（S<1m²） | |||
| 49 | Solder mask (18um, 35um, 70um etc are finished copper. If not mentioned copper, finished 1oz is the default value ) | Maximum via-plug diameter | 0.65mm | 0.65mm | 0.65mm |
| 50 | Maximum PCB finished thickness of via-plug | 3.2mm | 3.2mm | 3.2mm | |
| 51 | Min.width of solder mask bridge | base copper ≦35um | Green | 4mil | |
| 52 | Others | 5mil | |||
| 53 | copper 70-140um | All of colours | 6mil | ||
| 54 | base copper >140um | All of colours | 8 mil | ||
| 55 | Min. solder mask opening | single side 1mil (full gold plated PCB, partial area 2mil is allowed; Other PCB, parital area 1.5mil is allowed. | |||
| 56 | Min.solder mask covering traces. | 1.5mil (partial area 1.0mil is allowed | |||
| 57 | Min. width of opening characters | 8mil | |||
| 58 | Min.width of solder mask characters | 9mil(35um) | 9mil(35um) | 8mil(35um) | |
| 59 | Min.thickness of Solder mask | 9um(35um) | 9um(35um) | 9um(35um) | |
| 60 | Max.thickness of solder mask | 30um(35um) | 30um(35um) | 30um(35um) | |
| 61 | Colour | Green, Yellow, Orange, Black, Blue, Red, White, Matt green, Matt black, Matt blue, Purple, Gray | |||
| 62 | Tolerance of Thickness | ±5um | |||
| 63 | Min.height of opening character | 8mil | |||
| 64 | Notation / Characters (Silkscreen) | Min.width and height | 12um, 18um base copper | Width: 4mil | Height: 25mil |
| 65 | 35um base copper | Width: 4mil | Height: 30mil | ||
| 66 | ≥70um base copper | Width: 6mil | Height: 45mil | ||
| 67 | Min.gap from Characters to pads | 6mil | 6mil | 5mil | |
| 68 | Colour | White, Black, Yellow | |||
| 69 | Notation / Characters (Inkjet) | Min.Width | 2mil | 2mil | 2mil |
| 70 | Min.Height | base copper ≦70um: 20mil | |||
| 71 | base copper >70um: 30mil | ||||
| 72 | base copper >140um: 40mil | ||||
| 73 | Colour | White | |||
| Serial NO. | Procedure | Item | Manufacturing capability | ||
| Large volume （S<100 m²） | Middle volume （S<10 m²） | Prototype（S<1m² | |||
| 74 | Carbon ink | Carbon ink covers conductor or pads | 14mil | 13mil | 12mil |
| 75 | Mid distance from carbon ink to pads | 12mil | 11mil | 10mil | |
| 76 | Peelable mask | Peelable mask covers conductor or pads | 8mil | 7mil | 6mli |
| 77 | Min.distance from peelable mask to pads | 14mil | 13mil | 12mil | |
| 78 | Max.via-plug of Silk-screen method | 2.0mm | 2.0mm | 2.0mm | |
| 79 | Max. via-plug of aluminum foil method | 4.5mm | 4.5mm | 4.5mm | |
| 80 | HASL | PCB thickness of HASL | 0.6-4.0mm (Hole less 0.5mm should be use via-plug or mask-tent ) | ||
| 81 | HASL PCB Size | 22" x 24.5" (558.8mm x 622.3mm) | |||
| 82 | Min.BGA size of HASL | 10mil | |||
| 83 | Min. spacing for HASL dense board without solder mask | 6mil | |||
| 84 | Thickness of Surface finish | ENIG | Nickle | 0.5~8um | |
| 85 | Gold | 0.025~0.127um | |||
| 86 | Edge connector / Gold finger | Nickle | 2.5~12.7um | ||
| 87 | Gold | 0.125~2.0um | |||
| 88 | HASL | 2.54-6.35um | |||
| 89 | OSP | 0.2-0.4um | |||
| 90 | Immersion tin (Horizontal) | 0.8-1.5um | |||
| 91 | Immersion silver (Horizontal) | 0.1-0.3um | |||
| 92 | ENEPIG | Nickle | 3~10um | ||
| 93 | Palladium | 0.05~0.4um | |||
| 94 | Gold | 0.025~0.127um | |||
| Serial NO. | Procedure | Item | Manufacturing capability | ||
| Large volume （S<100 m²） | Large volume （S<100 m²） | Prototype（S<1m²） | |||
| 95 | CNC Router Contour | Method of contour process | CNC milling, V-CUT, Break-out tap, break-out holes, Punching | ||
| 96 | Minimum router | 0.6mm | |||
| 97 | Accuracy of contour | ±0.15mm | ±0.13mm | ±0.1mm | |
| 98 | Min.distance of milling contour(no copper exposure) | 10mil | 10mil | 8mil | |
| 99 | V-CUT | Angle of V-CUT | 20°、30°、45°、60° ±5 ° | ||
| 100 | Minimum distance for V-CUT without exposing copper | 0.3mm (20° tool), 0.4mm (30° tool), 0.5mm (45° tool), 0.65mm (60°) | |||
| 101 | Small Board V-Cut Machine | Minimum board width: | 40mm | ||
| 102 | Maximum board width: | 470mm | |||
| 103 | Minimum board thickness: | 0.4mm | |||
| 104 | Maximum board thickness: | 2.0mm | |||
| 105 | Non-continuous V-CUT spacing: | ≥ 8 mm | |||
| 106 | Big Board V-Cut Machine | Minimum board thickness: | 0.4mm | ||
| 107 | Maximum board thickness: | 3.5mm | |||
| 108 | Non-continuous V-CUT spacing: | ≥ 15 mm | |||
| 109 | Minimum V-CUT residual thickness. | 0.2mm | |||
| 110 | V-CUT residual thickness tolerance | ±0.075 mm (only positive tolerance is allowed when residual thickness is 0.2) | |||
| 111 | Alignment tolerance for upper and lower V-CUT lines | ±0.075 mm | |||
| 112 | Min. distance from edge to V-Cut (no copper exposure) | 18mil (1.6mm Thick, 20 degree V-groove cutter) | 14mil(1.6mm Thick, 20 degree V-groove cutter) | 12mil (1.6mm Thick, 20 degree V-groove cutter) | |
| 113 | 20mil (1.6mm Thick, 30 degree V-groove cutter) | 18mil (1.6mm Thick, 30 degree V-groove cutter) | 16mil (1.6mm Thick, 30 degree V-groove cutter) | ||
| 114 | 16mil (1.6mm Thick, 30 degree V-groove cutter) | 22mil (1.6mm Thick, 45 degree V-groove cutter) | 20mil (1.6mm Thick, 45 degree V-groove cutter) | ||
| 115 | 30mil (1.6mm Thick, 60 degree V-groove cutter) | 28mil (1.6mm Thick, 60 degree V-groove cutter) | 26mil (1.6mm Thick, 60 degree V-groove cutter) | ||
| Serial NO. | Procedure | Item | Manufacturing capability | ||
| Large volume （S<100 m²） | Large volume （S<100 m²） | Prototype（S<1m²） | |||
| 116 | Flying Test | Board thickness of flying probe test | 0.05-10.0mm | ||
| 117 | Standard flying probe size | 22" x 26" (558.8mm x 660.4mm) (including four-wire low resistance) | |||
| 118 | Maximum test size | 30" x 47.2" (762mm x 1198.88mm) | |||
| 119 | Minimum distance from test points to board edge. | 0.5mm (Limited to one set of opposite edges.) | |||
| 120 | Minimum continuity resistance | 10 Ω | |||
| 121 | Maximum insulation resistance | 100 MΩ | |||
| 122 | |||||
| 123 | Maximum voltage | 500 V | |||
| 124 | Minimum pads | 3 mil | |||
| 125 | Minimum pad spacing | 3.9 mil | |||
| 126 | Special tolerance | Panel size of fixture test method | Size≤460X380mm, Small size can be compensated through manufacturing procedure | ||
| 127 | Board thickness of fixture test method | 0.4-6.0mm | |||
| 128 | Tolerance of press-fit hole | ±2mil | |||
| 129 | Tolerance of NPTH | ±2mil | |||
| 130 | Tolerance of PCB thickness | 1.0mm≥PCB thickness, Tolerance ±0.1mm；1.0mm≤PCB thickness, Tolerance ±10% | |||
| 131 | Tolerance of depth of countersunk hole | ±0.2mm | |||
| 132 | Depth tolerance of blind slot | ±0.2mm | |||
| 133 | Maximum shipment size | Size≤1200X600mm（Double side, no test required） | |||
| 134 | Size≤1000X600mm（ Multilayer, no test required） | ||||
| 135 | Minimum shipment size | 5mm x 5mm | |||
| 136 | PCB thickness | 0.13-10.0mm | |||
| 137 | Max. drill diameter | Size≤6.5mm (Counterbore or router will be used for holes more than 6.5mm, Min.tolerance ±0.1mm ） | |||
| 138 | Max. countersink diameter | Size≤6.5mm Countersink can be used counterbore drill or router） | |||
| 139 | Distance of Bevel | Size≥11mm | Size≥5mm | Size≥5mm | |
| 140 | Thickness of peelable mask | 0.3-1.5mm ±0.15mm | |||