High-Performance RO3003 HDI PCB 4-Layer 1.6mm Thick Circuit Boards for Advanced Applications

(Custom PCBs are tailored products; the images and specifications provided are for reference only.)

Introduction to RO3003

Rogers RO3003 high-frequency laminates are ceramic-filled PTFE composites designed for commercial microwave and RF applications. These laminates provide excellent stability of dielectric constant (Dk) across various temperatures and frequencies, eliminating the typical step change in Dk seen with PTFE glass materials. This makes RO3003 ideal for automotive radar (77 GHz), advanced driver assistance systems (ADAS), and 5G wireless infrastructure (mmWave).

Features

Rogers RO3003 ceramic-filled PTFE composites
Dielectric constant of 3 ± 0.04 at 10 GHz/23°C
Dissipation factor of 0.001 at 10 GHz/23°C
Thermal degradation temperature > 500°C
Thermal conductivity of 0.5 W/mK
Moisture absorption of 0.04%
Coefficient of thermal expansion: X axis 17 ppm/°C, Y axis 16 ppm/°C, Z axis 25 ppm/°C

PCB Construction Details

Specification	Details
Base Material	RO3003C
Layer Count	4 layers
Board Dimensions	110.9mm x 110.9mm (1 PCS)
Minimum Trace/Space	4/5 mils
Minimum Hole Size	0.25mm
Blind and Buried Vias	L1-L2, L2-L3
Finished Board Thickness	1.64mm
Finished Copper Weight	1 oz (1.4 mils) outer layers
Via Plating Thickness	20 µm
Surface Finish	Immersion Gold
Top Silkscreen	None
Bottom Silkscreen	None
Top Solder Mask	None
Bottom Solder Mask	None
Electrical Testing	100% electrical test prior to shipment

PCB Stack-Up

Specification	Details
Copper Layer 1	35 µm
Rogers RO3003 Substrate	5 mil (0.127mm)
Copper Layer 2	35 µm
Prepreg	4 mil (0.102mm)
Copper Layer 3	35 µm
Rogers RO3003 Substrate	50 mil (1.27mm)
Copper Layer 4	35 µm

PCB Statistics

Components: 37
Total Pads: 193
Through Hole Pads: 135
Top SMT Pads: 58
Bottom SMT Pads: 0
Vias: 79
Nets: 2

Artwork and Standards Information

Type of Artwork Supplied: Gerber RS-274-X
Accepted Standard: IPC-Class-2
Availability: Worldwide

Benefits

Low dielectric loss suitable for applications up to 77 GHz
Excellent mechanical properties across temperature ranges
Reliable stripline and multi-layer board constructions
Uniform mechanical properties for various dielectric constants
Stable dielectric constant across temperature and frequency
Low in-plane expansion coefficient for reliable surface mount assemblies
Cost-effective laminate pricing for volume manufacturing

Typical Applications

Automotive radar systems
Global positioning satellite antennas
Cellular telecommunications systems, including power amplifiers and antennas
Wireless communication patch antennas
Direct broadcast satellites
Datalink systems for cable networks
Remote meter reading systems
Power backplanes