2 Layer F4BTME320 PCB 1.524mm Thick with Immersion Tin Finish for Aerospace and RF Applications
1. F4BTME Series Introduction
The F4BTME series represents an advanced PTFE-ceramic-glass composite manufactured through a proprietary process featuring:
Scientific formulation of glass fiber, nano-ceramics and PTFE resin
F4BM dielectric base with enhanced thermal/electrical properties
Reverse-treated RTF copper foil for optimal PIM performance
Excellent dimensional stability and thermal conductivity
Specifically engineered for high-frequency, high-reliability applications
2. F4BTME320 Key Features
Dielectric Constant (Dk): 3.2±0.06 @10GHz
Dissipation Factor: 0.002 @10GHz, 0.0026 @20GHz
CTE: X-13/Y-15/Z-58 ppm/°C (-55°C to 288°C)
Thermal Coefficient of Dk: -75 ppm/°C
PIM Performance: <-160 dBc
Moisture Absorption: 0.05%
3.Benefits
Enhanced dielectric stability
Superior heat resistance，bRand
Reduced conductor loss
Excellent PIM characteristicsb
Military/aerospace grade reliability
4.PCB Construction Details
| Specification | Details |
|---|---|
| Base Material | F4BTME320 |
| Layer Count | 2 Layers |
| Dimensions | 136mm × 98mm (±0.15mm) |
| Trace/Space | 5/5 mils |
| Min Hole Size | 0.4mm |
| Board Thickness | 1.6mm |
| Copper Weight | 1oz outer layers |
| Via Plating | 20μm |
| Surface Finish | Immersion Tin |
| Solder Mask | Black (Top), None (Bottom) |
| Electrical Test | 100% tested |
5.PCB Stackup (2-Layer Rigid Structure)
Copper Layer 1: 35μm
F4BTME320 Core: 1.524mm (60mil)
Copper Layer 2: 35μm
6.PCB Statistics:
Components: 31
Total Pads: 105
Thru Hole Pads: 71
Top SMT Pads: 34
Bottom SMT Pads: 0
Vias: 28
Nets: 2
7.Typical Applications
Aerospace/avionics systems
Military radar equipment
Phased array antennas
Satellite communication systems
RF feed networks
8.Quality Assurance
IPC-Class 2 compliant
100% electrical tested
Global availability
Gerber RS-274X support