4-Layer Hybrid PCB with RO4350B and High Tg FR-4 for RF Applications
1.Product Overview
This hybrid 4-layer PCB combines Rogers RO4350B high-frequency material with S1000-2M High Tg FR-4 substrate, delivering optimal RF performance and mechanical stability. The stackup features a 10mil RO4350B core for critical signal layers and 31.5mil FR-4 base, providing excellent dielectric constant control (3.48±0.05) while maintaining cost-effectiveness for commercial aerospace and millimeter-wave applications.
2.Key Material Properties
RO4350B Characteristics
Dielectric Constant: 3.48±0.05 @10GHz
Low Loss Tangent: 0.0037 @10GHz
Thermal Conductivity: 0.69 W/mK
CTE Matched to Copper: 10/12/32 ppm/°C
High Tg: >280°C
Moisture Resistance: 0.06% absorption
S1000-2M FR-4 Features
Tg 180°C (DSC method)
UV Blocking/AOI Compatible
Excellent Anti-CAF Performance
Lead-Free Process Compatible
3.PCB Construction Details
| Parameter | Specification |
|---|---|
| Base Material | RO4350B + High Tg FR-4 (S1000-2M) |
| Layer Count | 4-Layer |
| Board Dimensions | 173mm × 85.3mm (±0.15mm) |
| Minimum Trace/Space | 4/6 mils |
| Minimum Hole Size | 0.20mm |
| Via Type | Through-Hole Only |
| Finished Thickness | 1.5mm |
| Copper Weight | 1oz (35μm) all layers |
| Via Plating Thickness | 20μm |
| Surface Finish | ENIG |
| Top Silkscreen | White |
| Bottom Silkscreen | Green |
| Top Solder Mask | Green |
| Bottom Solder Mask | Green |
| Electrical Testing | 100% tested prior to shipment |
4.PCB Stackup:
Copper_layer_1 - 35 μm
RO4350B - 0.254 mm (10mil)
Copper_layer_2 - 35 μm
Prepreg - 1080 RC63% +7628 (43%) -0.254mm (10mil)
Copper_layer_3 - 35 μm
S1000-2M - 0.8 mm (31.5mil)
Copper_layer_4 - 35 μm
5.Board Statistics
Components: 52
Total Pads: 247
Thru Hole Pads: 117
Top SMT Pads: 98
Bottom SMT Pads: 32
Vias: 78
Nets: 12
6.Manufacturing & Quality Standards
Artwork Format: Gerber RS-274-X
Quality Standard: IPC-Class 2
Availability: Worldwide shipping
7.Technical Advantages
Hybrid Design: Combines RF performance with structural rigidity
Thermal Stability: Withstands lead-free reflow processes
Manufacturing Efficiency: Standard FR-4 processing compatible
Signal Integrity: Tight impedance control (±0.05 Dk)
8.Target Applications
Commercial Airline Broadband Antennas
Microstrip and Stripline Circuits
Millimeter Wave Applications
Radar Systems
Guidance Systems
Point to Point Digital Radio Antennas