F4BTMS220 2-Layer 5mil PCB – Ultra-Thin High-Frequency Board with Immersion Gold for Aerospace and RF Applications
1.F4BTMS Introduction
The F4BTMS series is an upgraded version of the F4BTM series, achieving a technological breakthrough in material formulation and manufacturing processes. By incorporating a significant amount of ceramics and reinforced ultra-thin, ultra-fine glass fiber cloth, the material demonstrates substantial improvements in performance and a broader range of dielectric constants. It is a high-reliability material suitable for aerospace applications and serves as a domestic replacement for similar foreign products.
The material minimizes the negative effects of glass fiber on electromagnetic wave propagation by using a small amount of ultra-thin glass fiber cloth and a large quantity of uniformly distributed special nano-ceramics mixed with PTFE resin. This results in reduced dielectric loss, enhanced dimensional stability, decreased X/Y/Z anisotropy, extended usable frequency range, improved electrical strength, and better thermal conductivity. Additionally, the material exhibits excellent low thermal expansion coefficient and stable dielectric temperature characteristics. The series comes standard with RTF low-roughness copper foil, reducing conductor loss and ensuring excellent peel strength, and is compatible with both copper and aluminum bases.
2.Key Features (F4BTMS220)
Dielectric Constant (Dk): 2.2 ±0.02 @ 10GHz
Dissipation Factor: 0.0009 @ 10GHz, 0.001 @ 20GHz
CTE: X-axis: 40 ppm/°C, Y-axis: 50 ppm/°C, Z-axis: 290 ppm/°C (-55°C to 288°C)
Thermal Coefficient of Dk: -130 ppm/°C (-55°C to 150°C)
Flammability Rating: UL 94-V0
Moisture Absorption: 0.02%
3.Benefits
Minimized dielectric loss and enhanced dimensional stability
Reduced X/Y/Z anisotropy and broader frequency range
Improved electrical strength and thermal conductivity
Excellent low thermal expansion and stable dielectric temperature characteristics
Low conductor loss and high peel strength with RTF copper foil
4.PCB Construction Details
| Parameter | Specification |
|---|---|
| Base Material | F4BTMS220 |
| Layer Count | Double Sided (2-Layer) |
| Board Dimensions | 114mm × 20mm (±0.15mm) |
| Minimum Trace/Space | 5/5 mils |
| Minimum Hole Size | 0.2mm |
| Blind Vias | No |
| Finished Board Thickness | 0.2mm |
| Finished Cu Weight | 1oz (1.4 mils) |
| Via Plating Thickness | 20 μm |
| Surface Finish | Immersion Gold |
| Top Silkscreen | White |
| Bottom Silkscreen | No |
| Top Solder Mask | Black |
| Bottom Solder Mask | No |
| Electrical Test | 100% tested prior to shipment |
5.PCB Stackup (2-Layer Rigid Structure)
Copper_layer_1 - 35 μm
F4BTMS220 Core - 0.127 mm (5mil)
Copper_layer_2 - 35 μm
6.PCB Statistics:
Components: 34
Total Pads: 65
Thru Hole Pads: 47
Top SMT Pads: 18
Bottom SMT Pads: 0
Vias: 35
Nets: 2
7.Typical Applications
Aerospace equipment, space and cabin systems
Microwave and RF circuits
Radar and military radar systems
Feed networks
Phase-sensitive antennas, phased array antennas
Satellite communications
8.Quality Assurance
IPC-Class 2 compliant
100% electrical tested
Global availability
Gerber RS-274X support