High-Performance RO4533 2-Layer PCB with 0.6mm Thickness for Antenna Applications
1.Introduction
Rogers RO4533 laminates are ceramic-filled, glass-reinforced hydrocarbon-based materials designed for superior RF performance in microstrip antenna applications. These laminates offer controlled dielectric constant, low loss, and excellent passive intermodulation (PIM) response, making them ideal for mobile infrastructure and WiMAX antenna networks.
Fully compatible with conventional FR-4 and lead-free soldering processes, RO4533 eliminates the need for special treatments required by traditional PTFE-based laminates. Its cost-effective design balances performance and affordability while meeting stringent environmental standards with halogen-free options.
The material’s excellent thermal properties—including a CTE closely matched to copper and a high glass transition temperature (Tg >280°C)—ensure reliability in demanding environments. With low moisture absorption (0.02%) and high thermal conductivity (0.6 W/mK), RO4533 PCBs deliver stable performance in high-power applications.
2.Features
Dielectric Constant (Dk): 3.3 at 10GHz
Dissipation Factor (Df): 0.0025 at 10GHz
CTE: X-axis 13ppm/°C, Y-axis 11ppm/°C, Z-axis 37ppm/°C
Tg: >280°C
Moisture Absorption: 0.02%
Thermal Conductivity: 0.6 W/mK
Benefits
Low loss, stable Dk, and low PIM for RF applications.
Compatible with standard PCB fabrication processes.
Excellent dimensional stability for high yield.
High thermal conductivity for improved power handling.
3.PCB Specifications at a Glance
| Specification | Value |
|---|---|
| Base Material | RO4533 |
| Layer Count | 2 layers |
| Board Dimensions | 52mm x 35mm (±0.15mm) |
| Minimum Trace/Space | 4/7 mils |
| Minimum Hole Size | 0.3mm |
| Blind Vias | No |
| Finished Thickness | 0.6mm |
| Copper Weight (Outer) | 1oz (35µm) |
| Via Plating Thickness | 20µm |
| Surface Finish | Immersion Gold |
| Top Silkscreen | White |
| Bottom Silkscreen | No |
| Top Solder Mask | Green |
| Bottom Solder Mask | No |
| Electrical Test | 100% tested prior to shipment |
4.PCB Stackup: 2-layer rigid PCB
Copper_layer_1 - 35 μmRogers 4533 Core - 0.508 mm (20mil)
Copper_layer_2 - 35 μm
5.PCB Statistics:
Components: 25
Total Pads: 31
Thru Hole Pads: 21
Top SMT Pads: 10
Bottom SMT Pads: 0
Vias: 32
Nets: 2
6.Typical Applications
Cellular base station antennas
WiMAX antenna networks
7.Quality Assurance
IPC-Class 2 compliant
100% electrical tested
Global availability
Gerber RS-274X support
This RO4533 PCB combines high-frequency performance with manufacturing efficiency, making it a top choice for advanced antenna designs.