Isola 370HR 12-Layer High-Performance PCB for Demanding Applications
1.Introduction
Isola's 370HR is an advanced FR-4 material system with a 180°C glass transition temperature (Tg), designed for multilayer PCBs requiring exceptional thermal performance and reliability. Combining a high-performance multifunctional epoxy resin with E-glass reinforcement, 370HR delivers:
Enhanced Thermal Stability: Td 340°C, T288 30 minutes
Low CTE: 13/14 ppm/°C (X/Y-axis) for reduced warpage
UV Blocking & AOI Fluorescence: Optimized for automated inspection
FR-4 Process Compatibility: Easy integration into existing workflows
Ideal for computing, automotive, and aerospace applications where sequential lamination and impedance control are critical.
2.Key Performance Features
Thermal Performance: Tg 180°C (DSC), T260 60 minutes
CAF Resistance: Enhanced reliability for high-density designs
RoHS Compliance: Environmentally friendly
Impedance Control: ±10% tolerance (7–10mil traces, 100Ω)
Surface Finish: ENIG (0.1μm gold) for -40°C to +85°C operation
3.1PCB Specifications at a Glance
Parameter |
Specification |
Base Material |
370HR High-Tg FR-4 |
Layer Count |
12-layer |
Board Dimensions |
120mm × 88mm (±0.15mm) |
Trace/Space |
4/6 mils |
Hole Size |
8 mils (0.2mm) |
Via Technology |
Blind vias (L1-L4, L1-L10) |
Copper Weight |
1oz (signal/planes) |
Silkscreen |
White (Top/Bottom) |
Solder Mask |
Green (Top/Bottom) |
Board Thickness |
1.58mm (±10%) |
Surface Finish |
ENIG (0.1μm gold) |
Operating Temp Range |
-40°C to +85°C |
Certifications |
UL Marked, 100% Electrical Test |

3.2Impedance Control
Layer |
Trace Width |
Impedance |
Reference Layer |
1 |
7mil |
100Ω |
Layer 2 |
3 |
9mil |
100Ω |
Layer 2 |
4 |
10mil |
100Ω |
Layer 5 |
6 |
7mil |
100Ω |
Layer 5 |
4.PCB Stackup: 12-layer rigid PCB
Layer |
Type |
Thickness |
Material |
Copper Weight |
1 |
Top Layer |
0.0727mm |
IS370HR Prepreg (1080 x1) |
1oz (1.4mil) |
2 |
Ground Plane |
0.0727mm |
IS370HR Prepreg (1080 x1) |
0.5oz (0.7mil) |
3 |
Mid Layer 1 |
0.0727mm |
IS370HR Prepreg (1080 x1) |
0.5oz (0.7mil) |
4 |
Mid Layer 2 |
0.1479mm |
IS370HR Prepreg (1080 x2) |
0.5oz (0.7mil) |
5 |
Power Plane |
0.2mm |
IS370HR Core |
0.5oz (0.7mil) |
6 |
Copper Layer |
0.1479mm |
IS370HR Prepreg (1080 x2) |
0.5oz (0.7mil) |
7 |
Power Plane |
0.2mm |
IS370HR Core |
0.5oz (0.7mil) |
8 |
Copper Layer |
0.1479mm |
IS370HR Prepreg (1080 x2) |
0.5oz (0.7mil) |
9 |
Copper Layer |
0.0727mm |
IS370HR Prepreg (1080 x1) |
1oz (1.4mil) |
10 |
Ground Plane |
0.0727mm |
IS370HR Prepreg (1080 x1) |
0.5oz (0.7mil) |
11 |
Copper Layer |
0.0727mm |
IS370HR Prepreg (1080 x1) |
0.5oz (0.7mil) |
12 |
Bottom Layer |
- |
- |
1oz (1.4mil) |
5.PCB Statistics:
Components: 59
Total Pads: 355
Thru Hole Pads: 129
Top SMT Pads: 178
Bottom SMT Pads: 48
Vias: 211
Nets: 61
6.Typical Applications
High-speed computing & data storage
Automotive ECUs & ADAS
Aerospace avionics
Medical imaging systems
Industrial control PCBs
7.Quality Assurance
Commercial airline broadband antennas
Microstrip/stripline circuits
Millimeter-wave systems
Radar and guidance systems
Point-to-point digital radio antennas
370HR combines FR-4 processability with high-reliability performance for complex multilayer designs.
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