Kappa 438 2-Layer 60mil PCB – ENIG Finish, FR-4 Compatible High-Frequency Material for 5G & IoT Applications
1.Kappa 438 Introduction
Rogers Kappa 438 laminates are designed using a glass-reinforced hydrocarbon ceramic system that offers superior high-frequency performance and low-cost circuit fabrication. This results in a low-loss material that can be fabricated using standard epoxy/glass (FR-4) processes. Kappa 438 laminates also have the UL 94 V-0 flame retardant rating and are compatible with lead-free solder processes. Standard thicknesses include 10, 20, 30, 40, and 60 mil.
Kappa 438 laminates offer dielectric constants (Dk) tailored to FR-4 industry standard norms, facilitating ease of converting existing FR-4 designs where better electrical performance is needed.
2.Key Features
Glass-reinforced hydrocarbon thermoset platform
Dk of 4.38 tailored to FR-4 industry standard norms
Tighter Dk and thickness tolerance than FR-4
Low Z-axis CTE of 42 ppm/°C
High Tg of >280°C (TMA)
Thermal coefficient of Dk: -21 ppm/°C (-50°C to 150°C)
Meets UL 94-V0 requirements
3.Benefits
Ease of PCB manufacturing and assembly in line with FR-4 processes
Design Dk enables easy conversion of existing FR-4 designs needing better electrical performance
Consistent circuit performance
Improved design flexibility and plated through-hole reliability
Automated assembly compatible

4.PCB Construction Details
| Parameter |
Specification |
| Base Material |
Kappa 438 |
| Layer Count |
2 layers |
| Board Dimensions |
53mm × 36mm (±0.15mm) |
| Minimum Trace/Space |
4/4 mils |
| Minimum Hole Size |
0.3mm |
| Blind Vias |
No |
| Finished Board Thickness |
1.6mm |
| Finished Cu Weight |
1 oz (1.4 mils) outer layers |
| Via Plating Thickness |
20 μm |
| Surface Finish |
Electroless Nickel Immersion Gold (ENIG) |
| Top Silkscreen |
Black |
| Bottom Silkscreen |
No |
| Top Solder Mask |
No |
| Bottom Solder Mask |
No |
| Electrical Test |
100% tested prior to shipment |
5.PCB Stackup (2-Layer Rigid Structure)
Copper_layer_1 - 35 μm
Rogers Kappa 438- 1.524 mm (60mil)
Copper_layer_2 - 35 μm
6.PCB Statistics:
Components: 10
Total Pads: 34
Thru Hole Pads: 22
Top SMT Pads: 12
Bottom SMT Pads: 0
Vias: 27
Nets: 2
7.Typical Applications
Carrier Grade WiFi/Licensed Assisted Access (LAA
Small Cell and Distributed Antenna Systems (DAS)
Vehicle to Vehicle/Vehicle to Infrastructure Communications (V2X)
Internet of Things (IoT) Segments: Smart Home and Wireless Meters
8.Quality Assurance
IPC-Class 2 compliant
100% electrical tested
Global availability
Gerber RS-274X support
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