RO3206 2-Layer 25mil PCB – Ceramic-Filled Woven Glass RF Substrate with Immersion Gold for Automotive & Wireless Systems
1.Introduction of RO3206
Rogers' RO3206 high frequency circuit materials are ceramic-filled laminates reinforced with woven fiberglass. These materials are engineered to offer exceptional electrical performance and mechanical stability at competitive prices. The RO3206 high frequency materials were designed as an extension of the RO3000 series high frequency circuit materials with one distinguishing characteristic - improved mechanical stability.
2.Key Features
Dielectric constant of 6.15 ±0.15 at 10 GHz/23°C
Dissipation factor of 0.0027 at 10GHz
High Thermal conductivity of 0.67 W/mK
Low Moisture Absorption < 0.1%
CTE matched to copper: X-axis 13 ppm/°C, Y-axis 13 ppm/°C, Z-axis 34 ppm/°C
Strong copper peel strength of 10.7 lbs/in
3.Benefits
Woven glass reinforcement improves rigidity for easier handling
Uniform electrical and mechanical performance ideal for complex multi-layer high frequency structures
Low dielectric loss ensures high frequency performance
Low in-plane expansion coefficient matched to copper
Suitable for use with epoxy multilayer board hybrid designs
Reliable surface mounted assemblies
Excellent dimensional stability ensures high production yields
Economically priced for cost-effective volume manufacturing
Surface smoothness allows for finer line etching tolerances
4.PCB Construction Details
| Parameter | Specification |
|---|---|
| Base Material | RO3206 |
| Layer Count | 2-layer |
| Board Dimensions | 63mm × 45mm (±0.15mm) |
| Minimum Trace/Space | 4/4 mils |
| Minimum Hole Size | 0.3mm |
| Blind Vias | No |
| Finished Board Thickness | 0.75mm |
| Finished Cu Weight | 1oz (1.4 mils) outer layers |
| Via Plating Thickness | 20 μm |
| Surface Finish | Immersion Gold |
| Top Silkscreen | White |
| Bottom Silkscreen | No |
| Top Solder Mask | Blue |
| Bottom Solder Mask | No |
| Electrical Test | 100% tested prior to shipment |
5.PCB Stackup (2-Layer Rigid Structure)
Copper_layer_1 - 35 μm
RO3206 - 0.635 mm (25mil)
Copper_layer_2 - 35 μm
6.PCB Statistics:
Components: 21
Total Pads: 43
Thru Hole Pads: 25
Top SMT Pads: 18
Bottom SMT Pads: 0
Vias: 22
Nets: 2
7.Typical Applications
Automotive collision avoidance systems
Automotive global positioning satellite antennas
Wireless telecommunications systems
Microstrip patch antennas for wireless communications
Direct broadcast satellites
Datalink on cable systems
Remote meter readers
Power backplanes
LMDS and wireless broadband
Base station infrastructure
8.Quality Assurance
Artwork Format: Gerber RS-274-X
Accepted Standard: IPC-Class-2
Availability: Worldwide
