RO4003C Multilayer PCB 4-Layer 4.8mm Thick Low Loss Material for Microstrip and Stripline Circuits

1.Introduction to RO4003C

Rogers RO4003C materials are advanced woven glass reinforced hydrocarbon/ceramic composites that combine the electrical performance characteristics of PTFE/woven glass with the manufacturability of epoxy/glass. This innovative design provides superior high-frequency performance and facilitates low-cost circuit fabrication. The result is a low-loss material that can be produced using standard epoxy/glass (FR-4) processes, all at competitive prices.

RO4003C materials are ideal for RF microwave circuit designers and are particularly suited for matching networks and controlled impedance transmission lines. The low dielectric loss of RO4003C allows it to be utilized in many applications where conventional circuit board laminates are limited by higher operating frequencies.

Available in various configurations, RO4003C laminates are manufactured using both 1080 and 1674 glass fabric styles, ensuring that all configurations meet the same electrical performance specifications. Importantly, RO4003C materials are non-brominated and do not carry a UL 94 V-0 rating.

2.Features of RO4003C

Dielectric Constant: DK 3.38 ± 0.05 at 10 GHz
Dissipation Factor: 0.0027 at 10 GHz
Thermal Conductivity: 0.71 W/m·K
Thermal Coefficient of Dielectric Constant: +40 ppm/°C, ranging from -50°C to 150°C
CTE Matched to Copper:
X-axis: 11 ppm/°C
Y-axis: 14 ppm/°C
Z-axis Coefficient of Thermal Expansion: 46 ppm/°C
Glass Transition Temperature (Tg): > 280°C
Low Moisture Absorption: 0.06%

3.PCB Stackup: 4-Layer Rigid PCB

Copper Layer 1: 35 µm
RO4003C: 0.508 mm (20 mil)
Prepreg: RO4450F 0.203 mm (8 mil)
RO4003C: 1.524 mm (60 mil)
Copper Layer 2: 35 µm
Prepreg: RO4450F 0.203 mm (8 mil)
RO4003C: 1.524 mm (60 mil)
Copper Layer 3: 35 µm
Prepreg: RO4450F 0.203 mm (8 mil)
RO4003C: 0.508 mm (20 mil)
Copper Layer 4: 35 µm

4.PCB Construction Details

Board Dimensions: 65 mm x 65 mm (1 piece), ± 0.15 mm
Minimum Trace/Space: 7/8 mils
Minimum Hole Size: 0.5 mm
Blind Vias: None
Finished Board Thickness: 4.8 mm
Finished Copper Weight: 1 oz (1.4 mils) for inner/outer layers
Via Plating Thickness: 20 µm
Surface Finish: ENEPIG
Top Silkscreen: None
Bottom Silkscreen: None
Top Solder Mask: None
Bottom Solder Mask: None
Countersunk Holes: Yes
Electrical Testing: 100% electrical test performed prior to shipment

5.PCB Statistics

Components: 6
Total Pads: 11
Through Hole Pads: 5
Top SMT Pads: 6
Bottom SMT Pads: 0
Vias: 5
Nets: 4

6.Artwork and Standards

Type of Artwork Supplied: Gerber RS-274-X
Accepted Standard: IPC-Class-2
Availability: Worldwide

7.Typical Applications

Commercial airline broadband antennas
Microstrip and stripline circuits
Millimeter-wave applications
Radar systems
Guidance systems
Point-to-point digital radio antennas