RO4350B and S1000-2M High-Performance PCB Design – Ideal for RF, Radar, and Millimeter-Wave Applications
1. Introduction of RO4350B
Rogers RO4350B materials are proprietary woven glass-reinforced hydrocarbon/ceramics that offer electrical performance comparable to PTFE/woven glass while maintaining the manufacturability of epoxy/glass. RO4350B laminates provide precise control over dielectric constant (Dk) and low loss, utilizing standard epoxy/glass processing methods. They are cost-effective compared to conventional microwave laminates and do not require special handling procedures. These materials are UL 94 V-0 rated, suitable for high power RF designs.
The thermal coefficient of expansion (CTE) of RO4350B is similar to copper, ensuring excellent dimensional stability crucial for mixed dielectric multi-layer board constructions. The low Z-axis CTE guarantees reliable plated through-hole quality, even under severe thermal shock. The material has a Tg of >280°C (536°F), ensuring stable expansion characteristics throughout circuit processing temperatures.
2.Key Features:
(1).Features of RO4350B
Dielectric Constant of DK 3.48 ±0.05 at 10GHz/23°C
Dissipation Factor of 0.0037 at 10GHz/23°C
Thermal Conductivity: 0.69 W/m/°KB
X-axis CTE: 10 ppm/°C, Y-axis CTE: 12 ppm/°C, Z-axis CTE: 32 ppm/°C
High Tg value of >280°C
Low water absorption: 0.06%
(2).Features of S1000-2M
Lower Z-axis CTE for improved through-hole reliability
Excellent mechanical processability and thermal resistance
Lead-free compatible
Tg180°C (DSC), UV blocking/AOI compatible
High heat resistance
Excellent anti-CAF performance
Low water absorption
3.PCB Stackup: 4-layer rigid PCB
| Specification | Details |
|---|---|
| Copper Layer 1 | 35 µm |
| RO4350B | 0.254 mm (10 mil) |
| Copper Layer 2 | 35 µm |
| Prepreg | 1080 RC63% 0.0644 mm (2.5 mil) |
| Copper Layer 3 | 35 µm |
| S1000-2M | 1.1 mm (43 mil) |
| Copper Layer 4 | 35 µm |
4.PCB Construction Details
| Specification | Details |
|---|---|
| Board Dimensions | 90 mm x 95 mm, +/- 0.15 mm |
| Minimum Trace/Space | 5/4 mils |
| Minimum Hole Size | 0.35 mm |
| Blind Vias | None |
| Finished Board Thickness | 1.6 mm |
| Finished Cu Weight | 1 oz (1.4 mils) inner/outer layers |
| Via Plating Thickness | 20 µm |
| Surface Finish | Electroless Nickel Immersion Gold (ENIG) |
| Top Silkscreen | White |
| Bottom Silkscreen | No |
| Top Solder Mask | Green |
| Bottom Solder Mask | No |
| Impedance Control | 50 ohm on 5 mil / 9 mil traces/gaps (top layer) |
| Edge Plated | Yes, for designated area |
| Via Filling | 0.35 mm via filled and capped |
| Electrical Testing | 100% electrical test conducted prior to shipment |
5.PCB Statistics
Components: 33
Total Pads: 242
Thru Hole Pads: 125
Top SMT Pads: 117
Bottom SMT Pads: 0
Vias: 49
Nets: 3
6.Type of Artwork Supplied
Gerber RS-274-X
7.Accepted Standard
IPC-Class-2
8.Availability
Worldwide
9.Typical Applications
Commercial airline broadband antennas
Microstrip and stripline circuits
Millimeter wave applications
Radar systems
Guidance systems
Point-to-point digital radio antennas