RO4533 2-Layer 30mil RF Antenna PCB with ENEPIG Surface Finish
1.Introduction of RO3206
Rogers RO4533 laminates are ceramic-filled, glass-reinforced hydrocarbon based material set, providing the controlled dielectric constant, low loss performance and excellent passive intermodulation response required for mobile infrastructure microstrip antenna applications.
RO4533 laminates are fully compatible with conventional FR-4 and high temperature lead-free solder processing. These laminates do not require special treatment needed on traditional PTFE-based laminates for plated through-hole preparation. It is an affordable alternative to more conventional PTFE antenna technologies, thus allowing designers to optimize the price and performance of their antennas. Moreover, RO4533 laminates are available halogen-free to meet the most stringent “green” standards.
The resin systems of RO4533 dielectric materials are designed to provide the necessary properties for ideal antenna performance. The coefficients of thermal expansion (CTEs) in both the X and Y directions are similar to that of copper. The good CTE match reduces stresses in the printed circuit board antenna. The typical glass transition temperature of RO4533 materials exceeds 280°C (536°F), leading to a low z-axis CTE and excellent plated through-hole reliability.
2.Key Features
Dielectric Constant of DK 3.3 at 10GHz
Dissipation Factor of 0.0025 at 10GHz
X axis CTE of 13ppm/°C, Y CTE of 11ppm/°C, Z CTE of 37ppm/°C
Tg >280 °C
Low moisture absorption of 0.02%
Thermal conductivity of 0.6 W/mk
3.Benefits
Low Loss, Low Dk and low PIM response for wide range of application use
Thermoset resin system compatible with standard PCB fabrication
Excellent dimensional stability for greater yield on larger panels sizes
Uniform mechanical properties for maintaining mechanical form during handling
High thermal conductivity for improved power handling
4.PCB Construction Details
| Specification | Value |
|---|---|
| Base Material | RO4533 |
| Layer Count | 2 layers |
| Board Dimensions | 46.95mm × 53.13mm (±0.15mm) |
| Minimum Trace/Space | 4/5 mils |
| Minimum Hole Size | 0.4mm |
| Blind Vias | No |
| Finished Board Thickness | 0.8mm |
| Finished Cu Weight (Outer Layers) | 1oz (1.4 mils) |
| Via Plating Thickness | 20 µm |
| Surface Finish | ENEPIG (Electroless Nickel Electroless Palladium and Immersion Gold) |
| Top Silkscreen | White |
| Bottom Silkscreen | No |
| Top Solder Mask | Green |
| Bottom Solder Mask | No |
| Electrical Test | 100% prior to shipment |
5.PCB Stackup (2-Layer Rigid Structure)
Copper layer 1 – 35 µm
Rogers 4533 Core – 0.762 mm (30mil)
Copper layer 2 – 35 µm
6.PCB Statistics:
Components: 20
Total Pads: 46
Thru Hole Pads: 22
Top SMT Pads: 24
Bottom SMT Pads: 0
Vias: 19
Nets: 3
7.Typical Applications
Cellular infrastructure base station antennas
WiMAX antenna networks
8.Quality Assurance
Artwork Format: Gerber RS-274-X
Quality Standard: IPC-Class-2
Availability: Worldwide
