Rigid Polyimide 4-Layer PCB 1.8mm Thick with HASL Lead-Free Finish for High-Temperature Applications
1.Introduction to Rigid Polyimide Material
Polyimide is a high-performance polymer known for its outstanding thermal stability, mechanical strength, and electrical insulation. It maintains exceptional peel strength (1.42 N/mm after thermal stress, 1.13 N/mm after process exposure) and superior electrical properties (volume resistivity: 6.6×10? MΩ·cm under C-96/35/90 conditions). With a dielectric constant of 4.12 and dissipation factor of 0.0072 at 1MHz, polyimide excels in high-frequency applications. Its moisture resistance (0.11% absorption), high dielectric strength (44.3 kV), and thermal resilience (no delamination at 288°C, Tg 257°C) make it indispensable for aerospace, military, and high-temperature environments.
2.Features
Thermal Stability: Tg of 257°C, withstands 288°C thermal stress.
Mechanical Strength: Bending strength of 410.2 N/mm² (machine direction).
Electrical Performance: Volume resistivity of 6.6×10? MΩ·cm, dielectric constant of 4.12.
Moisture Resistance: 0.11% absorption rate.
High-Frequency Suitability: Low dissipation factor (0.0072 at 1MHz).
3.Benefits
Reliability: Maintains performance in extreme temperatures and harsh conditions
Durability: Excellent peel strength and mechanical robustness.
Electrical Integrity: Stable dielectric properties for high-frequency applications.
Versatility: Suitable for aerospace, military, and industrial uses.
4.PCB Construction Details
| Specification | Technical Details |
|---|---|
| Base Material | Rigid Polyimide |
| Layers | 4 |
| Board Dimensions | 325×83mm (±0.15mm) |
| Trace/Space | 5/5 mils |
| Min. Hole Size | 0.3mm |
| Board Thickness | 1.8mm |
| Copper Weight | 1oz outer layers (35μm) |
| Via Plating | 20μm |
| Surface Finish | Lead-free HASL |
| Silkscreen | White (both sides) |
| Solder Mask | Black (both sides) |
| Via Treatment | 0.3mm resin-filled & capped |
| Countersink Holes | Top side |
| Electrical Test | 100% tested |
5.PCB Stackup (4-Layer Rigid Structure)
Copper layer 1 - 35 μm
Polyimide Core - 0.32 mm
Copper layer 2 - 35 μm
Polyimide Prepreg - 0.1mm
Polyimide Core - 0.8mm
Polyimide Prepreg - 0.1mm
Copper layer 3 - 35 μm
Polyimide Core - 0.32 mm
Copper layer 4 - 35 μm
6.PCB Statistics:
Components: 68
Total Pads: 102
Thru Hole Pads: 47
Top SMT Pads: 39
Bottom SMT Pads: 16
Vias: 121
Nets: 12
7.Typical Applications
Aerospace and aviation electronics
Military equipment
Downhole oil extraction systems
High-temperature industrial applications
8.Quality Assurance
IPC-Class 2 compliant
100% electrical tested
Global availability
Gerber RS-274X support