Home > Newly Shipped PCB > Rogers CLTE-MW 2-Layer 0.15mm Immersion Gold PCB – Microwave & Satellite Communication

Rogers CLTE-MW 2-Layer Immersion Gold PCB
PCB Material:Rogers CLTE-MW (Ceramic-filled PTFE) / 0.15mm
MOQ:1PCS
Packaging:Vacuum / Anti-static Packaging
Delivery Period:7-10 working days
Payment Method:T/T, Paypal
 

Rogers CLTE-MW 2-Layer 0.15mm Immersion Gold PCB – Microwave & Satellite Communication


1. Introduction to Rogers CLTE-MW PCB

CLTE-MW laminates provide PCB designers a high performance, cost-effective material, well suited for applications with thickness limitations due to physical or electrical constraints. This unique laminate system is available in seven thickness options, from 3 to 10 mils, ensuring that ideal signal to ground spacing exists for 5G and other millimeter wave applications. The CLTE-MW laminates are reinforced with spread glass which, along with a high filler loading, helps minimize the high frequency glass weave effects on electromagnetic wave propagation.


CLTE-MW laminates are ceramic filled, woven glass reinforced PTFE composites. The woven glass reinforcement provides excellent dimensional stability. Other key features include low z-axis CTE for excellent plated through hole reliability, a low loss tangent to enable low loss designs, and low moisture absorption to ensure stable performance in a range of operating environments.


This 2-layer rigid PCB is constructed entirely with Rogers CLTE-MW as the core material, making it ideal for demanding microwave, aerospace, and satellite communication applications.


CLTE-MW PCB 2.9mil 2-layer Immerion Gold


2. Key Features of Rogers CLTE-MW PCB

Low loss tangent of 0.0015 at 10 GHz

Low Z-axis CTE of 30 ppm/°C

Thermal conductivity of 0.42 W/(m·K)

UL 94 V-0 flammability rating

Low moisture absorption of 0.03%

High dielectric strength of 630 V/mil

Available in seven thickness options from 3 to 10 mils

Spread glass reinforcement minimizes glass weave effects


3. Benefits of Rogers CLTE-MW PCB

Enables low loss designs

Excellent plated through hole (PTH) reliability

Good heat dissipation in aggressive designs

Compatible with commercial applications

Reliable mechanical performance under thermally challenging environments

Excellent dimensional stability

Stable performance in a range of operating environments


4. Rogers CLTE-MW PCB Construction Details

ItemSpecification
Base materialRogers CLTE-MW
Layer countDouble sided
Board dimensions76.4mm x 95mm = 1 PCS, +/- 0.15mm
Minimum Trace/Space6/7 mils
Minimum Hole Size0.25mm
Blind viasNo
Finished board thickness0.15mm
Finished Cu weight1 oz (1.4 mils) outer layers
Via plating thickness20 μm
Surface finishImmersion Gold
Top SilkscreenBlack
Bottom SilkscreenNo
Top Solder MaskNo
Bottom Solder MaskNo
100% Electrical testUsed prior to shipment

5. PCB Stackup (2-Layer Rigid Structure)

Copper_layer_1 - 35 μm

CLTE-MW Core - 0.076 mm (2.99 mil)

Copper_layer_2 - 35 μm


6. PCB Statistics

Components: 19

Total Pads: 36

Thru Hole Pads: 21

Top SMT Pads: 15

Bottom SMT Pads: 0

Vias: 12

Nets: 4


7. Primary Application Areas

Commercial communications and avionics

Military / aerospace applications

Microwave feed networks

Phase sensitive electronic structures

Satellite communication systems

Passive components (couplers, filters & baluns)

Amplifiers and antennas


8.Quality Assurance

Type of artwork supplied: Gerber RS-274-X
Accepted standard: IPC-Class-3
Availability: Worldwide


9. Rogers CLTE-MW Low-Loss Ceramic-Filled PTFE – Product Introduction

CLTE-MW laminates are ceramic filled, woven glass reinforced PTFE composites. CLTE-MW laminates were developed to provide a cost effective, high performance material for the circuit designer. This unique laminate system is well suited for applications that have limitations in thickness due to either physical or electrical constraints. The seven available thickness options from 3 mils to 10 mils ensure that ideal signal to ground spacing exists for today's 5G and other millimeter wave designs. In addition, a variety of copper foil options are available including rolled, reverse treated ED, and standard ED. Resistive foil and metal plate options are also available upon request.


The CLTE-MW laminates are reinforced with spread glass, which along with a high filler loading helps minimize the high frequency glass weave effects on electromagnetic wave propagation. The woven glass reinforcement also provides excellent dimensional stability. Other key features of the laminate include low z-axis CTE (30 ppm/°C) for excellent plated through hole reliability, a low loss tangent of 0.0015 at 10 GHz to enable low loss designs, and low moisture absorption of 0.03% to ensure stable performance in a range of operating environments. Thermal conductivity of 0.42 W/(m·K) enables heat dissipation in aggressive designs along with a high dielectric strength of 630 V/mil to ensure good z-axis insulation between conductor layers. The UL 94 V-0 flammability rating enables the use of CLTE-MW laminates in commercial applications.


CLTE-MW laminates are well suited for a range of applications including amplifiers, antennas, baluns, couplers and filters. Applicable markets range from commercial and consumer to defense and aerospace.


CCL 44 CLTE-MW


10. Features and Benefits Summary

FeatureBenefit
Low loss tangent of 0.0015 at 10 GHzEnables low loss designs
Low Z-axis CTE of 30 ppm/°CExcellent plated through hole (PTH) reliability
Thermal conductivity of 0.42 W/(m·K)Good heat dissipation in aggressive designs
UL 94 V-0 flammability ratingCompatible with commercial applications
Low moisture absorption of 0.03%Stable performance in a range of operating environments
High dielectric strength of 630 V/milGood z-axis insulation between conductor layers
Spread glass reinforcementMinimizes high frequency glass weave effects
Seven thickness options (3 to 10 mils)Ideal signal to ground spacing for 5G and mmWave designs


11.Rogers CLTE-MW Data Sheet

PropertyTypical ValueUnitsTest ConditionsTest Method
Electrical Properties
Dielectric Constant (process)2.94 to 3.02 ± 0.04-23°C @ 50% RH, 10 GHzIPC TM-650 2.5.5.5
Dielectric Constant (design)3.03 to 3.10-C-24/23/50, 8-40 GHzMicrostrip Differential Phase Length
Dissipation Factor0.0015-23°C @ 50% RH, 10 GHzIPC TM-650 2.5.5.5
Thermal Coefficient of Dielectric Constant-35ppm/°C0 to 100°C, 10 GHzIPC TM-650 2.5.5.5
Volume Resistivity1.3 × 10⁷MΩ·cmC96/35/90IPC TM-650 2.5.17.1
Surface Resistivity2.5 × 10⁶C96/35/90IPC TM-650 2.5.17.1
Electrical Strength (Dielectric Strength)630V/mil-IPC TM-650 2.5.6.2
Dielectric Breakdown44kVD-48/50IPC TM-650 2.5.6
Comparative Tracking Index600V / PLC 0class/voltsC-40/23/50UL-746A, ASTM D6054
Thermal Properties
Decomposition Temperature (Td)500°C2hrs @ 105°C, 5% weight lossIPC TM-650 2.3.40
CTE - X axis8ppm/°C-55°C to 288°CIPC TM-650 2.4.41
CTE - Y axis8ppm/°C-55°C to 288°CIPC TM-650 2.4.41
CTE - Z axis30ppm/°C-55°C to 288°CIPC TM-650 2.4.24
Thermal Conductivity0.42W/(m·K)Z directionASTM D5470
Time to Delamination>60minutesas-received, 288°CIPC TM-650 2.4.24.1
Mechanical Properties
Copper Peel Strength1.1 (6.0)N/mm (lbs/in)10s @ 288°C, 35 μm foilIPC TM-650 2.4.8
Flexural Strength (MD, CMD)113, 99 (16.4, 14.4)MPa (ksi)25°C ± 3°CASTM D790
Tensile Strength (MD, CMD)83, 80 (12.0, 11.6)MPa (ksi)23°C @ 50% RHASTM D3039/D3039-14
Flex Modulus (MD, CMD)6468, 6360 (938.1, 922.4)MPa (ksi)25°C ± 3°CIPC TM-650 2.4.4
Dimensional Stability (MD, CMD)0.22, 0.22mil/inchafter etch + bakeIPC-TM-650 2.4.39a
Physical Properties
FlammabilityV-0--UL 94
Moisture Absorption0.03%E1/105+D48/50IPC TM-650 2.6.2.1
Density2.1g/cm³C24/23/50ASTM D792
Specific Heat Capacity0.93J/g·K2 hours at 105°CASTM E2716
NASA Outgassing
Total Mass Lost0.03%TML/CVCMASTM E595
Collected Volatiles<0.01%ASTM E595

12.CLTE-MW Dielectric Constant by Thickness

GradePanel ThicknessProcess Dk (10 GHz)Design Dk (AH/AH)
CLTE-MW0.003" (0.076mm)2.943.10
CLTE-MW0.004" (0.102mm)2.973.08
CLTE-MW0.005" (0.127mm)2.963.07
CLTE-MW0.006" (0.152mm)3.023.07
CLTE-MW0.007" (0.178mm)3.003.06
CLTE-MW0.008" (0.203mm)3.013.05
CLTE-MW0.010" (0.254mm)3.003.03

13.Some Typical Applications

Commercial communications and avionics

Military / aerospace applications

Microwave feed networks

Phase sensitive electronic structures

Satellite communication systems

Passive components (couplers, filters & baluns)

Amplifiers and antennas


14.Standard Thicknesses, Panel Sizes & Claddings

Standard Thicknesses

0.003" (0.076 mm) ± 0.0005"

0.004" (0.102 mm) ± 0.0005"

0.005" (0.127 mm) ± 0.0007"

0.006" (0.152 mm) ± 0.0007"

0.007" (0.178 mm) ± 0.0010"

0.008" (0.203 mm) ± 0.0010"

0.010" (0.254 mm) ± 0.0010"

Standard Panel Sizes

12" x 18" (305 x 457 mm)

24" x 18" (610 x 457 mm)

Standard Claddings

Reverse Treated Electrodeposited Copper Foil: 1/2 oz (18 μm), 1 oz (35 μm), 2 oz (70 μm)

Very Low Profile Electrodeposited Copper Foil: 1/4 oz (9 μm), 1/2 oz (18 μm), 1 oz (35 μm)


 

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