Rogers RO4003C LoPro 2-Layer 16.7mil Low-Loss PCB with ENEPIG Finish1.Introduction of Core RO4003C LoPro laminates use a proprietary Rogers' technology that allows reverse treated foil to bond to standard RO4003C dielectric. This results in a laminate with low conductor loss for improved insertion loss and signal integrity while maintaining the other desirable attributes of the standard RO4003C laminate system. RO4003C hydrocarbon ceramic laminates are designed to offer superior high frequency performance and low cost circuit fabrication. The result is a low loss material which can be fabricated using standard epoxy/glass (FR-4) processes and do not require specialized via preparation such as sodium etch for lower manufacturing cost. 2.Key Features Dielectric constant of 3.38 +/- 0.05 at 10 GHz/23°C 3.Benefits Lower insertion loss allows for higher operating frequency designs (even greater than 40 GHz)
4.PCB Construction Details
5.PCB Stackup (2-Layer Rigid Structure) Copper layer 1 – 35 μm 6.PCB Statistics: Components: 56 7.Typical Applications Digital applications such as servers, routers, and high speed back planes 8.Quality Assurance Artwork supplied: Gerber RS-274-X |
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