TFA294 PCB 2-Layer 0.127mm Thick High-Frequency PTFE Ceramic Composites for Aerospace Applications

1.Introduction of TFA Series

The TFA series features a dielectric layer made from a Polytetrafluoroethylene (PTFE) ceramic composite. Unlike traditional methods that involve impregnating glass fiber cloth with resin to create prefabricated sheets, this series employs a unique process to produce these sheets, which are then pressed using a specialized lamination technique. The resulting material showcases exceptional electrical, thermal, and mechanical properties, providing an aerospace-grade, high-frequency, and highly reliable alternative to similar foreign products.

This substrate series is free of glass fiber cloth and incorporates a significant amount of uniform special nano-ceramics blended with resin. This design removes the fiberglass effect during electromagnetic wave propagation, leading to outstanding frequency stability and minimal dielectric loss. Additionally, the material exhibits reduced X/Y/Z anisotropy and features a low thermal expansion coefficient comparable to that of copper foil, along with stable dielectric temperature characteristics.

The dielectric constant options available in this series are 2.94, 3.0, 6.15, and 10.2, corresponding to part numbers TFA294, TFA300, TFA615, and TFA1020.

2.Features (TFA294)

- Dielectric constant (Dk) of 2.94 at 10 GHz  
- Dissipation factor of 0.0010 at 10 GHz and 20 GHz, and 0.0012 at 40 GHz  
- Low temperature coefficient of dielectric constant (TCDK) of -5 ppm/°C, ranging from -55°C to 150°C  
- Coefficients of thermal expansion (CTE): X-axis at 18 ppm/°C, Y-axis at 18 ppm/°C, Z-axis at 32 ppm/°C, from -55°C to 288°C  
- Thermal conductivity of 0.59 W/mK  
- Moisture absorption of 0.03%  
- UL 94-V0 rated  

3.PCB Stackup: 2-layer rigid PCB
Copper layer1 :35 µm  
Rogers RO4350B Core : 0.127mm (5 mil)  
Copper layer2 :35 µm  

4.PCB Construction Detail

- Board dimensions: 58.1 mm x 66 mm (1 piece, +/- 0.15 mm)  
- Minimum trace/space: 4/5 mils  
- Minimum hole size: 0.2 mm  
- No blind vias  
- Finished board thickness: 0.25 mm  
- Finished copper weight: 1 oz (1.4 mils) for outer layers  
- Via plating thickness: 20 µm  
- Surface finish: ENEPIG  
- Top silkscreen: None  
- Bottom silkscreen: None  
- Top solder mask: None  
- Bottom solder mask: None  
- 100% electrical testing conducted prior to shipment  

 5.PCB Statistics
- Components: 10  
- Total pads: 26  
- Through hole pads: 15  
- Top SMT pads: 11  
- Bottom SMT pads: 0  
- Vias: 9  
- Nets: 2  

 6.Type of Artwork Supplie:
Gerber RS-274-X

7.Quality Standard:
IPC-Class-2

8. Availability: Worldwide

9. Some Typical Applications

- Aerospace equipment, including in-cabin systems and aircraft  
- Microwave applications, antennas, and phase-sensitive antennas  
- Early warning and airborne radars  
- Phased array antennas and beamforming networks  
- Satellite communications and navigation  
- Power amplifiers