TU-872 SLK 20-Layer 3.0mm ENEPIG PCB – HDI & High Speed Digital Applications

1. Introduction to TU-872 SLK HDI PCB

TU-872 SLK is based on a high performance modified epoxy FR-4 resin, reinforced with regular woven E-glass. This material is designed with low dielectric constant and low dissipation factor for high speed low loss and high frequency multilayer circuit board applications.

TU-872 SLK material is suitable for environmental protection lead free processes and is fully compatible with standard FR-4 processing. The laminates exhibit excellent moisture resistance, improved CTE, superior chemical resistance, thermal stability, CAF resistance, and toughness enhanced by an allyl network forming compound.

This 20-layer HDI PCB is constructed with TU-872 SLK as the core material, providing exceptional signal integrity, low loss, and high reliability for demanding high speed digital, telecom, and backplane applications. The board features ENEPIG surface finish, resin plugging, and HDI laser via structures.

2. Key Features of TU-872 SLK

• Low dielectric constant (<4.0)

• Low dissipation factor (<0.010)

• Stable and flat Dk/Df performance across frequency

• Tg (DMA) >170°C, Tg (DSC) >340°C, Tg (TMA) >170°C

• Td (TGA) >340°C

• Z-axis CTE <3.0%

• T260 >30 min, T288 >15 min, T300 >2 min

• Excellent moisture resistance (0.13% water absorption)

• Lead free reflow process compatible

• Anti-CAF capability

• Superior dimensional stability, thickness uniformity and flatness

• Excellent through-hole and soldering reliability

• UL 94V-0 flammability rating

• Max operating temperature: 130°C

3. Benefits of TU-872 SLK HDI PCB

• Low loss for high speed signal integrity

• Compatible with modified FR-4 processes – no special handling required

• Excellent thermal reliability for lead free assembly

• Low Z-axis CTE ensures reliable plated through-hole quality

• HDI capability with laser vias for high density routing

• Resin plugging for planarized via-in-pad designs

• ENEPIG surface finish (Ni+Pd+Au) for wire bonding and long shelf life

• IPC Class-3 high reliability standard

4. PCB Construction Details

5. PCB Stackup (20-Layer HDI Rigid Structure)

*Core and prepreg thicknesses configured to achieve 3.0 mm total thickness with TU-872 SLK and TU-87P SLK prepreg. Laser vias for HDI interconnections between L1-L2 and L19-L20.*

Total Pressed Thickness: 3.0 mm

6. Impedance Control Table

7. PCB Special Features

• HDI Laser Vias: Sequential lamination with microvias for high density interconnect

• Resin Plugging: All vias resin filled and capped for via-in-pad capability

• ENEPIG Surface Finish: Electroless Nickel - Electroless Palladium - Immersion Gold (suitable for wire bonding, aluminum wire bonding, and long shelf life)

• IPC Class-3: Highest reliability standard for mission critical applications

• 2x2 Panel Array: 4 PCBs per panel (215mm x 137mm each)

8. Primary Application Areas

• Radio frequency (RF) circuits

• Backpanel, high performance computing

• Line cards, storage systems

• Servers, telecom, base station equipment

• Office routers

• High speed digital designs

• High reliability mission critical systems

9. Quality Assurance

• Artwork supplied: Gerber RS-274-X

• Accepted standard: IPC Class-3

• Availability: Worldwide

• IPC-4101E Type: /29, /99, /101, /126

• IPC-4101E/126 Validation Services QPL Certified

• UL Designation: ANSI Grade FR-4.0

• UL File Number: E189572

• Flammability Rating: 94V-0

10. TU-872 SLK High Speed Laminate Introduction

TU-872 SLK is based on a high performance modified epoxy FR-4 resin. This material is reinforced with regular woven E-glass and designed with low dielectric constant and low dissipation factor for high speed low loss and high frequency multilayer circuit board application.

TU-872 SLK material is suitable for environmental protection lead free process and is compatible with FR-4 processes. TU-872 SLK laminates also exhibit excellent moisture resistance, improved CTE, superior chemical resistance, thermal stability, CAF resistance, and toughness enhanced by an allyl network forming compound.

The material is available in various thicknesses from 0.002" to 0.062" with copper cladding from 1/3 oz to 5 oz. Prepregs are available with glass styles including 106, 1080, 3313, 2116 and others upon request.

11. TU-872 SLK Data Sheet

12. Typical Applications

• Radio frequency (RF) circuits

• Backpanel, high performance computing

• Line cards, storage systems

• Servers, telecom, base station equipment

• Office routers

• High speed digital designs

• High reliability mission critical systems

13. Standard Availability – TU-872 SLK

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