WL-CT440 2-Layer 10mil Ceramic-Filled PCB with Immersion Gold
1.Introduction
Wangling's WL-CT440 organic polymer ceramic fiberglass cloth-covered copper clad laminates are a thermosetting resin-based high-frequency materials. The composition of the dielectric layer includes hydrocarbon resin, ceramics, and fiberglass cloth. It exhibits low loss performance, meeting the requirements for high-frequency designs. PCB processing can be carried out using techniques similar to FR4 materials, making it simpler compared to PTFE materials and ensuring better stability and consistency in circuitry. It can be used as a substitute for similar foreign products.
The combination of hydrocarbon resin and composite ceramics provides excellent low loss, high-temperature resistance, and temperature stability characteristics. The series of materials have a stable temperature coefficient of dielectric constant and loss, low thermal expansion coefficient, and a high TG value of above 280°C.
2.Key Features
Dielectric constant of 4.1 at 10 GHz/23°C
Dissipation factor of 0.005 at 10GHz
Tg 280℃
Excellent TCDK of -21 ppm/°C
High Thermal conductivity of 0.66 W/MK
Low Moisture Absorption 0.12%
Matched to copper CTE in X-axis of 14ppm/°C, Y-axis of 18 ppm/°C and Z-axis of 35 ppm/°C
UL-94V0
3.Benefits
Low loss performance suitable for high-frequency designs
High-temperature resistance and excellent thermal stability
Compatible with standard FR4 processing techniques
Stable dielectric constant and low thermal expansion coefficient
High Tg value (>280°C) for reliable performance
Can serve as a substitute for similar imported materials
4.PCB Details
| Specification | Value |
|---|---|
| Base Material | WL-CT440 |
| Layer Count | 2-layer |
| Board Dimensions | 56.5mm × 89.65mm (±0.15mm) |
| Minimum Trace/Space | 6/7 mils |
| Minimum Hole Size | 0.35mm |
| Blind Vias | No |
| Finished Board Thickness | 0.3mm |
| Finished Cu Weight (Outer Layers) | 1oz (1.4 mils) |
| Via Plating Thickness | 20 μm |
| Surface Finish | Immersion Gold |
| Top Silkscreen | White |
| Bottom Silkscreen | No |
| Top Solder Mask | Green |
| Bottom Solder Mask | No |
| Electrical Test | 100% prior to shipment |
5.PCB Stackup (2-Layer Rigid Structure)
Copper layer 1 – 35 μm
WL-CT440 – 0.254 mm (10mil)
Copper layer 2 – 35 μm
6.PCB Statistics
Components: 23
Total Pads: 56
Thru Hole Pads: 30
Top SMT Pads: 26
Bottom SMT Pads: 0
Vias: 32
Nets: 2
7.Typical Applications
Aerospace equipment, space, cabin equipment, aircraft
Microwave, antenna, phase-sensitive antenna
Early warning radar, airborne radar
Phased array antenna, beam wave network
Satellite communication, navigation
Power amplifier
8.Quality Assurance
Artwork Format: Gerber RS-274-X
Quality Standard: IPC-Class-2
Availability: Worldwide
