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F4BTM350 2-Layer Thick PCB
PCB Material:F4BTM350 / 3.1mm (120mil core)
MOQ:1PCS
Price:4.99-199 USD/PCS
Packaging:Vacuum / Heavy-Duty Packaging
Delivery Period:8-12 working days
Payment Method:T/T, Paypal
 

F4BTM350 2-Layer 3.1mm Thick PCB for High-Frequency RF & Microwave Applications


1.Introduction of F4BTM350

Wangling's F4BTM350 laminates are engineered through a scientific formulation of fiberglass cloth, nano-ceramic fillers, and polytetrafluoroethylene resin, followed by stringent pressing processes. This series builds upon the F4BM dielectric layer by incorporating high-dielectric, low-loss nano-ceramic materials. The result is a laminate with a higher dielectric constant, improved heat resistance, a lower thermal expansion coefficient, higher insulation resistance, and enhanced thermal conductivity—all while maintaining excellent low-loss characteristics.


F4BTM350 and F4BTME350 share the same dielectric layer but differ in copper foil type: F4BTM uses ED copper foil and is suitable for applications without PIM (Passive Intermodulation) requirements, while F4BTME uses reverse-treated (RTF) copper foil, offering superior PIM performance, more precise line control, and reduced conductor loss.


2.Key Features

Dielectric constant (Dk) of 3.5 ±0.07 at 10GHz
Dissipation factor of 0.0025 at 10GHz
CTE: x-axis 10 ppm/°C, y-axis 12 ppm/°C, z-axis 51 ppm/°C (-55°C to 288°C)
Low thermal coefficient of Dk: -60 ppm/°C (-55°C to 150°C)
Moisture absorption ≤ 0.05%
Flammability rating: UL-94 V0
CTI > 600V, Grade 0


3.Benefits of Using F4BTM350 in PCB Design

Excellent high-frequency performance with stable Dk and low loss
Enhanced thermal and mechanical reliability
Suitable for precision RF and microwave circuits
Compatible with immersion gold surface finish for improved solderability and shelf life
Supports fine trace/spacing down to 5/7 mils for high-density designs


F4BTM350 PCB


4.PCB Construction Details

Parameter Specification
Base MaterialF4BTM350
Layer Count2-layer
Board Dimensions328mm x 84.08mm (±0.15mm)
Minimum Trace/Space5/7 mils
Minimum Hole Size0.4mm
Blind ViasNo
Finished Board Thickness3.1mm
Finished Cu Weight (Outer)1oz (1.4 mils)
Via Plating Thickness20µm
Surface FinishImmersion Gold
Top SilkscreenWhite
Bottom SilkscreenNo
Top Solder MaskBlack
Bottom Solder MaskNo
Electrical Test100% tested prior to shipment

5.PCB Stackup (2-Layer Rigid Structure)

Copper layer 1: 35µm
F4BTM350 core: 3.048mm (120mil)
Copper layer 2: 35µm


6.PCB Statistics:

Components: 58
Total pads: 139
Through-hole pads: 97
Top SMT pads: 42
Bottom SMT pads: 0
Vias: 68
Nets: 2


7.Typical Applications

Microwave, RF, and radar systems
Phase shifters
Power dividers, couplers, combiners
Feed networks
Phase-sensitive antennas, phased array antennas
Satellite communications
Base station antennas


8.Quality Assurance

Artwork Format: Gerber RS-274-X
Quality Standard: IPC-Class-2
Availability: Worldwide


 

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