High-Frequency F4BM220 PCB - 2-Layer PTFE Circuit Board with Immersion Gold Finish

1.Introduction to F4BM220 Technology

Wangling's F4BM220 laminates combine fiberglass cloth reinforcement with polytetrafluoroethylene (PTFE) resin and PTFE film layers to create an advanced high-frequency PCB material. This formulation delivers superior electrical performance compared to standard F4B220, featuring reduced dielectric loss, enhanced insulation resistance, and improved thermal stability.

The material is available in two copper foil variants: F4BM220 with ED copper foil for standard applications, and F4BME220 with RTF copper foil for PIM-sensitive designs requiring ultra-low passive intermodulation.

2.Key Material Properties

Dielectric constant (Dk) of 2.2±0.04 at 10GHz
Dissipation factor of .001 at 10GHz
CTE x-axis of 25 ppm/°C, CTE y-axis of 34 ppm/°C, CTE z-axis of 240 ppm/°C, -55°C to 288°C
Thermal coefficient of Dk at -142 ppm/°C, -55°C to 150°C
Moisture absorption of ≤0.08%
Flammability of UL-94 V0

3.Complete PCB Specifications

4.PCB Stackup

Top Layer: 35µm copper
Core: 0.8mm F4BM220 dielectric
Bottom Layer: 35µm copper

5.Board Statistics

Total Components: 31
Total Pads: 72 (45 thru-hole, 27 SMT)
Vias: 49
Nets: 2

6.Manufacturing & Quality Standards

Artwork Format: Gerber RS-274-X
Quality Standard: IPC-Class 2
Via Types: Through-hole only (no blind vias)
Availability: Worldwide shipping

7.Target Applications

RF & Microwave Systems: Phase shifters, power dividers/combiners, directional couplers
Antenna Technologies: Phased array antennas, satellite feed networks, base station antennas
Aerospace & Defense: Radar systems, military communications, avionics systems