High-Performance RO4360G2 2-Layer PCB for Telecommunications and Power Applications

1. Introduction to RO4360G2

The RO4360G2 laminate is a low-loss, glass-reinforced, hydrocarbon ceramic-filled thermoset material that offers an optimal balance of performance and processing capability. As the first high dielectric constant (Dk) thermoset laminate that can be processed similarly to conventional FR-4, RO4360G2 provides enhanced rigidity for improved processability in multi-layer board constructions. This material is lead-free process capable and helps reduce both material and fabrication costs. It can be effectively paired with RO440 series prepreg and lower-Dk RO4000 laminates in multi-layer designs.

2. Features and Benefits

Features
Dielectric Constant: 6.15 ± 0.15 at 10 GHz and 23°C.
Dissipation Factor: 0.0038 at 10 GHz and 23°C.
Thermal Properties: Td > 407°C; high Tg greater than 280°C (TMA).
Thermal Conductivity: High at 0.75 W/mK.
Low Z-axis CTE: 28 ppm/°C.
Copper-Matched CTE: X-axis: 13 ppm/°C, Y-axis: 14 ppm/°C.
Lead-Free Process Compatibility: 94V-0 flammability rating.

Benefits

Design Flexibility: Allows for versatile applications in various circuit designs.
Plated Through-Hole Reliability: Ensures dependable connections.
Automated Assembly Compatibility: Facilitates efficient manufacturing processes.
Environmentally Friendly: Fully compatible with lead-free processes.
Cost-Effective: Efficient supply chain and short lead times reduce overall material costs.

3. PCB Construction Details

4. PCB Stackup

Copper Layer 1: 35 µm
RO4360G2 Substrate: 8 mil (0.203 mm)
Copper Layer 2: 35 µm

5.PCB Statistics

Components: 18
Total Pads: 57
Thru Hole Pads: 39
Top SMT Pads: 18
Bottom SMT Pads: 0
Vias: 51
Nets: 2

6.Manufacturing & Compliance

Artwork Format: Gerber RS-274-X
Quality Standard: IPC-Class-2 compliant
Availability: Worldwide production and shipping

7.Typical Applications

Base station power amplifiers
Small cell transceivers