ISOLA 370HR PCB - 6-Layer High-Performance FR-4 PCB with ENIG Finish

1. Introduction to ISOLA 370HR

ISOLA 370HR laminates and prepregs, developed by Polyclad, utilize a patented high-performance epoxy resin system with a glass transition temperature (Tg) of 180°C. This multifunctional FR-4 resin is specifically engineered for multilayer Printed Circuit Board (PCB) applications that demand exceptional thermal performance and reliability. The laminates and prepregs are crafted with high-quality E-glass fabric, ensuring excellent resistance to Conductive Anodic Filament (CAF) formation. 370HR delivers outstanding thermal performance with a low Coefficient of Thermal Expansion (CTE), along with mechanical, chemical, and moisture resistance that meets or surpasses traditional FR-4 materials.

Utilized in countless PCB designs, 370HR is recognized as best in class for thermal reliability, CAF performance, processing ease, and effectiveness in sequential lamination processes.

2. Properties
Glass Transition Temperature (Tg): 180°C (measured by DSC)
Decomposition Temperature (Td): 340°C (5% weight loss measured by TGA)
Time to Delaminate: T260 of 60 minutes, T288 of 30 minutes (measured by TMA with copper removed)
Coefficient of Thermal Expansion (CTE): Pre-Tg Z-Axis of 45 ppm/°C, X/Y-Axis of 13/14 ppm/°C
Thermal Conductivity: 0.4 W/mK
Dielectric Constant (DK): 3.92 at 5 GHz and 10 GHz; 4.24 at 100 MHz; 4.17 at 1 GHz; 4.04 at 2 GHz
Dissipation Factor (Df): 0.025 at 5 GHz and 10 GHz; 0.015 at 100 MHz; 0.0161 at 1 GHz; 0.021 at 2 GHz
Dielectric Breakdown: Greater than 50 kV
Comparative Tracking Index (CTI): 175V-249V
Moisture Absorption: 0.15%
Flammability Rating: UL94-V0 for laminate and laminated prepreg

3. Attributes

High thermal reliability
High-density interconnect capabilities

4. 6-Layer PCB Stackup (370HR)

The stackup for the 370HR PCB includes various signal and power layers, with the total thickness reaching 62.0 mils.
Specifics of each layer include top and bottom signal layers, ground planes, and power layers.

5. PCB Construction Details

Board Dimension: 40 mm x 55 mm (1 piece, +/- 0.15 mm)
Minimum Trace/Space: 4/4 mils
Minimum Hole Size: 0.2 mm
Blind Via: None
Finished Board Thickness: 1.6 mm
Finished Copper Weight: 1 oz (1.4 mils) for both inner and outer layers
Via Plating Thickness: 20 µm
Surface Finish: ENIG
Silkscreen: White on both top and bottom layers
Solder Mask: Green on both top and bottom layers
Impedance Control: 50 ohm on 10 mil traces
Electrical Testing: 100% testing performed prior to shipment

6. PCB Statistics -Components: 31
Total Pads: 46
Through-Hole Pads: 29
Top SMT Pads: 17
Bottom SMT Pads: 0
Vias: 24
Nets: 5

7. Type of Artwork Supplied
Gerber RS-274-X format.

8. Accepted Standard
IPC-Class-2 compliance.

9. Availability
Available worldwide.

10. Typical Applications
Computing, Storage & Peripherals
Consumer Electronics
Networking & Communications
Medical, Industrial, and Instrumentation
Automotive and Transportation
Aerospace and Defense