Megtron6 M6 High-Speed 6-Layer PCB for 5G and Automotive Radar Systems
1.Advanced High-Frequency Performance
Panasonic's Megtron6 M6 R-5775G represents the cutting edge in high-speed PCB technology, offering exceptional signal integrity for demanding RF and digital applications. This 6-layer laminate combines ultra-low dielectric loss with outstanding thermal stability, making it ideal for next-generation 5G networks, automotive radar systems, and high-performance computing infrastructure.
2.Key Technical Advantages
Optimized Signal Integrity:
Dielectric Constant (Dk): 3.4 @1GHz, 3.34 @13GHz
Dissipation Factor (Df): 0.002 @1GHz, 0.0037 @13GHz
Enhanced Thermal Performance:
Glass Transition Temp (Tg): >185°C (DSC)
Thermal Decomposition: 410°C
CTE Stability: 16/16/45 ppm/°C (X/Y/Z)
Robust Construction:
UL 94V-0 flammability rating
RoHS & halogen-free compliant
Compatible with standard FR-4 processes
3.PCB Construction Specifications
| Specification | Detail |
|---|
| Base Material | Megtron6 (M6) - R5775G (HVLP) |
| Layer Count | 6-layer |
| Board Dimensions | 81.9mm × 53.7mm (±0.15mm) |
| Minimum Trace/Space | 4/5 mils |
| Minimum Hole Size | 0.3mm |
| Blind Vias | Not Supported |
| Finished Board Thickness | 1.4mm |
| Copper Weight | 1oz outer / 0.5oz inner |
| Via Plating Thickness | 25μm |
| Surface Finish | ENEPIG |
| Silkscreen | White (Top & Bottom) |
| Solder Mask | Matte Black (Top & Bottom) |
| Via Treatment | 0.3mm vias resin-filled and capped |
| Electrical Testing | 100% tested prior to shipment |
4.PCB Stackup:
| Layer | Material Type | Thickness | Details |
|---|
| 1 | Copper (Outer Layer) | 35 μm | Signal layer |
| - | Prepreg R-5670(G) 1080 | 85.1 μm | 1 ply |
| 2 | Copper (Inner Layer) | 17 μm | Signal/Power plane |
| - | M6 Core R5775G(HVLP) | 500 μm | Core substrate |
| 3 | Copper (Inner Layer) | 17 μm | Signal/Power plane |
| - | Prepreg R-5670(G) 3313 | 99.4 μm | 1 ply |
| 4 | Copper (Inner Layer) | 17 μm | Signal/Power plane |
| - | M6 Core R5775G(HVLP) | 500 μm | Core substrate |
| 5 | Copper (Inner Layer) | 17 μm | Signal/Power plane |
| - | Prepreg R-5670(G) 1080 | 85.1 μm | 1 ply |
| 6 | Copper (Outer Layer) | 35 μm | Signal layer |
5.Board Statistics
Components: 108
Total Pads: 247
Thru Hole Pads: 125
Top SMT Pads: 98
Bottom SMT Pads: 24
Vias: 412
Nets: 8
6.Manufacturing & Quality Standards
Artwork Format: Gerber RS-274-X
Quality Standard: IPC-Class 2
Availability: Worldwide shipping
7.Target Applications
5G Infrastructure: mmWave antennas and RF front-end modules
Automotive Electronics: 77GHz radar and ADAS systems
Data Center Hardware: High-speed server boards and optical modules
Aerospace Systems: Satellite communication equipment
Next-Gen Consumer Tech: Wi-Fi 6E/7 routers and AR/VR devices
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