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RF-30 High Frequency PCB
PCB Material:RF-30 / 1.1mm
MOQ:1PCS
Price:6.99-55 USD/PCS
Packaging:Vacuum / Anti-static Packaging
Delivery Period:7-14 working days
Payment Method:T/T, Paypal
 

RF-30 High Frequency PCB 2-Layer Antenna Board with Immersion Tin Finish


1.Introduction of RF-30

RF-30 is an organic ceramic laminate that combines woven glass reinforced fluoropolymer chemistry with ceramic enhancements. Designed as the best value solution, it meets the low-cost, high-performance demands of microwave and radio frequency antenna applications.


The material's low dissipation factor, thermal stability and smooth surface profile minimize phase shift with frequency/temperature variations, delivering exceptionally low intermodulation performance. RF-30 is particularly suitable for large printed circuit base station antennas up to 102 inches.


With excellent peel strength for high-temperature assembly and power handling requirements, RF-30 maintains dimensional stability through its woven fabric design. The laminate meets UL-94V0 flammability standards.


2.Features:

Dielectric Constant: 3.0 ±0.05 at 1.9GHz
Dissipation Factor: 0.0014 at 1.9GHz
CTE: x=11 ppm/°C, y=21 ppm/°C, z=125 ppm/°C
Moisture Absorption: 0.02%
Dielectric Breakdown: >60kV
Volume Resistivity: 1.26×109 Mohm-cm
Flammability Rating: UL-94V0


3.PCB Construction Details

ParameterSpecification
Base MaterialRF-30
Board Dimensions151mm×82mm (±0.15mm)
Minimum Trace/Space5/4 mils
Minimum Hole Size0.3mm
Finished Thickness1.1mm
Copper Weight1oz (35μm) outer layers
Via Plating Thickness20μm
Surface FinishImmersion Tin
Solder MaskNone
Silkscreen (Top)Black
Electrical Test100% tested


4.PCB Stackup

Top Layer: 35μm copper
Core: 1.016mm (40mil) RF-30
Bottom Layer: 35μm copper


5.Board Statistics

Components: 77
Total Pads: 186 (93 thru-hole, 93 SMT)
Vias: 121
Nets: 2


6.Manufacturing & Quality Standards

Artwork Format: Gerber RS-274-X
Quality Standard: IPC-Class 2
Via Types: Through-hole only (no blind vias)
Availability: Worldwide shipping


7.Benefits

Cost-effective RF solution
Excellent peel strength
Ultra-low dissipation factor
Superior intermodulation performance
Minimal moisture absorption
Enhanced surface smoothness


8.Target Applications

Antenna and subcomponents
RF passive components
Power amplifiers
Base station antennas
Microwave circuits


 

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