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RO3003 4-Layer High-Frequency PCB
PCB Material:Rogers RO3003 / 1.6mm
MOQ:1PCS
Price:24.99-119 USD/PCS
Packaging:Vacuum / Anti-static Packaging
Delivery Period:9-16 working days
Payment Method:T/T, Paypal
 

RO3003 PCB – 4-Layer 1.6mm Thick High-Frequency PCB for Automotive Radar and 5G Applications


1.Unlock Next-Level Performance with Rogers RO3003 High-Frequency PCBs

Rogers RO3003 laminates are ceramic-filled PTFE composites designed for high-frequency RF and microwave applications, offering exceptional stability of dielectric constant (Dk) across various temperatures and frequencies. With a Dk of 3.0 ±0.04 and a dissipation factor of 0.001 at 10 GHz, RO3003 is the ideal choice for automotive radar (77 GHz), 5G wireless infrastructure (mmWave), and advanced driver assistance systems (ADAS).


This 4-layer rigid PCB features a 1.6mm thickness, 1oz copper layers, and immersion silver surface finish, ensuring superior performance, reliability, and cost-effectiveness for your high-frequency designs.


2.Key Features of RO3003 Laminates

Dielectric Constant (Dk): 3.0 ±0.04 at 10 GHz/23°C
Dissipation Factor (Df): 0.001 at 10 GHz/23°C
Thermal Conductivity: 0.5 W/mK
Low Moisture Absorption: 0.04%
CTE: X-axis: 17 ppm/°C, Y-axis: 16 ppm/°C, Z-axis: 25 ppm/°C
Decomposition Temperature (Td): >500°C
Coefficient of Thermal Expansion (-55 to 288 °C):X axis 17 ppm/°C, Y axis 16 ppm/°C, Z axis 25 ppm/°C


3.Why Choose RO3003 Laminates?

Low Dielectric Loss: Ideal for applications up to 77 GHz.
Excellent Mechanical Properties: Reliable for stripline and multi-layer board constructions.
Stable Dk Over Temperature and Frequency: Perfect for band-pass filters, microstrip patch antennas, and voltage-controlled oscillators.
Low In-Plane Expansion Coefficient: Matches copper for reliable surface-mounted assemblies.
Cost-Effective: Economical pricing for volume manufacturing.


4.PCB Stackup: 4-layer rigid PCB

SpecificationDetails
Copper Layer 135 μm
Rogers RO3003 Substrate5 mil (0.127 mm)
Copper Layer 235 μm
Prepreg4 mil (0.102 mm)
Copper Layer 335 μm
Rogers RO3003 Substrate50 mil (1.27 mm)
Copper Layer 435 μm

5.PCB Construction details:

Board dimensions: 110.9mm x 110.9 mm = 1PCS
Minimum Trace/Space: 4/5 mils
Minimum Hole Size: 0.25mm
No Blind vias.
Finished board thickness: 1.64mm
Finished Cu weight: 1 oz (1.4 mils) outer layers
Via plating thickness: 20 μm
Surface finish: Immersion Silver
Top Silkscreen: No
Bottom Silkscreen: No
Top Solder Mask: No
Bottom Solder Mask: No
100% Electrical test used prior to shipment


6.PCB Statistics:

Components: 37
Total Pads: 193
Thru Hole Pads: 135
Top SMT Pads: 58
Bottom SMT Pads: 0
Vias: 79
Nets: 2


7.Accepted Standards

Artwork Format: Gerber RS-274-X
Quality Standard: IPC-Class-2 compliant
Availability: Worldwide production and shipping


8.Applications of RO3003 Laminates

Automotive Radar Systems (77 GHz)
5G Wireless Infrastructure (mmWave)
Global Positioning Satellite Antennas
Cellular Telecommunications Systems
Patch Antennas for Wireless Communications
Direct Broadcast Satellites
Power Backplanes


RO3003 PCB 4-layer 1.6mm Thick


9.Upgrade Your RF PCB Designs with RO3003 Laminates!

Whether you're working on automotive radar, 5G infrastructure, or wireless communications, Rogers RO3003 laminates offer the perfect combination of performance, reliability, and cost efficiency. With low dielectric loss, stable Dk over temperature and frequency, and excellent mechanical properties, RO3003 is the ideal choice for your next high-frequency PCB project.


 

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