500°C, thermal conductivity 0.79 W/mK, CTE X/Y/Z 17/17/24 ppm/°C, moisture absorption 0.02%. Ideal for automotive radar, GPS antennas, cellular power amplifiers, patch antennas, direct broadcast satellites, RF bonding applications. IPC-Class-2."> 500°C, thermal conductivity 0.79 W/mK, CTE X/Y/Z 17/17/24 ppm/°C, moisture absorption 0.02%. Ideal for automotive radar, GPS antennas, cellular power amplifiers, patch antennas, direct broadcast satellites, RF bonding applications. IPC-Class-2 quality.">
Home > Newly Shipped PCB > RO3006 2-Layer 0.2mm PCB – 5mil Ultra-Thin Ceramic PTFE with Pure Gold Plating for RF & Bonding

RO3006 2-Layer 0.2mm PCB
PCB Material:Rogers RO3006 / 0.2mm (5mil core)
MOQ:1PCS
Price:4.99-159 USD/PCS
Packaging:Vacuum / Anti-static Packaging
Delivery Period:7-10 working days
Payment Method:T/T, Paypal
 

RO3006 2-Layer 0.2mm PCB – 5mil Ultra-Thin Ceramic PTFE with Pure Gold Plating for RF & Bonding


1. Introduction to RO3006 2-Layer 0.2mm PCB

Rogers RO3006 laminates are ceramic-filled PTFE composites engineered to deliver exceptional electrical and mechanical stability for commercial microwave and RF applications. These advanced circuit materials maintain a stable dielectric constant (Dk) across temperature variations, effectively eliminating the step change in Dk that typically occurs with PTFE glass materials near room temperature. This superior stability makes RO3006 ideal for precision high-frequency applications where consistent performance is critical.


2. Key Features

Rogers RO3006 ceramic-filled PTFE composite material
Dielectric constant: 6.15 ± 0.15 at 10 GHz/23°C
Dissipation factor: 0.002 at 10 GHz/23°C
Thermal decomposition temperature: >500°C
Enhanced thermal conductivity: 0.79 W/m·k
Low moisture absorption: 0.02%
Coefficient of Thermal Expansion (-55 to 288°C): X-axis 17 ppm/°C, Y-axis 17 ppm/°C, Z-axis 24 ppm/°C


3. Benefits

Uniform mechanical properties across dielectric constant range
Ideal for multi-layer board designs with varying dielectric constants
Compatible with epoxy glass multi-layer board hybrid designs
Low in-plane expansion coefficient matched to copper
Enables reliable surface mounted assemblies
Excellent dimensional stability for temperature-sensitive applications
Volume manufacturing process for cost-effective production


RO3006 PCB


4. PCB Construction Details

Parameter Specification
Base MaterialRO3006
Layer Count2 layers
Board Dimensions20mm × 25mm
Min. Trace/Space5 mil / 9 mil
Min. Hole Size0.2 mm
Blind ViasNo
Finished Board Thickness0.2 mm
Finished Cu Weight1 oz (outer layers)
Via Plating Thickness20 μm
Surface FinishPure Gold (30 µ", for wire bonding)
Top/Bottom SilkscreenNo
Top/Bottom Solder MaskNo
Electrical Test100% tested prior to shipment

5. PCB Stackup (2-Layer Rigid Structure)

Copper_layer_1 - 35 μm
Rogers RO3006 - 5mil (0.127mm)
Copper_layer_2 - 35 μm


6. PCB Statistics:

Components: 3
Total Pads: 14
Thru Hole Pads: 10
Top SMT Pads: 4
Bottom SMT Pads: 0
Vias: 16
Nets: 2


7. Typical Applications

Automotive radar systems
Global positioning satellite antennas
Cellular telecommunications systems (power amplifiers and antennas)
Patch antennas for wireless communications
Direct broadcast satellites
Datalink on cable systems
Remote meter readers
Power backplanes


8. Quality Assurance

Artwork Format: Gerber RS-274-X
Accepted Standard: IPC-Class-2
Availability: Worldwide


 

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