Home > Newly Shipped PCB > RO3210 2-Layer 0.6mm High-Frequency PCB – 20mil Ceramic Woven Glass with Immersion Gold for Automotive Radar and 5G Base Stations

RO3210 2-Layer 0.6mm High-Frequency PCB
PCB Material:Rogers RO3210 / 0.6mm (20mil core)
MOQ:1PCS
Price:4.99-149 USD/PCS
Packaging:Vacuum / Anti-static Packaging
Delivery Period:7-10 working days
Payment Method:T/T, Paypal
 

RO3210 2-Layer 0.6mm High-Frequency PCB – 20mil Ceramic Woven Glass with Immersion Gold for Automotive Radar and 5G Base Stations


1. Introduction to RO3210 2-Layer 0.6mm PCB

Rogers' RO3210 high frequency circuit materials are ceramic-filled laminates reinforced with woven fiberglass, engineered to deliver exceptional electrical performance and mechanical stability with one distinguishing characteristic - significantly improved mechanical stability. RO3210 laminates uniquely combine the surface smoothness of non-woven PTFE laminates, enabling finer line etching tolerances, with the rigidity of woven-glass PTFE laminates. These advanced materials can be fabricated into printed circuit boards using standard PTFE circuit board processing techniques, making them both high-performing and practical for manufacturing.


2. Key Features

Dielectric constant: 10.2 ± 0.5
Dissipation factor: 0.0027 at 10GHz
Coefficient of thermal expansion matched to copper: X-axis 13 ppm/°C, Y-axis 13 ppm/°C, Z-axis 34 ppm/°C
High decomposition temperature: 500°C (TGA method)
Enhanced thermal conductivity: 0.81 W/m·K
Flammability rating: UL 94 V-0 standard


3. Benefits

Woven glass reinforcement improves rigidity for easier handling
Uniform electrical and mechanical performance ideal for complex multi-layer high frequency structures
Low in-plane expansion coefficient matched to copper enables reliable surface mounted assemblies
Suitable for use with epoxy multi-layer board hybrid designs
Excellent dimensional stability ensures high production yields
Superior surface smoothness allows for finer line etching tolerances


RO3210 PCB


4. PCB Construction Details

ParameterSpecification
Base MaterialRO3210
Layer Count2-layer
Board Dimensions54.5mm × 50mm (±0.15mm)
Min. Trace/Space5 mil / 8 mil
Min. Hole Size0.3 mm
Blind ViasNo
Finished Board Thickness0.6 mm
Finished Cu Weight1 oz (outer layers)
Via Plating Thickness20 μm
Surface FinishImmersion Gold
Top SilkscreenWhite
Bottom SilkscreenNo
Top Solder MaskBlue
Bottom Solder MaskNo
Electrical Test100% tested prior to shipment

5. PCB Stackup (2-Layer Rigid Structure)

Copper_layer_1 - 35 μm
Rogers RO3210 Core - 0.508 mm (20mil)
Copper_layer_2 - 35 μm


6. PCB Statistics:

Total Pads: 23
Thru Hole Pads: 15
Top SMT Pads: 8
Bottom SMT Pads: 0
Vias: 14
Nets: 2


7. Typical Applications

Automotive collision avoidance systems
Automotive global positioning satellite antennas
Wireless telecommunications systems
Microstrip patch antennas for wireless communications
Direct broadcast satellites
Datalink on cable systems
Remote meter readers
Power backplanes
LMDS and wireless broadband
Base station infrastructure


8. Quality Assurance

Artwork Format: Gerber RS-274-X
Accepted Standard: IPC-Class-2
Availability: Worldwide


 

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