RO3210 4-Layer 1.22mm High-Frequency PCB with ENIG Finish

1.Introduction

Rogers' RO3210 high-frequency circuit materials are ceramic-filled laminates reinforced with woven fiberglass. These materials are engineered to deliver outstanding electrical performance and mechanical stability, with a key distinguishing feature—improved mechanical rigidity.

RO3210 laminates combine the surface smoothness of non-woven PTFE laminates (enabling finer line etching tolerances) with the rigidity of woven-glass PTFE laminates. These materials can be fabricated into printed circuit boards using standard PTFE processing techniques, making them ideal for high-frequency, multi-layer applications.

2.Key Performance Features

Dielectric Constant (Dk): 10.2 ± 0.5
Dissipation Factor: 0.0027 @ 10GHz
Thermal Expansion Matched to Copper:
X/Y: 13 ppm/°C
Z: 34 ppm/°C
Decomposition Temperature (Td): 500°C (TGA)
Thermal Conductivity: 0.81 W/m·K
Flammability Rating: UL 94 V0

3.PCB Specifications at a Glance

4.PCB Stackup: 4-layer rigid PCB

5.PCB Statistics:

Components: 12
Total Pads: 38
Thru Hole Pads: 28
Top SMT Pads: 10
Bottom SMT Pads: 0
Vias: 32
Nets: 2

6.Typical Applications

Automotive collision avoidance systems
Automotive global positions satellite antennas
Wireless telecommunications systems
Microstrip patch antennas for wireless communications
Direct broadcast satellites
Datalink on cable systems
Remote meter readers
Power backplanes
LMDS and wireless broadband
Base station infrastructure

7.Quality Assurance

IPC-Class 2 compliant
100% electrical tested
Global availability
Gerber RS-274X support