Home > Newly Shipped PCB > RO4350B and S1000-2M High-Performance PCB Design – Ideal for RF, Radar, and Millimeter-Wave Applications

RO4350B S1000-2M Hybrid PCB
PCB Material:RO4350B + S1000-2M / 1.6mm
MOQ:1PCS
Price:32.99-149 USD/PCS
Packaging:Vacuum / Anti-static Packaging
Delivery Period:10-18 working days
Payment Method:T/T, Paypal
 

RO4350B and S1000-2M High-Performance PCB Design – Ideal for RF, Radar, and Millimeter-Wave Applications


1. Introduction of RO4350B

Rogers RO4350B materials are proprietary woven glass-reinforced hydrocarbon/ceramics that offer electrical performance comparable to PTFE/woven glass while maintaining the manufacturability of epoxy/glass. RO4350B laminates provide precise control over dielectric constant (Dk) and low loss, utilizing standard epoxy/glass processing methods. They are cost-effective compared to conventional microwave laminates and do not require special handling procedures. These materials are UL 94 V-0 rated, suitable for high power RF designs.


The thermal coefficient of expansion (CTE) of RO4350B is similar to copper, ensuring excellent dimensional stability crucial for mixed dielectric multi-layer board constructions. The low Z-axis CTE guarantees reliable plated through-hole quality, even under severe thermal shock. The material has a Tg of >280°C (536°F), ensuring stable expansion characteristics throughout circuit processing temperatures.


2.Key Features:

(1).Features of RO4350B

Dielectric Constant of DK 3.48 ±0.05 at 10GHz/23°C
Dissipation Factor of 0.0037 at 10GHz/23°C
Thermal Conductivity: 0.69 W/m/°KB
X-axis CTE: 10 ppm/°C, Y-axis CTE: 12 ppm/°C, Z-axis CTE: 32 ppm/°C
High Tg value of >280°C
Low water absorption: 0.06%


Hybrid PCB 10mil RO4350B and S1000-2M 4-layer 1.6mm Thick


(2).Features of S1000-2M

Lower Z-axis CTE for improved through-hole reliability
Excellent mechanical processability and thermal resistance
Lead-free compatible
Tg180°C (DSC), UV blocking/AOI compatible
High heat resistance
Excellent anti-CAF performance
Low water absorption


3.PCB Stackup: 4-layer rigid PCB

SpecificationDetails
Copper Layer 135 µm
RO4350B0.254 mm (10 mil)
Copper Layer 235 µm
Prepreg1080 RC63% 0.0644 mm (2.5 mil)
Copper Layer 335 µm
S1000-2M1.1 mm (43 mil)
Copper Layer 435 µm

4.PCB Construction Details

SpecificationDetails
Board Dimensions90 mm x 95 mm, +/- 0.15 mm
Minimum Trace/Space5/4 mils
Minimum Hole Size0.35 mm
Blind ViasNone
Finished Board Thickness1.6 mm
Finished Cu Weight1 oz (1.4 mils) inner/outer layers
Via Plating Thickness20 µm
Surface FinishElectroless Nickel Immersion Gold (ENIG)
Top SilkscreenWhite
Bottom SilkscreenNo
Top Solder MaskGreen
Bottom Solder MaskNo
Impedance Control50 ohm on 5 mil / 9 mil traces/gaps (top layer)
Edge PlatedYes, for designated area
Via Filling0.35 mm via filled and capped
Electrical Testing100% electrical test conducted prior to shipment

5.PCB Statistics

Components: 33
Total Pads: 242
Thru Hole Pads: 125
Top SMT Pads: 117
Bottom SMT Pads: 0
Vias: 49
Nets: 3


6.Accepted Standards

Artwork Format: Gerber RS-274-X
Quality Standard: IPC-Class-2 compliant
Availability: Worldwide production and shipping


7.Typical Applications

Commercial airline broadband antennas
Microstrip and stripline circuits
Millimeter wave applications
Radar systems
Guidance systems
Point-to-point digital radio antennas


 

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