RO4535 PCB 2-Layer 20mil High-Frequency Laminates for Antenna and Mobile Infrastructure Applications

1.Introduction of RO4535

RO4535 High Frequency Laminates are cost-effective performance materials developed by Rogers Corporation to address the specific needs of the antenna market.

These laminates expand on the capabilities of the successful RO4000 series, offering a ceramic-filled, glass-reinforced hydrocarbon material that ensures a controlled dielectric constant, low loss performance, and excellent passive intermodulation response, making them ideal for mobile infrastructure microstrip antenna applications.

RO4535 laminates are fully compatible with standard FR-4 and high-temperature lead-free solder processing. Unlike traditional PTFE-based laminates, they do not require special treatments for plated through-hole preparation. This product presents an affordable alternative to conventional PTFE antenna technologies, enabling designers to optimize both cost and performance for their antennas. Additionally, RO4535 laminates are available with Rogers' RoHS-compliant flame-retardant technology for applications that necessitate UL94 V-0 certification.

2.Feature

Dielectric Constant of DK 3.44 +/-0.08 at 10 GHz/23°C
Dissipation Factor of 0.0037 at 10 GHz/23°C
Thermal Conductivity of 0.6 W/m·K
X-axis CTE of 16 ppm/°C, Y-axis CTE of 17 ppm/°C, Z-axis CTE of 50 ppm/°C
High Tg value of >280 °C
Low moisture absorption of 0.09%
UL-94 V0 rated

3. Benefits

Exceptional passive intermodulation (PIM) performance with LoPro copper foil
Enhanced mechanical rigidity compared to PTFE
CTE similar to that of copper, minimizing stress in PCB antennas

4.PCB Stackup: 2-layer rigid PCB
Copper layer1: 35 µm
Rogers RO4535 Core: 0.508mm (20 mil)
Copper layer2: 35 µm

5.PCB Construction Detail

Board dimensions: 53 mm x 53 mm = 1 PCS, +/- 0.15 mm
Minimum Trace/Space: 4/4 mils
Minimum Hole Size: 0.3 mm
No blind vias.
Finished board thickness: 0.6 mm
Finished copper weight: 1 oz (1.4 mils) on outer layers
Via plating thickness: 20 µm
Surface finish: Immersion Gold
Top Silkscreen: White
Bottom Silkscreen: None
Top Solder Mask: Green
Bottom Solder Mask: Green
100% electrical testing conducted prior to shipment

6.PCB Statistics
Components: 11
Total Pads: 22
Through Hole Pads: 12
Top SMT Pads: 10
Bottom SMT Pads: 0
Vias: 17
Nets: 2

7.Type of Artwork Supplied:
Gerber RS-274-X

8.Quality Standard:
IPC-Class-2

9. Availability:
Worldwide

10. Some Typical Applications

Antennas for cellular infrastructure base stations