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RT/duroid 6002 2-Layer 10mil Immersion Silver PCB
PCB Material:Rogers RT/duroid 6002 / 0.37mm (10mil core)
MOQ:1PCS
Price:4.99-149 USD/PCS
Packaging:Vacuum / Anti-static Packaging
Delivery Period:7-10 working days
Payment Method:T/T, Paypal
 

RT/duroid 6002 2-Layer 10mil Immersion Silver PCB for Microwave Applications


1. Introduction

Rogers RT/duroid 6002 laminates are ceramic-filled PTFE microwave materials with low dielectric constant for use in complex microwave structures. They are also low loss materials that provide excellent high frequency performance. Offering excellent mechanical and electrical properties, these materials are reliable for use in multi-layer board constructions.


2. Key Features

Low Dielectric Constant: 2.94 ±0.04
Excellent Thermal Stability: Thermal coefficient of Dk at 12 ppm/°C
Ultra-Low Loss: Dissipation factor of 0.0012 at 10GHz
High Temperature Resistance: Td 500°C TGA
Effective Thermal Management: Thermal conductivity of 0.6 W/m/k
Dimensional Stability: Low Z-axis CTE at 24 ppm/°C
Moisture Resistance: Moisture absorption of 0.02%


3. Benefits

Superior High-Frequency Performance: Low loss for excellent high frequency performance
Precision Manufacturing: Tight thickness control
Thermal Reliability: In-plane expansion coefficient matched to copper; ideal for temperature-sensitive applications
Space-Qualified: Low out-gassing; ideal for space applications
Stable Performance: Excellent dimensional stability
Robust Construction: Excellent mechanical and electrical properties; reliable multi-layer board constructions


RT/duroid 6002 PCB


4. PCB Construction Details

ParameterSpecification
Base MaterialRT/duroid 6002
Layer Count2 layers
Board Dimensions68mm × 52mm = 1PC
Minimum Trace/Space5/5 mils
Minimum Hole Size0.25mm
Blind ViasNo
Finished Board Thickness0.37mm
Finished Cu Weight1oz (1.4 mils) outer layers
Via Plating Thickness20 μm
Surface FinishImmersion silver
Top SilkscreenNo
Bottom SilkscreenNo
Top Solder MaskNo
Bottom Solder MaskNo
Electrical Test100% tested prior to shipment

5. PCB Stackup (2-Layer Rigid Structure)

Copper_layer_1 - 35 μm
Rogers RT/duroid 6002 Substrate - 10mil (0.254mm)
Copper_layer_2 - 35 μm


6. PCB Statistics:

Components: 12
Total Pads: 34
Thru Hole Pads: 16
Top SMT Pads: 18
Bottom SMT Pads: 0
Vias: 21
Nets: 2


7. Typical Applications

Phased Array Antennas
Ground Based and Airborne Radar Systems
Global Positioning System Antennas
Power Backplanes
Commercial Airline Collision Avoidance
Beam Forming Networks


8. Quality Assurance

Artwork Format: Gerber RS-274-X
Accepted Standard: IPC-Class-2
Availability: Worldwide


 

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