Rigid Polyimide 4-Layer PCB 1.8mm Thick with HASL Lead-Free Finish for High-Temperature Applications1.Introduction to Rigid Polyimide Material Polyimide is a high-performance polymer known for its outstanding thermal stability, mechanical strength, and electrical insulation. It maintains exceptional peel strength (1.42 N/mm after thermal stress, 1.13 N/mm after process exposure) and superior electrical properties (volume resistivity: 6.6×10⁶ MΩ·cm under C-96/35/90 conditions). With a dielectric constant of 4.12 and dissipation factor of 0.0072 at 1MHz, polyimide excels in high-frequency applications. Its moisture resistance (0.11% absorption), high dielectric strength (44.3 kV), and thermal resilience (no delamination at 288°C, Tg 257°C) make it indispensable for aerospace, military, and high-temperature environments. 2.Key Features Thermal Stability: Tg of 257°C, withstands 288°C thermal stress. 3.Benefits Reliability: Maintains performance in extreme temperatures and harsh conditions
4.PCB Construction Details
5.PCB Stackup (4-Layer Rigid Structure) Copper layer 1 - 35 μm 6.PCB Statistics: Components: 68 7.Typical Applications Aerospace and aviation electronics 8.Quality Assurance IPC-Class 2 compliant |
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