Rogers TMM10 1-Layer 60mil OSP PCB – High Frequency Microwave Applications

1. Introduction to Rogers TMM10 PCB

TMM® 10 thermoset microwave materials offer the benefits of both PTFE and ceramic based substrates, but are not limited by the same mechanical properties and production techniques. TMM10 laminates combine many of the desirable features of ceramic substrates with the ease of soft substrate processing techniques.

TMM10 laminates have an exceptionally low thermal coefficient of dielectric constant, typically less than 30 ppm/°C. The material's isotropic coefficients of thermal expansion, very closely matched to copper, allow for production of high reliability plated through holes, and low etch shrinkage values. This 1-layer (single-sided) rigid PCB is constructed entirely with TMM10 as the core material, making it ideal for chip testers, dielectric polarizers, satellite communication, and GPS antenna applications.

2. Key Features of Rogers TMM10 PCB

• Dielectric Constant (Dk): 9.20 ± 0.230 at 10 GHz

• Dissipation Factor: 0.0022 at 10 GHz

• Thermal coefficient of Dk: -38 ppm/°K

• CTE matched to copper (21/21/20 ppm/K)

• Decomposition Temperature (Td): 425 °C TGA

• Thermal Conductivity: 0.76 W/m/K

• Mechanical properties resist creep and cold flow

• Resistant to process chemicals, reducing damage during fabrication

• Material does not require sodium napthanate treatment prior to electroless plating

• Based on thermoset resin, allowing for reliable wire-bonding

3. Benefits of Rogers TMM10 PCB

• Combines benefits of ceramic and PTFE substrates without specialized production techniques

• Exceptional Dk uniformity (9.20 ± 0.23) for consistent impedance control

• Low dissipation factor (0.0022) ensures high performance at microwave frequencies

• CTE matched to copper enables high reliability plated through holes

• High thermal conductivity (0.76 W/m/K) facilitates heat removal

• Thermoset resin does not soften when heated, preventing pad lifting during wire bonding

• Resistant to etchants and solvents used in PCB production

• Can replace alumina substrates in many applications

4. PCB Construction Details

5. PCB Stackup (1-Layer Rigid Structure)

6. PCB Statistics

7. Rogers TMM10 Material – Product Introduction

TMM® thermoset microwave materials are ceramic, hydrocarbon, thermoset polymer composites designed for high plated-thru-hole reliability stripline and microstrip applications. TMM laminates are available in a wide range of dielectric constants and claddings.

The electrical and mechanical properties of TMM laminates combine many of the benefits of both ceramic and traditional PTFE microwave circuit laminates, without requiring the specialized production techniques common to these materials. TMM laminates do not require a sodium napthanate treatment prior to electroless plating.

TMM laminates are based on thermoset resins, and do not soften when heated. As a result, wire bonding of component leads to circuit traces can be performed without concerns of pad lifting or substrate deformation. TMM laminates combine many of the desirable features of ceramic substrates with the ease of soft substrate processing techniques.

8. Features and Benefits Summary

9. TMM10 Typical Properties (Data Sheet)

10. Primary Application Areas

• Chip testers

• Dielectric polarizers and lenses

• Satellite communication systems

• GPS antennas and patch antennas

• RF and microwave circuitry

• Power amplifiers and combiners

• Filters and couplers

11. Quality Assurance

• Type of artwork supplied: Gerber RS-274-X

• Accepted standard: IPC-Class-2

• Availability: Worldwide

• 100% Electrical test prior to shipment

12. Standard Thicknesses, Panel Sizes & Claddings