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TC600 High-Thermal PCB
PCB Material:TC600 / 1.6mm
MOQ:1PCS
Price:7.99-99 USD/PCS
Packaging:Vacuum / Anti-static Packaging
Delivery Period:7-12 working days
Payment Method:T/T, Paypal
 

TC600 High-Thermal-Conductivity PCB with Immersion Gold Finish


1.Product Overview

Rogers TC600 is a premium PTFE-based composite laminate engineered with thermally conductive ceramic fillers and woven glass reinforcement. Designed for high-power RF applications, this material delivers best-in-class thermal conductivity (1.1 W/mK) while maintaining excellent dielectric stability (Dk=6.15). The 2-layer construction features 1oz copper layers and immersion gold finish, making it ideal for compact power amplifiers, microwave combiners, and avionics systems.


2.Key Material Properties

High Dielectric Constant: 6.15 (stable from 1.8MHz to 10GHz)
Ultra-Low Loss: 0.0017-0.0020 dissipation factor
Superior Thermal Management: 1.1 W/mK conductivity
Temperature Stable: -75 ppm/°C ΔDk (-40°C to 140°C)
Moisture Resistant: 0.03% absorption
CTE Matched: 9/9/35 ppm/°C (X/Y/Z)


3.PCB Construction Details

SpecificationDetails
Base MaterialTC600
Layer Configuration Double Sided
Board Dimensions 76mm × 57mm (4 variants)
Dimensional Tolerance ±0.15mm
Minimum Trace/Space 4/5 mils
Minimum Hole Size 0.3mm
Via Type Through-hole only (No Blind)
Finished Board Thickness 1.6mm
Copper Weight (Outer Layers) 1oz (35μm total)
Via Plating Thickness 20μm
Surface FinishImmersion Gold
Silkscreen (Top/Bottom) None / None
Solder Mask (Top/Bottom) None / None
Quality Assurance 100% Electrical Tested


4.PCB Stackup: 2-layer rigid PCB

Copper layer 1 - 18 μm + 17μm plating
TC600 - 1.524 mm (60mil)
Copper layer 2 - 18 μm + 17μm plating


5.Board Statistics

Components: 24
Total Pads: 141
Thru Hole Pads: 65
Top SMT Pads: 76
Bottom SMT Pads: 0
Vias: 101
Nets: 2


6.Manufacturing & Quality Standards

Artwork Format: Gerber RS-274-X
Quality Standard: IPC-Class 2
Availability: Worldwide shipping


7.Technical Advantages

Thermal Performance: Reduces hot spots by 25-30% compared to standard materials
Size Reduction: Enables 20% smaller PCB footprints versus lower Dk substrates
Frequency Stability: <1% Dk variation across operating temperatures
Reliability: Matches CTE of active components for durable solder joints


8.Target Applications

Microwave Combiner and Power Divider Boards in Avionics Applications
Small Footprint Antennas
Digital Audio Broadcasting (DAB) Antennas (Satellite Radio)
GPS & Hand-held RFID Reader Antennas


 

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