TP600 2-Layer 5.1mm Thick PCB – High-Frequency Thermoplastic ENIG Board for RF Applications

1. Introduction to TP600 2-Layer 5.1mm Thick PCB

TP material is a unique high-frequency thermoplastic in the industry. The dielectric layer of TP-type laminates consists of ceramics and polyphenylene oxide (PPO) resin, without fiberglass reinforcement. The dielectric constant can be precisely adjusted by varying the ratio between ceramics and PPO resin. The production process is specialized, offering excellent dielectric performance and high reliability. TP denotes the smooth surface material without copper cladding, TP-1 indicates single-sided cladding, and TP-2 refers to double-sided cladding. The dielectric constant can be customized between 3 and 25 according to circuit requirements, with common values including 3.0, 4.4, 6.0, 6.15, 9.2, 9.6, 9.8, 10.2, 11, 16, and 20.

2. Key Features

Dielectric constant (Dk) of 6.0 ± 0.12 at 10GHz
Low dissipation factor of 0.0010 at 10GHz
Low TCDK: -50 ppm/°C (-55°C to 150°C)
CTE: x-axis 50 ppm/°C, y-axis 50 ppm/°C, z-axis 60 ppm/°C (-55°C to 150°C)
Thermal conductivity: 0.55 W/m·K
Moisture absorption: 0.01%
UL 94-V0 rated

3. Benefits

Customizable dielectric constant (3–25)
No fiberglass reinforcement for smooth surface and consistent Dk
Suitable for high-frequency and high-reliability applications
Good thermal and mechanical stability

4. PCB Construction Details

5. PCB Stackup (2-Layer Rigid Structure)

Copper_layer_1 - 35 μm
TP600 Core - 5.08 mm (200mil)
Copper_layer_2 - 35 μm

6. PCB Statistics:

Components: 4
Total Pads: 16
Thru Hole Pads: 10
Top SMT Pads: 6
Bottom SMT Pads: 0
Vias: 9
Nets: 2

7. Typical Applications

Global Satellite Navigation Systems
Missile-borne systems
Fuze technology
Miniaturized antennas

8. Quality Assurance

Artwork Format: Gerber RS-274-X
Accepted Standard: IPC-Class-2
Availability: Worldwide