TP980 High-Frequency PCB with 7.62mm Thick Core and ENIG Finish for Aerospace Applications

1.Product Introduction: Revolutionary Thermoplastic RF Material

The TP980 represents a breakthrough in high-frequency circuit materials, utilizing a proprietary ceramic-polyphenylene oxide (PPO) composite without traditional fiberglass reinforcement. This innovative thermoplastic formulation enables precise dielectric constant adjustment from 3.0 to 25 through ceramic/PPO ratio control, with the TP980 variant optimized at 9.8±0.2 Dk. Unlike conventional laminates, the TP series offers three configurations: bare substrate (TP), single-clad (TP-1), and double-clad (TP-2) versions for design flexibility.

2.Key Material Properties (TP980)

Precision Dielectric Constant: 9.8±0.2 @10GHz (adjustable 3.0-25 range)
Ultra-Low Signal Loss: 0.0012 dissipation factor @10GHz
Temperature Stability: -40 ppm/°C ΔDk (-55°C to 150°C)
Thermal Management: 0.65 W/mK conductivity

3.PCB Construction Details

4.PCB Stackup: 2-layer rigid PCB

Copper layer 1 - 35 μm
TP980 Core - 7.62 mm (300mil)
Copper layer 2 - 35 μm

5.Board Statistics

Components: 10
Total Pads: 31
Thru Hole Pads: 21
Top SMT Pads: 10
Bottom SMT Pads: 0
Vias: 22
Nets: 2

6.Manufacturing & Quality Standards

Artwork Format: Gerber RS-274-X
Quality Standard: IPC-Class 2
Availability: Worldwide shipping

7.Technical Advantages

Fiberglass-Free Design: Eliminates weave effect for consistent RF performance
Military-Grade Reliability: Withstands extreme thermal cycling
Manufacturing Flexibility: Compatible with standard PCB processes
Custom Dk Options: Available in 11 standard variants (TP300-TP980)

8.Target Applications

Global Satellite Navigation System
Missile-borne electronics
Fuze technology
Miniaturized antenna