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Newly Shipped PCB |
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| Welcome to our "Newly Shipped PCB" column, where we unveil the latest creations fresh off the manufacturing line! Join us as we showcase the cutting-edge printed circuit boards that have just been dispatched to our valued clients. From innovative designs to high-quality craftsmanship, each PCB represents a culmination of precision engineering and technological excellence. Get a glimpse into the world of newly shipped PCBs, where every board tells a unique story of dedication, expertise, and forward-thinking solutions. Stay tuned to discover the diversity, complexity, and beauty of the PCBs that are setting new standards in the industry. Let's celebrate the arrival of these exceptional PCBs together! |
Newly Shipped PCB List
ISOLA 370HR PCB - 6-Layer High-Performance FR-4 PCB with ENIG Finish
December 8, 2024
ISOLA 370HR laminates and prepregs, developed by Polyclad, utilize a patented high-performance epoxy resin system with a glass transition temperature (Tg) of 180°C.
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F4BM300 High Frequency PCB - 2-Layer Rigid PCB with Immersion Tin Finish
December 9, 2024
Wangling's F4BM300 laminates are expertly crafted through a precise formulation and rigorous pressing of fiberglass cloth, polytetrafluoroethylene (PTFE) resin, and PTFE film.
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F4BTSM615 High Frequency PCB - 2-Layer Rigid PCB with HASL Finish
December 10, 2024
The F4BTSM series represents an advanced iteration of the F4BTM series, featuring significant innovations in material formulation and manufacturing techniques.
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IT-180A High-Performance PCB - 4-Layer Rigid PCB with Immersion Gold Finish
December 11, 2024
IT-180ATC is a high-performance multifunctional filled epoxy with a glass transition temperature (Tg) of 175°C, as determined by DSC.
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RF-60TC High Frequency PCB - 2-Layer Rigid PCB with Immersion Gold Finish
December 12, 2024
RF-60TC is a high-frequency material that features excellent thermal conductivity, combining ceramic-filled, glass-reinforced PTFE laminate for high-power RF and microwave applications.
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RO3003 PCB 4-Layer 2.4mm Thick: High-Frequency Ceramic-Filled PTFE Laminates for Automotive Radar and 5G mmWave Applications
December 13, 2024
Rogers RO3003 high-frequency laminates are ceramic-filled PTFE composites designed for commercial microwave and RF applications.
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RO3006 PCB 2-Layer 5mil: High-Frequency Ceramic-Filled PTFE Laminates for Automotive Radar and Wireless Communication Systems
December 14, 2024
Rogers RO3006 laminates are ceramic-filled PTFE composites engineered to deliver outstanding electrical and mechanical stability for commercial microwave and RF applications.
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RO4003C PCB 2-Layer 8mil Cost-Effective Solution for Cellular Base Stations and Automotive Sensors
December 15, 2024
RO4003C PCB 2-Layer 8mil: High-frequency laminates with stable dielectric constant, low loss, and cost-effective fabrication. Ideal for automotive radar, RF identification, and cellular base stations.
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RO4350B PCB 2-Layer 13.3mil Low Loss Hydrocarbon/Ceramic Material for Multilayer Board Designs
December 16, 2024
RO4350B PCB 2-Layer 13.3mil: High-frequency laminates with stable dielectric constant, low loss, and cost-effective fabrication. Ideal for automotive radar, RF identification, and cellular base stations.
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RO4535 PCB 2-Layer 20mil High-Frequency Laminates for Antenna and Mobile Infrastructure Applications
December 17, 2024
RO4535 PCB 2-Layer 20mil High-frequency laminates with stable dielectric constant, low loss, and excellent PIM performance. Designed for cellular base station antennas and mobile infrastructure applications.
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RT/Duroid 5880 PCB 2-Layer 15mil High-Frequency PTFE Laminates for Microstrip and Stripline Circuits
December 18, 2024
RT/Duroid 5880 PCB 2-Layer 15mil High-frequency PTFE laminates with uniform dielectric properties and low dissipation factor. Ideal for microstrip circuits, radar systems, and millimeter wave applications.
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RT/Duroid 6035HTC PCB 2-Layer 10mil High Thermal Conductivity Laminates for High-Power RF Applications
December 19, 2024
RT/Duroid 6035HTC PCB 2-Layer 10mil High thermal conductivity laminates for high-power RF and microwave applications. Ideal for amplifiers, filters, and power dividers with low insertion loss and excellent thermal stability.
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TFA294 PCB 2-Layer 0.127mm Thick High-Frequency PTFE Ceramic Composites for Aerospace Applications
December 20, 2024
TFA294 PCB 2-Layer 0.127mm Thick High-frequency PTFE ceramic composites with low loss and stable dielectric properties. Designed for aerospace, microwave antennas, and phased array systems.
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TLX-8 PCB 2-layer 30mil
December 21, 2024
TLX-8 is a type of PTFE fiberglass laminate designed for high-volume antenna applications, delivering reliability across various RF uses.
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TU-768 PCB 2-Layer 1.6mm Thick High-Performance Epoxy Laminates for Consumer Electronics
December 22, 2024
TU-768 PCB 2-Layer 1.6mm Thick High-performance epoxy laminates with UV-blocking and anti-CAF properties. Ideal for consumer electronics, automotive applications, and servers.
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12-layer Through Holes PCB 1.6mm IT-180 Impedance Matt Red
January 2 , 2025
IT-180ATC is a high Tg (175°C by DSC) multifunctional filled epoxy, known for its high thermal reliability and CAF resistance.
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CuClad 250 PCB 2-Layer 20mil High-Frequency PTFE Laminates for Radar and Microwave Components
January 3, 2025
CuClad 250 PCB 2-Layer 20mil High-frequency PTFE laminates with low dielectric constant and excellent dimensional stability. Ideal for radar, microwave components, and electronic countermeasures.
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F4B TSM233 PCB 2-Layer 40mil Low Loss Material for Microwave and Phased Array Antennas
January 8, 2025
F4BTSM233 PCB 2-Layer 40mil High-performance ceramic-filled PTFE laminates with low loss and stable dielectric properties. Designed for aerospace, radar systems, and satellite communications.
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F4B TSM1000 PCB 2-Layer 6.35mm Thick High Thermal Conductivity for Aerospace and RF Feed Networks
January 10, 2025
F4BTSM1000 PCB 2-Layer 6.35mm Thick High-performance ceramic-filled PTFE laminates with low loss and stable dielectric properties. Designed for aerospace, radar systems, and satellite communications.
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HDI Hybrid PCB 8-Layer 1.5mm RO4003C S1000-2M Advanced Impedance Control for RF and Microwave Circuits
January 11, 2025
HDI Hybrid PCB 8-Layer 1.5mm RO4003C S1000-2M High-performance hybrid PCB with low loss and advanced impedance control. Ideal for cellular base stations, automotive radar, and RF identification applications.
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Hybrid PCB on RO4003C and S1000-2M 6-Layer 1.1mm Thick Low Loss Material for Microstrip and Stripline Circuits
January 12, 2025
Hybrid PCB on RO4003C and S1000-2M 6-Layer 1.1mm Thick High-performance hybrid PCB with low loss and advanced impedance control. Ideal for radar systems, millimeter wave applications, and microstrip circuits.
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IsoClad 933 PCB 2-Layer 31mil High-Frequency PTFE Laminates for Conformal Antennas and Radar Systems
January 13, 2025
IsoClad 933 PCB 2-Layer 31mil High-frequency PTFE laminates with low loss and excellent dimensional stability. Ideal for conformal antennas, radar systems, and stripline circuits.
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RF-10 PCB 2-Layer 125mil High Dielectric Constant Laminates for Microstrip Patch Antennas
January 14, 2025
RF-10 PCB 2-Layer 125mil High dielectric constant laminates with low loss and excellent thermal conductivity. Ideal for microstrip patch antennas, GPS antennas, and satellite components.
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RO3203 PCB 4-Layer 0.6mm Thick High-Frequency Ceramic-Filled Laminates for Automotive and Wireless Systems
January 17, 2025
RO3203 PCB 4-Layer 0.6mm Thick High-frequency ceramic-filled laminates with low loss and excellent dimensional stability. Ideal for automotive systems, wireless telecommunications, and microstrip patch antennas.
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RO4003C Multilayer PCB 4-Layer 4.8mm Thick Low Loss Material for Microstrip and Stripline Circuits
January 18, 2025
RO4003C Multilayer PCB 4-Layer 4.8mm Thick High-frequency laminates with low loss and excellent dimensional stability. Ideal for radar systems, millimeter-wave applications, and microstrip circuits.
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RO4350B PCB 4-Layer 1.8mm High-Frequency Laminates for Cellular Base Station Antennas
January 19, 2025
RO4350B PCB 4-Layer 1.8mm High-frequency laminates with low loss and excellent dimensional stability. Ideal for cellular base station antennas, RF identification tags, and automotive radar systems.
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RO4830 PCB 2-Layer 9.4mil Low Loss Material for Millimeter-Wave Applications
January 20, 2025
RO4830 PCB 2-Layer 9.4mil High-frequency laminates with low insertion loss and excellent performance for 76-81 GHz automotive radar sensors. Ideal for millimeter-wave applications and cost-sensitive designs.
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RT/duroid 5880 PCB 2-layer 10mil Copper Filled Via
January 21, 2025
Rogers RT/duroid 5880 high-frequency laminates are advanced PTFE composites reinforced with glass microfibers, specifically designed for precision stripline and microstrip circuit applications.
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TLY-5 High Frequency PCB - 20mil (0.508mm) Double Layer Rigid PCB with Immersion Gold Finish
January 22, 2025
TLY-5 laminates are crafted from lightweight woven fiberglass, offering superior dimensional stability compared to chopped fiber-reinforced PTFE composites.
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WL-CT338 PCB 2-Layer 30mil High-Frequency Laminates for Base Station and Satellite Antennas
January 24, 2025
WL-CT338 PCB 2-Layer 30mil High-frequency laminates with low loss and excellent thermal stability. Ideal for base station antennas, automotive radar, and power amplifiers.
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AL₂O₃(96%) Ceramic PCB - Double-Layer Board, 1mm Thickness, Immersion Gold
February 7, 2025
AL₂O₃ Ceramic PCB, double-layer board, 1mm thickness, immersion gold, high-temperature resistance, aerospace applications, automotive electronics, IoT devices, RF circuits.
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SF490 PET Transparent Flexible Copper Clad Laminate (FCCL) – Halogen-Free, High Transparency, and High Flexibility for Advanced Electronics
February 9, 2025
The SF490 PET Transparent Flexible Copper Clad Laminate (FCCL) – Halogen-free, high transparency, and high flexibility for advanced electronics. Ideal for flexible displays, touch panels, and wearable devices.
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Rogers RT/duroid 6035HTC High-Frequency PCB – High Thermal Conductivity for High-Power RF and Microwave Applications
February 12, 2025
Explore the Rogers RT/duroid 6035HTC High-Frequency PCB, featuring high thermal conductivity and low dielectric constant for high-power RF and microwave applications. Ideal for power amplifiers, RF systems, and more.
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Rogers RO4350B High-Frequency PCB – Cost-Effective Solution for RF and Microwave Applications
February 13, 2025
Explore the Rogers RO4350B High-Frequency PCB, featuring low dielectric constant and cost-effective manufacturing for RF and microwave applications. Ideal for cellular base stations, automotive radar, and more.
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RO4003C High-Frequency PCB – Rogers RO4003C Laminates for High-Performance RF Applications
February 14, 2025
Upgrade your RF PCB designs with Rogers RO4003C laminates – DK 3.38, low loss, and high-performance. Ideal for cellular base stations, automotive radar, and RFID tags. Cost-effective fabrication, excellent dimensional stability, and easy manufacturability.
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RO3210 High-Frequency PCB – Rogers RO3210 Laminates for High-Performance RF Applications
February 17, 2025
Upgrade your RF PCB designs with Rogers RO3210 laminates – DK 10.2, low loss, and high-performance. Ideal for automotive radar, wireless telecommunications, and satellite applications. Excellent dimensional stability, matched CTE to copper, and easy manufacturability.
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RO3003 PCB – 4-Layer 1.6mm Thick High-Frequency PCB for Automotive Radar and 5G Applications
February 18, 2025
Upgrade your RF PCB designs with Rogers RO3003 laminates – 4-layer 1.6mm thick PCB, Dk 3.0, and low dielectric loss. Ideal for automotive radar, 5G infrastructure, and wireless communications. Stable Dk over temperature, excellent mechanical properties, and cost-effective manufacturing.
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Polyimide 25µm FPC – 2-Layer 0.24mm Thick Flexible PCB with Immersion Gold for High-Frequency Applications
February 19, 2025
Upgrade your flexible PCB designs with Polyimide 25µm FPC – 2-layer 0.24mm thick, immersion gold finish, and high-frequency performance. Ideal for foldable phones, wearable devices, and automotive electronics. Low dielectric loss, excellent flexibility, and harsh environment resistance.
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Panasonic Megtron6 (M6) R-5775 PCB – High-Speed, Low-Loss Multilayer PCB for 5G, Automotive, and High-Performance Computing
February 20, 2025
Discover Megtron6 (M6) R-5775, a high-speed, low-loss multilayer laminate designed for high-frequency applications such as 5G communications and high-performance computing. With exceptional thermal reliability and eco-friendly compliance, M6 meets the rigorous demands of modern electronic devices.
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RO4350B and S1000-2M High-Performance PCB Design – Ideal for RF, Radar, and Millimeter-Wave Applications
February 21, 2025
Explore the Hybrid 4-Layer PCB built with RO4350B and S1000-2M, ideal for high-frequency applications like radar systems, antennas, and millimeter-wave circuits. Featuring low loss, high thermal stability, and precise impedance control.
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HDI PCB – 8-Layer 1.5mm Thick with TU-883 Material for High-Speed, Low-Loss Applications
February 22, 2025
Upgrade your high-speed PCB designs with TU-883 HDI PCBs – 8-layer 1.5mm thick, low-loss, and impedance-controlled. Ideal for RF, telecom, and high-performance computing. Low Dk/Df, anti-CAF capability, and ENEPIG surface finish.
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FR408HR High-Performance 4-Layer PCB Specifications for Enhanced Reliability
February 24, 2025
Discover the specifications and features of the high-performance 4-layer FR408HR PCB designed for high-speed digital applications, ensuring superior reliability and efficiency.
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F4B TSM1000 PCB: High-Reliability Material for Aerospace Applications
February 25, 2025
Explore the advanced features of the F4B TSM1000 PCB, a high-reliability material designed for aerospace applications. Learn about its specifications, construction details, and typical uses.
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F4B TSM220 PCB – 2-Layer 250mil (6.35mm) Thick for Aerospace and RF Applications
February 26, 2025
Upgrade your high-frequency PCB designs with F4BTSM220 – 2-layer 250mil (6.35mm) thick, ultra-low loss, and aerospace-grade reliability. Ideal for radar, satellite communications, and phased array antennas. Dk 2.2, Df 0.0009, and pure gold surface finish.
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10oz Heavy Copper TU-865 PCB – Double-Sided 3.0mm Thick for Harsh Environments
February 27, 2025
Upgrade your high-power PCB designs with TU-865 Heavy Copper PCB – double-sided 3.0mm thick, 10oz copper layers, and ENIG surface finish. Ideal for automotive, telecom, and harsh environment applications. Dk 4.4, anti-CAF capability, and halogen-free materials.
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18-Layer PCB with Premium RO4350B and RO4450F for Superior High-Frequency Performance
February 28, 2025
High-performance 18-layer PCB made with RO4350B and RO4450F materials, 3.2 mm thick, ideal for high-frequency applications like cellular base stations and automotive radar.
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F4BM220 High-Performance 2-Layer PCB for Microwave and RF Applications
March 1, 2025
The F4BM220 2-layer PCB is optimized for RF and microwave applications. It offers low dielectric loss and high insulation resistance, making it suitable for phase shifters and power dividers.
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F4BTSM430 2-Layer PCB: High-Performance Construction for Aerospace Applications
March 3, 2025
Discover the F4BTSM430 2-layer PCB, engineered for high-reliability aerospace applications. Featuring advanced materials and superior performance metrics, this PCB is ideal for demanding electronic systems.
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F4BTSM1000 PCB High-Performance 2-Layer Rigid PCB for Aerospace Applications
March 5, 2025
The F4B TSM1000 PCB is a high-performance 2-layer rigid PCB designed for demanding aerospace applications. With advanced materials and construction techniques, it provides excellent electrical performance, thermal conductivity, and stability, making it ideal for microwave and RF technologies.
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10-Layer HDI Tg180 FR-4 PCB for High Performance
March 7, 2025
Explore advanced PCB technology with our 10-layer HDI circuit boards, featuring high Tg FR-4 material for enhanced performance and reliability in various applications.
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High-Performance Hybrid PCB: RO4003C and S1000-2M 6-Layer Construction
March 9, 2025
Discover the features and specifications of a high-performance hybrid PCB made with RO4003C and S1000-2M. This 6-layer construction offers excellent electrical properties and thermal stability for advanced applications.
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High-Frequency RO3003 PCB – 2-Layer 5mil with ENIG Finish for RF and Microwave Applications
March 11, 2025
Premium 2-layer RO3003 PCB with 5mil trace/space, ENIG finish, and stable Dk for automotive radar, 5G, and RF/microwave applications.
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RO3006 High-Frequency PCB - 2-Layer 25mil Thick with ENIG Finish for RF/Microwave Applications
March 14, 2025
High-performance RO3006 2-layer PCB with 5/4 mil trace/space, 25mil substrate, and ENIG finish. Ideal for automotive radar, 5G, and satellite communications.
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RO3035 2-Layer PCB with Immersion Gold for High-Frequency Applications
March 16, 2025
Discover our RO3035 2-layer PCB with immersion gold, perfect for high-frequency applications up to 40 GHz, offering excellent dielectric stability and low moisture absorption for automotive radar and telecommunications.
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High-Performance RO4360G2 2-Layer PCB for Telecommunications and Power Applications
March 17, 2025
Discover the RO4360G2 2-layer PCB designed for high-performance applications. This board features excellent thermal stability and low loss characteristics, making it ideal for telecommunications and power amplifiers.
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Advanced 2-Layer RT/duroid 6002 PCBs for Microwave and RF Applications with Immersion Tin Finish
March 18, 2025
Discover high-performance 2-layer RT/duroid 6002 PCBs with an immersion tin finish, designed for advanced microwave applications. Explore specifications, features, and typical uses.
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High-Performance 2-Layer RT/duroid 5880 PCBs with Immersion Gold Finish for Advanced Applications
March 21, 2025
Explore high-performance 2-layer RT/duroid 5880 PCBs with an immersion gold finish, designed for advanced applications in RF and microwave technology. Discover specifications, features, and typical uses.
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High-Performance 2-Layer TLX-8 PCBs with ENEPIG Finish for Reliable RF Applications
March 22, 2025
Explore high-performance 2-layer TLX-8 PCBs with an ENEPIG finish, perfect for reliable RF applications. Discover specifications, features, and typical uses.
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TLX-9 2-Layer PCB: High-Performance Circuit Boards for Advanced Applications
March 23, 2025
Discover the advanced TLX-9 PCB, a high-performance 2-layer immersion silver circuit board designed for optimal electrical and mechanical properties. Ideal for applications in communications and high-power electronics.
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Rogers TMM4 PCB - High-Performance Microwave Material for Advanced Applications
March 25, 2025
Discover Rogers TMM4 PCB, a high-performance thermoset microwave material designed for advanced RF applications. Learn about its features, benefits, and typical uses in industries like telecommunications and aerospace.
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Advanced 8-Layer HDI RF PCB Solution with RO4350B Core and RO4450F Bondply
April 1, 2025
Discover our high-performance 8-layer HDI RF PCB with RO4350B core and RO4450F bondply, engineered for 5G, automotive radar, and satellite communications. Featuring 50Ω impedance control, 4/6 mil trace/space, and ENIG finish—ideal for demanding RF applications.
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The Power of 370HR Exploring High-Reliability PCBs for Critical Applications
April 2, 2025
Explore the features and specifications of 370HR PCBs, a high-performance FR-4 material ideal for demanding applications requiring superior thermal performance and reliability. Learn about its high Tg, low CTE, and suitability for various industries.
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High-Frequency F4BM220 PCB - 2-Layer PTFE Circuit Board with Immersion Gold Finish
April 3, 2025
High-performance 2-layer F4BM220 PCB with 0.8mm PTFE core and immersion gold surface finish. Designed for RF, microwave, and aerospace applications with Dk 2.2@10GHz. IPC-Class 2 certified.
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High Frequency 6-Layer Hybrid PCB RO4350B and S1000-2M with ENIG Finish
April 4, 2025
Advanced 6-layer hybrid PCB combining RO4350B and S1000-2M materials. Features 1.5mm thickness, 4/4 mil trace/space, ENIG finish, and controlled impedance for RF/microwave applications. IPC-Class 2 certified.
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RF-10 High Frequency PCB with Immersion Tin Finish
April 5, 2025
2-layer RF-10 PCB with 10.2 dielectric constant, 60mil thickness and immersion tin finish. Ideal for RF applications like patch antennas and satellite components. IPC-Class 2 certified.
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RF-30 High Frequency PCB 2-Layer Antenna Board with Immersion Tin Finish
April 7, 2025
Cost-effective 2-layer RF-30 PCB with 3.0 dielectric constant, 40mil thickness and immersion tin finish. Ideal for antenna applications and RF components. IPC-Class 2 certified.
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Optimized RO3010 2-Layer PCB for High-Frequency RF Applications
April 8, 2025
High-performance 2-layer RO3010 PCB with immersion silver finish, ideal for RF applications like automotive radar, GPS antennas, and telecom systems. Features 10.2 dielectric constant, low thermal expansion, and 5/6 mil trace/space.
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RO4003C 2-Layer ENIG PCB – High-Frequency RF Board for 5G & Automotive Radar
April 9, 2025
Discover the RO4003C 2-layer PCB with ENIG finish, ideal for high-frequency RF applications. Features low loss (Dk 3.38), excellent thermal stability, and FR-4-like manufacturability. Used in 5G antennas, automotive radar, and satellite systems.
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High-Frequency RO4350B 2-Layer PCB with ENIG Finish
April 11, 2025
RO4350B 2-layer PCB with ENIG finish delivers high-frequency performance (Dk=3.48) for 5G, automotive radar, and RF applications. Features 4/4 mil trace spacing, 0.29mm thickness, and IPC-Class-2 compliance.
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RT/duroid 6035HTC 2-Layer High-Power RF PCB with ENIG Finish
April 13, 2025
RT/duroid 6035HTC PCB offers 1.44W/m/K thermal conductivity for high-power RF designs. Features 4/7 mil traces, 1.6mm thickness, and immersion silver finish. Ideal for amplifiers and transmitters.
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TC350 High-Thermal-Conductivity PCB with 2OZ Copper & ENIG Finish
April 14, 2025
TC350 PCB with 2oz copper and ENIG finish delivers 0.72W/mK thermal conductivity for high-power RF applications. Features 6/6 mil traces, 1.6mm thickness, and stable Dk=3.5 performance.
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TC600 High-Thermal-Conductivity PCB with Immersion Gold Finish
April 16, 2025
TC600 PCB with immersion gold finish delivers 1.1W/mK thermal conductivity for high-power RF designs. Features 4/5 mil traces, 1.6mm thickness, and stable Dk=6.15 performance.
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TFA300 Ultra-Thin RF PCB with 10mil Core and Immersion Gold Finish
April 18, 2025
TFA300 ultra-thin (0.3mm) RF PCB features 3.0 Dk ceramic-PTFE core for aerospace applications. 5/7 mil traces, immersion gold finish, and stable performance from -55°C to 288°C.
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Rogers TMM10i High-Frequency PCB with Pure Gold Finish
April 21, 2025
Rogers TMM10i PCB with pure gold finish delivers 9.8 Dk stability for critical RF systems. Features 5/5 mil traces, nickel-free gold plating, and military-grade reliability for aerospace/5G applications.
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TP980 High-Frequency PCB with 7.62mm Thick Core and ENIG Finish for Aerospace Applications
April 23, 2025
TP980 7.62mm PCB features ceramic-PPO core with 9.8 Dk stability for aerospace/defense. Offers 6/6 mil traces, ENIG finish, and 0.0012 loss @10GHz in military-grade construction.
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F4BM265 High-Frequency PCB with 6.2mm Thick Core for RF/Microwave Applications
May 6, 2025
F4BM265 6.2mm PCB features PTFE composite core with 2.65 Dk for RF systems. Offers 6/8 mil traces, bare copper finish, and 0.0013 loss @10GHz in robust 3-layer construction.
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4-Layer Hybrid PCB with RO4350B and High Tg FR-4 for RF Applications
May 7, 2025
4-layer hybrid PCB combines 10mil RO4350B (3.48Dk) with High Tg FR-4 for RF applications. Features 4/6 mil traces, ENIG finish, and 1.5mm thickness.
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6-Layer CuClad 217 RF PCB with 3.5mm Thick Core and ENIG Finish
May 8, 2025
6-layer CuClad 217 PCB offers ultra-low 2.17Dk with 5/7 mil traces in 3.5mm ENIG-finished construction. Ideal for radar/EW systems with L1-L4 blind vias.
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6-Layer Hybrid PCB with RO4350B and High Tg FR-4 for RF Applications
May 10, 2025
6-layer hybrid PCB combines 16.6mil RO4350B (3.48Dk) with High Tg FR-4 for RF designs. Features 4/6 mil traces, immersion silver finish, and optimized cost/performance balance.
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High-Density 6-Layer RO4350B RF PCB with Blind Vias for Automotive Radar Applications
May 13, 2025
6-layer hybrid PCB combines 16.6mil RO4350B (3.48Dk) with High Tg FR-4 for RF designs. Features 4/6 mil traces, immersion silver finish, and optimized cost/performance balance.
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F4B TSM1000 High-Frequency PCB with 1.905mm Thick Core for Aerospace and Radar Applications
May 14, 2025
F4B TSM1000 PCB features 10.2Dk ceramic-PTFE core for aerospace/radar applications. 8/7 mil traces, 2.0mm thickness, and 0.0020 loss @10GHz in military-grade construction.
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IsoClad 933 2-Layer High-Frequency PCB for RF and Military Electronics
May 15, 2025
IsoClad 933 2-layer PCB delivers superior high-frequency performance with a 2.33 dielectric constant, perfect for RF circuits, conformal antennas, and military/defense applications.
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Megtron6 M6 High-Speed 6-Layer PCB for 5G and Automotive Radar Systems
May 16, 2025
Panasonic Megtron6 M6 R-5775G delivers superior high-speed performance with ultra-low signal loss, perfect for 5G infrastructure, automotive radar, and high-frequency computing applications.
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Premium Pneumatic SMT Stencil for Precision PCB Solder Paste Printing
May 17, 2025
Achieve flawless PCB assembly with our 736mm stainless steel SMT stencil. Designed for high-precision solder paste printing in consumer electronics, automotive, and telecom manufacturing.
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RF-35 2-Layer PCB Optimal Solution for RF and Microwave Circuits
May 18, 2025
RF-35 2-layer PCB offers cost-effective high-frequency performance with 3.5 Dk and ultra-low loss, perfect for power amplifiers, filters, and RF components with ENIG finish.
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Taconic RF-60A 2-Layer PCB for Advanced RF Applications
May 19, 2025
RF-60A 2-layer PCB delivers superior high-frequency performance with a 6.15 Dk, ideal for power amplifiers, filters, and miniaturized antennas. Features immersion gold finish and exceptional thermal stability.
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Rogers RO3003 2-Layer RF PCB for 5G and Automotive Radar Systems
May 20, 2025
Rogers RO3003 2-layer RF PCB offers stable 3.0 Dk performance for 77GHz automotive radar and 5G mmWave applications, featuring ultra-low loss and immersion gold finish.
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Rogers RO4830 Plus 2-Layer PCB for Automotive Radar and mmWave Applications
May 21, 2025
Rogers RO4830 Plus 2-layer PCB delivers superior mmWave performance with 3.0 Dk for 76-81GHz automotive radar sensors featuring ultra-low loss and ENIG finish
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High-Performance RT/duroid 5880 3-Layer PCB for RF Microwave Circuits
May 22, 2025
RT/duroid 5880 3-layer PCB is a high-frequency laminate with exceptional dielectric uniformity (2.2 ±0.02) and ultra-low loss (0.0009 at 10 GHz), ideal for stripline, microstrip, and millimeter-wave applications like radar and broadband antennas.
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TP1020 2-Layer High-Frequency PCB for Aerospace & Defense Applications
May 23, 2025
TP1020 2-layer PCB is a high-frequency thermoplastic solution with adjustable dielectric constant (10.2±0.2) and ultra-low loss (0.0012 at 10GHz), ideal for satellite navigation, missile systems, and miniaturized antennas.
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2-Layer 0.22mm Flexible PCB with 1.0mm FR-4 Stiffener (ENIG Finish)
May 27, 2025
2-layer 0.22mm flexible PCB with 1.0mm FR-4 stiffener and ENIG finish. Features high peel strength, RoHS compliance, and excellent high-frequency performance. Ideal for automotive, consumer electronics, and industrial applications.
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Isola 370HR 12-Layer High-Performance PCB for Demanding Applications
May 29, 2025
Isola 370HR 12-layer PCB is a high-performance FR-4 solution with 180°C Tg, low CTE (13/14ppm/°C), and ENIG finish, ideal for computing, automotive, and aerospace applications requiring thermal reliability and impedance control.
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High-Speed M6 & IS370HR 6-Layer PCB with Thermal Coin for RF Applications
June 1, 2025
6-layer hybrid PCB with embedded copper coin combines M6 high-speed material and IS370HR FR-4, offering superior thermal performance (Tg 185°C+) and RF capabilities for 5G base stations, automotive radar, and aerospace applications.
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F4BM220 PTFE RF Circuit Board with Low Dielectric Loss
June 3, 2025
F4BM220 double-sided PCB is a high-frequency PTFE laminate with low dielectric loss (Dk 2.2±0.04), ideal for microwave/RF systems, phase array antennas, and satellite communications.
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Rogers RO3006 2-Layer High-Frequency PCB for RF Applications
June 4, 2025
RO3006 2-layer PCB is a ceramic-filled PTFE RF material with stable Dk (6.15±0.15) and low loss (0.002@10GHz), ideal for automotive radar, GPS antennas, and wireless communications.
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Rogers RO3010 4-Layer 2.6mm PCB with Immersion Tin Surface
June 6, 2025
RO3010 4-layer PCB is a high-Dk ceramic PTFE laminate (Dk 10.2±0.3) with immersion tin finish, ideal for automotive radar, GPS antennas, and wireless communications.
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RO3210 4-Layer 1.22mm High-Frequency PCB with ENIG Finish
June 8, 2025
RO3210 4-layer 1.22mm PCB combines ceramic-filled PTFE with woven glass reinforcement (Dk 10.2±0.5), ideal for automotive radar, 5G antennas, and wireless systems with ENIG finish.
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RO4003C 4-Layer 1.8mm Thick PCB with ENIG Finish and Blind Vias
June 9, 2025
High-frequency 1.8mm thick RO4003C 4-layer PCB with ENIG finish, blind vias, and 5/4 mil trace/space. Ideal for RF/microwave applications like automotive radar and cellular antennas.
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High-Performance RO4533 2-Layer PCB with 0.6mm Thickness for Antenna Applications
June 11, 2025
Discover Rogers RO4533 2-layer PCB with 0.6mm thickness, immersion gold finish, and excellent RF performance. Ideal for cellular infrastructure and WiMAX antennas. Low Dk (3.3), low loss (0.0025), and high thermal reliability.
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High-Frequency RT/duroid 5880 4-Layer PCB with 3.0mm Thickness for RF Applications
June 14, 2025
Discover Rogers RT/duroid 5880 4-layer PCB with 3.0mm thickness, OSP finish, and superior RF performance. Ideal for millimeter-wave, radar, and airline broadband antennas. Low Dk (2.2), ultra-low loss (0.0009), and PTFE-based reliability.
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TLX-8 2-Layer 10mil Thin PCB with ENIG Finish for High-Frequency Applications
June 16, 2025
Discover TLX-8 2-layer 10mil thin PCB with ENIG finish—ideal for high-frequency RF applications. Featuring excellent PIM values, thermal stability, and reliability in extreme environments.
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Taconic TLY-5 2-Layer 125mil Thick PCB with Immersion Gold Finish for RF Applications
June 17, 2025
Discover the Taconic TLY-5 2-layer 125mil thick PCB with immersion gold finish—perfect for automotive radar (77GHz), satellite communications, and millimeter-wave systems. Features ultra-low loss (0.0009 Df), exceptional dimensional stability, and high-frequency performance.
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High-Frequency TP450 2-Layer PCB with 2.6mm Thickness for Aerospace Applications
June 19, 2025
TP450 2-layer PCB with 2.6mm thickness and ENIG finish. Features adjustable Dk (4.5±0.2), low loss (0.0010), and excellent thermal stability. Ideal for satellite, missile, and antenna systems.
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High-Performance TP980 RF PCB - 4.1mm Thick ENIG-Finished Board for Aerospace
June 22, 2025
Premium TP980 2-layer RF PCB with 4.1mm thickness featuring ENIG finish. High Dk (9.8±0.2), ultra-low loss (0.0012), military-grade reliability for satellite & defense systems.
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TRF-45 PCB: 2-Layer 32mil Thick ENIG Finished High-Frequency Circuit Board
June 24, 2025
TRF-45 PCB is a high-performance 2-layer 32mil thick circuit board with ENIG finish, designed for low-loss RF applications like satellite antennas and GPS. Features stable Dk of 4.5±0.15 and excellent thermal stability.
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6-Layer RO4003C FR-4 Hybrid PCB with Depth-Controlled Slots for RF Applications
June 27, 2025
A 6-layer hybrid PCB using Rogers RO4003C and FR-4 for cost-effective RF applications, featuring depth-controlled slots, ENIG finish, and high-frequency performance. Ideal for antennas, radar, and satellite systems.
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2 Layer TFA615 PCB 0.508mm (20mil) Thick with ENIG Finish for Aerospace and RF Applications
June 29, 2025
A 2-layer aerospace-grade PCB using TFA615 PTFE-ceramic material, optimized for high-frequency RF applications. Features ENIG finish, precise thickness (0.508mm), and stable dielectric properties for radar, satellite, and avionics systems.
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2 Layer F4BTME320 PCB 1.524mm Thick with Immersion Tin Finish for Aerospace and RF Applications
July 1, 2025
High-performance 2-layer PCB using F4BTME320 PTFE composite material, optimized for mission-critical aerospace and defense applications. Features ultra-low PIM (<-160dBc), immersion tin finish, and exceptional thermal stability for radar, satellite and phased array systems.
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2-Layer RF-10 PCB 0.3mm Thin Immersion Gold Finish for High-Frequency RF Applications
July 3, 2025
Ultra-thin 2-layer RF-10 PCB (0.3mm) with immersion gold finish, designed for compact high-frequency applications. Features ceramic-filled PTFE material with exceptional dielectric stability (Dk=10.2) and low loss, ideal for miniaturized RF components and antenna systems.
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RF-35 2-Layer PCB 0.3mm Thin Board with Immersion Silver for Microwave RF Applications
July 5, 2025
0.3mm 2-layer RF-35 board with immersion silver finish, featuring Taconic's ceramic laminate (Dk=3.5, Df=0.0018) for high-performance microwave/RF applications.
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Rigid Polyimide 4-Layer PCB 1.8mm Thick with HASL Lead-Free Finish for High-Temperature Applications
July 8, 2025
0.3mm 2-layer RF-35 board with immersion silver finish, featuring Taconic's ceramic laminate (Dk=3.5, Df=0.0018) for high-performance microwave/RF applications.
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RO3003G2 2-Layer PCB 0.2mm Thin Board with Immersion Gold for Automotive Radar Applications
July 10, 2025
Ultra-thin 0.2mm RO3003G2 PCB with ENIG finish, designed for 77GHz automotive radar systems. Features Rogers' ceramic-filled PTFE material (Dk=4.12) with ultra-low loss (0.0011@10GHz) and excellent thermal stability (Tg 257°C) for reliable ADAS performance.
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RO3210 2-Layer 30mil ENIG PCB for High-Frequency Wireless and Automotive Applications
July 12, 2025
A 2-layer RO3210 PCB (0.8mm/30mil) with ENIG finish, designed for high-frequency wireless and automotive applications. Features Rogers' ceramic-filled PTFE laminate (Dk=10.2) with excellent thermal stability (CTE matched to copper) and low-loss performance (0.0027@10GHz).
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RO4003C 2-Layer 16mil ENIG PCB for High-Frequency RF Applications
July 14, 2025
RO4003C 2-layer 16mil ENIG PCB delivers high-frequency performance with cost-effective FR-4-like processing. Featuring stable Dk=3.38 and low loss, it optimizes RF designs for cellular, automotive radar, and satellite applications.
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RO4350B 2-Layer 16.6mil ENEPIG PCB for High-Frequency RF Applications
July 16, 2025
RO4003C 2-layer 16mil ENIG PCB delivers high-frequency performance with cost-effective FR-4-like processing. Featuring stable Dk=3.38 and low loss, it optimizes RF designs for cellular, automotive radar, and satellite applications.
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RO4725JXR 2-Layer 0.8mm Immersion Gold PCB for Antenna Applications
July 18, 2025
This high-performance 2-layer PCB utilizes Rogers RO4725JXR material, offering a low-loss, cost-effective solution with immersion gold finish, ideal for high-frequency antenna applications such as cellular base stations.
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RT/duroid 5880 2-Layer 0.45mm Immersion Gold PCB for High-Frequency Applications
July 19, 2025
This ultra-thin 0.45mm 2-layer PCB utilizes Rogers RT/duroid 5880 high-frequency material, delivering exceptional electrical uniformity and minimal signal loss for demanding RF/microwave applications including radar systems and millimeter-wave circuits.
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RT/duroid 6035HTC 2-Layer 0.8mm ENIG PCB for High-Power RF/Microwave Applications
July 20, 2025
This high-thermal-conductivity 2-layer PCB utilizes Rogers RT/duroid 6035HTC material, delivering superior heat dissipation and stable performance for high-power RF/microwave circuits including amplifiers and power dividers.
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RT/duroid 6202 2-Layer 0.2mm ENIG PCB for High-Frequency Microwave Applications
July 23, 2025
This ultra-thin 0.2mm 2-layer PCB utilizes Rogers RT/duroid 6202 material, offering exceptional dimensional stability and low loss performance for advanced microwave systems including phased array antennas and radar systems.
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TP1020 2-Layer 4.1mm Thick ENIG PCB for High-Frequency RF/Microwave Applications
July 25, 2025
This thick 4.1mm 2-layer PCB utilizes unique TP1020 thermoplastic material with adjustable dielectric constant, delivering excellent high-frequency performance for specialized applications including satellite navigation and missile systems.
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3 Layer RO3006 Hybrid RF PCB 0.86mm with Blind Vias for Microwave Applications
August 1, 2025
This 3-layer hybrid RF PCB combines Rogers RO3006 and Tg170 FR-4 materials, offering exceptional electrical stability for high-frequency commercial applications.
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CLTE-XT 2-Layer Ultra-Thin 0.25mm PCB with Immersion Gold for RF and Antenna Applications
August 2, 2025
This 2-layer ultra-thin RF PCB utilizes Rogers CLTE-XT material, designed for high-frequency applications requiring low insertion loss and exceptional dimensional stability.
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CuClad 233 2-Layer 20mil PCB – High-Frequency RF Board with Immersion Gold Finish
August 4, 2025
A high-performance 2-layer RF PCB built on Rogers CuClad 233 laminate, featuring a 20mil core, low dielectric constant, immersion gold finish, and excellent high-frequency properties for advanced microwave and aerospace applications.
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DiClad 870 2-Layer 93mil PCB – High-Frequency, Low-Loss, Immersion Gold Finish for RF Applications
August 6, 2025
The DiClad 870 2-layer 93mil PCB is a high-frequency, low-loss circuit board designed for demanding RF and microwave applications, featuring a PTFE-based substrate with stable electrical properties, excellent moisture resistance, and immersion gold surface finish for reliable performance in radar, phased array, and communication systems.
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F4BTSM220 2-Layer 5mil PCB – Ultra-Thin High-Frequency Board with Immersion Gold for Aerospace and RF Applications
August 7, 2025
The F4BTSM220 2-layer 5mil PCB is an ultra-thin, high-reliability circuit board designed for aerospace and high-frequency applications, featuring ceramic-reinforced PTFE material, stable electrical properties, and immersion gold surface finish.
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IsoClad 933 2-Layer 62mil PCB – Flexible RF Substrate with ENIG Finish for Conformal Antenna Applications
August 9, 2025
The IsoClad 933 2-layer 62mil PCB is a high-frequency circuit board featuring nonwoven fiberglass/PTFE composite material that provides excellent flexibility and dimensional stability for conformal antennas and RF applications.
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Kappa 438 2-Layer 60mil PCB – ENIG Finish, FR-4 Compatible High-Frequency Material for 5G & IoT Applications
August 10, 2025
The Kappa 438 2-layer 60mil PCB is a glass-reinforced hydrocarbon ceramic laminate that offers FR-4 compatible fabrication with superior high-frequency performance, designed for 5G, IoT, and wireless communication systems.
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RO3010 2-Layer 0.127mm PCB – High-Dk Ceramic-Filled PTFE Substrate with ENIG for RF & Automotive Radar
August 12, 2025
The RO3010 2-layer 0.127mm PCB is a high-dielectric-constant circuit material ideal for miniaturized RF designs, offering excellent electrical stability and compatibility with broadband and high-frequency applications such as automotive radar and wireless communications.
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RO3206 2-Layer 25mil PCB – Ceramic-Filled Woven Glass RF Substrate with Immersion Gold for Automotive & Wireless Systems
August 13, 2025
The RO3206 2-layer 25mil PCB is a high-frequency ceramic-filled laminate with woven glass reinforcement, offering excellent electrical performance and mechanical stability for automotive radar, wireless communications, and base station applications.
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RO4003C 4-Layer 4.8mm Thick PCB with ENIG Finish and Countersunk Holes – Applications and Process Overview
August 14, 2025
A 4-layer RO4003C PCB with 4.8mm thickness, ENIG finish, and countersunk holes, delivering superior high-frequency performance and thermal stability for demanding RF/microwave applications.
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RO4350B 6-Layer 1.6mm PCB with ENIG & Blind Vias for RF/Microwave Applications
August 16, 2025
Engineered with RO4350B material, this 1.6mm thick, 6-layer board supports high-density designs (4/4 mil trace/space) with blind vias and ENIG surface finish for reliable RF/microwave applications.
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RT/duroid 5880 2-Layer 1.1mm PCB with Immersion Gold for High-Frequency Microwave Applications
August 17, 2025
This 2-layer PCB utilizes Rogers RT/duroid 5880 high-frequency laminate with a thickness of 1.1mm and immersion gold finish, ideal for precision stripline and microstrip circuits in microwave and millimeter-wave applications.
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TMM6 2-Layer 15mil PCB – High-Frequency RF Microwave Circuit Board with Immersion Silver Finish
August 20, 2025
This is a high-frequency, double-layer rigid PCB fabricated from Rogers TMM6 material, featuring an ultra-thin 0.5mm profile, a 15mil core, and immersion silver finish, ideal for demanding RF and microwave circuit applications.
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TP600 2-Layer 5.1mm Thick PCB – High-Frequency Thermoplastic ENIG Board for RF Applications
August 22, 2025
This is a double-sided rigid PCB made from TP600 high-frequency thermoplastic material, featuring an extreme thickness of 5.1mm, ENIG surface finish, and excellent dielectric properties for demanding RF and microwave applications.
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TSM-DS3 2-Layer 0.8mm PCB – Low-Loss Ceramic-Filled 30mil Core with Immersion Gold Finish
August 26, 2025
This is a high-performance double-layer PCB utilizing TSM-DS3 low-loss ceramic-filled material with a 30mil core, designed for high-power and high-frequency applications requiring excellent thermal management and dimensional stability.
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6-Layer Copper Coin Embedded PCB 1.0mm – M6 & IT180 Hybrid with ENIG Finish for 5G and Automotive
September 5, 2025
This is a sophisticated 6-layer hybrid PCB featuring embedded copper coin technology, resin-filled vias, and a combination of M6 high-speed and IT180 materials, designed for high-performance thermal management and signal integrity in 5G and automotive applications.
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F4B TSM255 2-Layer 1.6mm PCB – 60mil Ceramic-Filled PTFE with Immersion Gold for Aerospace & RF
September 7, 2025
This double-sided PCB utilizes F4B TSM255 high-reliability ceramic-filled PTFE material with a 60mil core and immersion gold finish, designed for demanding aerospace and high-frequency RF applications.
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RF-10 2-Layer 0.6mm PCB – 20mil Ceramic-Filled PTFE with Immersion Silver for High-Frequency RF Applications
September 8, 2025
This 2-layer PCB utilizes RF-10 ceramic-filled PTFE material with a 20mil core and immersion silver finish, designed for compact high-frequency RF circuits requiring stable dielectric performance and excellent thermal management.
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RO3003 2-Layer 1.4mm PCB – 50mil Ceramic-Filled PTFE with ENIG for RF & Automotive Radar
September 10, 2025
This 2-layer PCB utilizes Rogers RO3003 ceramic-filled PTFE material with a 50mil core and ENIG finish, designed for high-frequency RF applications requiring stable electrical performance across temperature and frequency variations.
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RO3006 2-Layer 0.2mm PCB – 5mil Ultra-Thin Ceramic PTFE with Pure Gold Plating for RF & Bonding
September 12, 2025
This ultra-thin 2-layer PCB uses Rogers RO3006 ceramic-filled PTFE material with a 5mil core and 30µ" pure gold plating, designed for high-frequency RF applications requiring reliable wire bonding and stable electrical performance.
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RO3035 2-Layer 0.37mm PCB – 10mil Ceramic-Filled PTFE with Immersion Gold for 5G & mmWave
September 14, 2025
This ultra-thin 2-layer PCB utilizes Rogers RO3035 ceramic-filled PTFE material with a 10mil core and immersion gold finish, designed for high-frequency 5G and millimeter-wave applications requiring stable electrical performance.
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RO3210 2-Layer 0.6mm High-Frequency PCB – 20mil Ceramic Woven Glass with Immersion Gold for Automotive Radar and 5G Base Stations
September 15, 2025
This 2-layer PCB uses Rogers RO3210 ceramic-filled woven glass laminate with a 20mil core and immersion gold finish, designed for high-frequency RF and automotive applications requiring excellent mechanical stability and electrical performance.
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RO4350B 2-Layer 1.524mm ENIG PCB for Automotive Radar and Base Station
September 16, 2025
A high-frequency RF PCB using RO4350B material with ENIG finish, ideal for automotive radar and communication applications.
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RO4730G3 2-Layer 20mil ENIG PCB for Base Station Antennas
September 18, 2025
A high-performance antenna-grade PCB utilizing RO4730G3 material with ENIG finish, specifically designed for cellular base station antenna applications.
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RT/duroid 6002 2-Layer 10mil Immersion Silver PCB for Microwave Applications
September 20, 2025
An ultra-thin, high-frequency PCB using RT/duroid 6002 low-loss material with immersion silver finish, designed for demanding microwave and radar systems.
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RT/duroid 6035HTC 2-Layer 60mil ENIG PCB for High Power RF Applications
September 22, 2025
A high-thermal-conductivity PCB utilizing RT/duroid 6035HTC material with ENIG finish, engineered for high-power RF and microwave amplifiers.
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TLX-0 2-Layer 20mil Immersion Gold PCB for RF Microwave Applications
September 23, 2025
A versatile RF microwave PCB using TLX-0 material with immersion gold finish, designed for demanding applications in radar, communications, and aerospace systems.
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TLX-9 2-Layer 50mil Immersion Tin PCB for RF Communications
September 25, 2025
A high-performance RF PCB using Taconic TLX-9 material with immersion tin finish, designed for communication systems and high-power amplifiers.
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TLY-3 2-Layer 20mil Silver-Gold Plate PCB for Millimeter Wave Applications
September 26, 2025
An ultra-low loss millimeter wave PCB using TLY-3 material with silver-gold plate finish, optimized for 77GHz automotive radar and satellite communications.
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TMM10i 2-Layer 30mil Immersion Tin PCB for Microwave Circuits
September 29, 2025
A high-Dk thermoset microwave PCB using Rogers TMM10i material with immersion tin finish, ideal for stripline and microstrip applications in communication systems.
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F4B TSM450 4-Layer 1.4mm ENIG PCB for Aerospace and Radar Systems
October 8, 2025
A high-reliability 4-layer microwave PCB using advanced F4B TSM450 ceramic-filled material with ENIG finish, designed for demanding aerospace and radar applications.
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6-Layer Hybrid PCB 1.3mm RO4350B+FR-4 ENEPIG for RF and Digital Systems
October 9, 2025
A sophisticated 6-layer hybrid PCB combining RO4350B RF material and High Tg FR-4 with ENEPIG finish, designed for advanced RF/digital mixed-signal applications.
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Megtron6 12-Layer 2.12mm High Speed PCB for 5G and Data Center Applications
October 11, 2025
A high-performance 12-layer PCB using Panasonic Megtron6 material with ENIG finish and advanced impedance control, designed for 5G infrastructure and high-speed data communication systems.
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Astra MT77 2-Layer 10mil ENIG PCB for Automotive Radar Applications
October 13, 2025
An ultra-thin, low-loss millimeter wave PCB using Astra MT77 material with ENIG finish, specifically designed for advanced automotive radar and safety systems.
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RO3010 2-Layer 25mil ENIG PCB for High-Dk RF Applications
October 14, 2025
A high-dielectric-constant RF PCB using Rogers RO3010 ceramic-filled PTFE material with ENIG finish, optimized for circuit miniaturization in telecommunications and automotive radar systems.
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RO3203 2-Layer 10mil ENEPIG PCB for High-Frequency Wireless Systems
October 15, 2025
An ultra-thin high-frequency PCB using Rogers RO3203 ceramic-filled material with ENEPIG finish, designed for wireless communications and automotive electronics applications beyond 40GHz.
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RO4003C LoPro 2-Layer 20.7mil Silver-Gold PCB for High-Frequency Applications
October 16, 2025
An ultra-thin high-frequency PCB using Rogers RO3203 ceramic-filled material with ENEPIG finish, designed for wireless communications and automotive electronics applications beyond 40GHz.
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RO4350B LoPro 2-Layer 60.7mil ENEPIG PCB for High-Frequency Applications
October 17, 2025
A low-profile, high-performance RF PCB using Rogers RO4350B LoPro material with ENEPIG finish, designed for superior signal integrity in cellular and satellite communication systems.
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RO4360G2 2-Layer 32mil ENIG PCB for Base Station Amplifiers
October 19, 2025
A high-dielectric-constant thermoset PCB using Rogers RO4360G2 material with ENIG finish, specifically designed for base station power amplifiers and small cell transceivers.
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RT/duroid 5880 2-Layer 62mil ENIG PCB for Millimeter Wave Applications
October 20, 2025
An ultra-low loss PTFE PCB using Rogers RT/duroid 5880 material with ENIG finish, designed for high-frequency stripline and microstrip circuits in millimeter wave and radar systems.
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RT/duroid 6006 2-Layer 10mil ENIG PCB for High-Dk Microwave Applications
October 22, 2025
An ultra-thin high-dielectric-constant PCB using Rogers RT/duroid 6006 ceramic-PTFE material with ENIG finish, optimized for circuit miniaturization in satellite and radar systems.
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RT/duroid 6010.2LM 2-Layer 75mil Immersion Silver PCB for High-Dk Microwave Applications
October 23, 2025
A high-dielectric-constant microwave PCB using Rogers RT/duroid 6010.2LM ceramic-PTFE material with immersion silver finish, designed for compact circuits in satellite and radar systems.
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TC600 2-Layer 30mil ENEPIG PCB for Thermal Management Applications
October 24, 2025
A thermally conductive high-frequency PCB using Rogers TC600 ceramic-filled material with ENEPIG finish, designed for enhanced heat dissipation in power amplifiers and avionics systems.
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TLX-8 2-Layer 31mil ENIG PCB for Extreme Environment RF Applications
October 26, 2025
A robust PTFE fiberglass PCB using Taconic TLX-8 material with ENIG finish, engineered for reliable performance in extreme environments including aerospace and military applications.
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TMM4 2-Layer 60mil Silver-Gold PCB for Microwave Circuit Applications
October 29, 2025
A high-reliability thermoset microwave PCB using Rogers TMM4 material with silver-gold plating, designed for stripline and microstrip applications in satellite and RF systems.
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2-Layer Adhesiveless FPC 50μm ENIG for Flexible Electronics
November 2, 2025
An ultra-thin adhesiveless flexible PCB using SF305 polyimide material with ENIG finish, designed for high-reliability applications in foldable electronics and automotive systems.
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Rogers RO4350B 2-Layer 1.524mm Immersion Silver PCB for RF Applications
November 3, 2025
A high-performance RF PCB using Rogers RO4350B material with immersion silver finish, designed for cellular base stations, automotive radar, and satellite communication systems.
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4-Layer Hybrid PCB 0.98mm RO4350B+FR-4 ENIG for RF/Digital Integration
November 5, 2025
A cost-effective 4-layer hybrid PCB combining Rogers RO4350B RF material and FR-4 with ENIG finish, optimized for mixed-signal applications in telecommunications and automotive systems.
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F4BM220 2-Layer 0.5mm ENIG PCB for Microwave and Radar Systems
November 6, 2025
A high-performance microwave PCB using Wangling's F4BM220 PTFE/fiberglass material with ENIG finish, designed for phase-sensitive antennas and RF communication systems.
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F4BTM350 2-Layer 3.1mm Thick PCB for High-Frequency RF & Microwave Applications
November 8, 2025
This 2-layer PCB uses F4BTM350 laminate with a 3.1mm thickness, designed for high-frequency and RF applications requiring stable performance and low loss.
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RF-10 2-Layer 0.75mm Thick PCB for High-Dk RF & Microwave Applications
November 9, 2025
This is a 2-layer 0.75mm thick RF PCB made with RF-10 high-Dk laminate, designed for compact and high-performance RF/microwave applications.
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Rogers RO3003 2-Layer 0.3mm Thin PCB for Automotive Radar & 5G mmWave Applications
November 10, 2025
This 2-layer 0.3mm thin PCB utilizes Rogers RO3003 high-frequency laminate, providing stable electrical performance for demanding automotive radar, ADAS, and 5G mmWave applications.
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Rogers RO3206 2-Layer 50mil High-Frequency RF PCB with Immersion Gold
November 12, 2025
This RO3206-based 2-layer 50mil rigid PCB offers excellent high-frequency performance and mechanical stability, making it ideal for RF, automotive, and telecom applications.
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Rogers RO4003C 2-Layer 8mil RF High-Frequency PCB with Immersion Silver
November 13, 2025
The RO4003C 2-layer 8mil PCB is a high-performance RF circuit board designed for applications requiring stable electrical performance and reliable plated through-hole integrity in demanding thermal environments.
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Rogers RO4533 2-Layer 30mil RF Antenna PCB with ENEPIG Surface Finish
November 16, 2025
The RO4533 2-layer 30mil PCB is a high-performance, ceramic-filled RF antenna board designed for cellular infrastructure and WiMAX applications, offering excellent electrical stability and compatibility with standard PCB fabrication processes.
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Rogers RO4725JXR 2-Layer 60.7mil High-Frequency Antenna PCB with Immersion Gold
November 19, 2025
The RO4725JXR 2-layer 60.7mil PCB is a high-performance, low-loss antenna-grade laminate designed for cellular base station antennas, offering excellent electrical stability, low PIM, and compatibility with standard FR-4 processing.
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Rogers RO4835 2-Layer 6.6mil High-Frequency Thin Core PCB with Immersion Gold
November 21, 2025
The RO4835 2-layer 6.6mil PCB is an ultra-thin, high-frequency circuit board designed for automotive radar and RF applications, offering excellent oxidation resistance and stable electrical performance in a cost-effective package.
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TLY-5 2-Layer 10mil High-Frequency Thin PCB with Immersion Gold
November 22, 2025
The Taconic TLY-5 2-layer 10mil PCB is an ultra-low-loss, high-frequency circuit board engineered for millimeter-wave applications including automotive radar and satellite communications, offering exceptional dimensional stability and electrical performance.
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WL-CT350 2-Layer 40mil High-Frequency PCB with Immersion Gold
November 25, 2025
The WL-CT350 2-layer 40mil PCB is a ceramic-reinforced high-frequency laminate designed for RF and antenna applications, offering excellent thermal stability, low loss, and compatibility with standard FR4 fabrication processes.
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Rogers RT/duroid 5880 4-Layer Hybrid RF/FR-4 PCB with Immersion Silver
November 29, 2025
This RT/duroid 5880 4-layer hybrid PCB combines high-frequency performance with structural stability, integrating RT5880 and FR-4 materials to deliver excellent RF signal integrity for Ku-band and microwave applications.
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F4BM217 2-Layer 3.9mil Ultra-Thin PTFE PCB with Immersion Gold
December 2, 2025
The F4BM217 2-layer 3.9mil PCB is an ultra-thin, low-loss PTFE laminate designed for microwave and RF applications, offering excellent electrical stability and dimensional control for phased arrays and satellite communications.
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Rogers RT/duroid 5880LZ 2-Layer 10mil Lightweight RF PCB with Immersion Gold
December 4, 2025
The Rogers RT/duroid 5880LZ 2-layer 10mil PCB is an ultra-low-loss, lightweight PTFE composite board designed for high-frequency stripline and microstrip applications, especially suited for aerospace, radar, and missile guidance systems.
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Rogers TMM6 2-Layer 15mil Ceramic Thermoset PCB with ENEPIG Surface Finish
December 5, 2025
The Rogers TMM6 2-layer 15mil PCB is a ceramic thermoset polymer composite designed for high-reliability RF and microwave applications, offering excellent plated through-hole integrity and compatibility with standard PCB processes.
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Rogers TMM10 2-Layer 15mil High-Dk Thermoset PCB with EPIG Nickel-Free Finish
December 6, 2025
The Rogers TMM10 2-layer 15mil PCB is a high-dielectric-constant thermoset laminate designed for RF and microwave applications, offering excellent thermal stability and compatibility with wire-bonding processes, while using a nickel-free EPIG surface finish.
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CLTE-AT 2-Layer 5mil Ultra-Thin Ceramic PTFE PCB with Immersion Gold
December 9, 2025
The CLTE-AT 2-layer 5mil PCB is an ultra-thin ceramic PTFE composite laminate with woven glass reinforcement, designed for high-performance RF and automotive radar applications, offering exceptional dimensional stability and low insertion loss.
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F4BTM300 2-Layer 10mil Ceramic-Filled PTFE PCB with ENIG Finish
December 10, 2025
The F4BTM300 2-layer 10mil PCB is a nano-ceramic reinforced PTFE composite laminate with enhanced thermal and electrical properties, designed for aerospace, radar, and high-frequency phased array applications.
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TP600 2-Layer 19.6mil High-Frequency Thermoplastic PCB with ENEPIG Finish
December 12, 2025
The TP600 2-layer 19.6mil PCB is a high-frequency thermoplastic laminate with customizable dielectric constant, designed for satellite navigation, missile systems, and miniaturized antenna applications, offering excellent electrical stability and low loss performance.
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TP960 2-Layer 19.6mil High-Dk Thermoplastic PCB with ENIG Finish
December 13, 2025
The TP960 2-layer 19.6mil PCB is a high-dielectric-constant thermoplastic composite laminate designed for satellite navigation and missile systems, offering tunable electrical properties and excellent reliability in demanding environments.
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WL-CT440 2-Layer 10mil Ceramic-Filled PCB with Immersion Gold
December 15, 2025
The WL-CT440 2-layer 10mil PCB is a thermosetting ceramic-filled laminate with excellent thermal and electrical stability, designed for aerospace, radar, and phased array antenna applications, offering reliable performance and ease of processing.
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F4BTSM430 2-Layer 10mil Advanced Ceramic-Filled PTFE PCB with Immersion Gold
December 16, 2025
The F4BTSM430 2-layer 10mil PCB is a high-performance ceramic-reinforced PTFE laminate designed for aerospace, radar, and phased array systems, offering enhanced electrical stability, low loss, and improved thermal properties.
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High Performance Aluminum Core PCB with 2W/MK Thermal Conductivity
December 17, 2025
High-performance 2W/MK aluminum core PCB designed for superior thermal management in high-power applications including LED lighting, power modules, automotive systems, and industrial electronics.
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High-Performance 4-Layer MT770 RF PCB with Ultra-Low Loss MT77 Material
December 19, 2025
This 4-layer MT770 PCB utilizes Isola's ultra-low loss MT77 laminate and prepreg, featuring resin-filled vias, immersion silver finish, and a symmetrical stack-up, making it ideal for high-frequency RF, microwave, and high-speed digital applications.
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10-Layer RO3003 High-Performance RF PCB with Immersion Gold Finish
December 20, 2025
High-performance 10-layer RO3003 PCB with immersion gold finish, featuring 1oz copper per layer, blind vias, and a compact 75mm x 63mm size for high-density RF/microwave applications.
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16-Layer Heavy Copper PCB for High-Power Applications
December 22, 2025
This 16-layer heavy copper PCB features 3oz copper per layer and a robust S1000-2M substrate, providing exceptional current-carrying capacity and thermal management for demanding high-power industrial and energy applications.
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18-Layer M6 High-Speed PCB with ENIG Surface Finish
December 25, 2025
This 18-layer high-speed PCB utilizes Panasonic's Megtron6 material with ENIG surface finish and resin-filled vias, delivering exceptional signal integrity for demanding high-frequency and high-data-rate applications.
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Rogers TMM4 2-Layer 15mil Ceramic-Filled Thermoset PCB with Immersion Gold Finish
January 4, 2026
A 2-layer Rogers TMM4 ceramic-filled thermoset PCB with 15mil thickness, Immersion Gold finish, and 1oz copper, optimized for high-reliability RF and microwave applications.
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Rogers TMM10i 2-Layer 15mil Pure Gold PCB for Microwave Applications
January 5, 2026
A high-dielectric-constant microwave PCB using Rogers TMM10i thermoset material with pure gold plating (no nickel), designed for stripline and microstrip circuits requiring reliable wire-bonding capability.
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Taconic CER-10 2-Layer 25mil ENIG PCB for High-Dk Microwave Components
January 6, 2026
A high-dielectric-constant organic-ceramic PCB using Taconic CER-10 material with ENIG finish, designed for power amplifiers and microwave passive components.
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Rogers CuClad 217 2-Layer 20mil ENIG PCB for Microwave & Radar Systems
January 7, 2026
A low-dielectric-constant PTFE composite PCB using Rogers CuClad 217 cross-plied material with ENIG finish, designed for high-frequency radar and electronic countermeasures applications.
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Wangling F4B TSM615 2-Layer 0.254mm Immersion Tin PCB for Aerospace Applications
January 8, 2026
An ultra-thin high-frequency PCB using Wangling F4B TSM615 ceramic-filled PTFE material with immersion tin finish, engineered for aerospace and military radar systems.
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Rogers RO4730G3 2-Layer 20mil ENEPIG PCB for Base Station Antennas
January 9, 2026
A lightweight antenna-grade PCB using Rogers RO4730G3 hydrocarbon/ceramic material with ENEPIG finish, designed for cellular base station applications requiring low PIM and lead-free compatibility.
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Rogers RO4835 2-Layer 0.254mm ENEPIG PCB for Automotive Radar Applications
January 10, 2026
An oxidation-resistant high-frequency PCB using Rogers RO4835 hydrocarbon material with ENEPIG finish, designed for automotive radar and phased-array applications requiring reliable high-temperature performance.
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Rogers RT/duroid 6010.2LM 4-Layer 2.8mm ENIG PCB for High-Dk Microwave Applications
January 11, 2026
A high-dielectric-constant multilayer microwave PCB using Rogers RT/duroid 6010.2LM ceramic-PTFE material with ENIG finish, designed for circuit miniaturization in satellite communications and radar systems.
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Taconic TLX-7 2-Layer 30mil Immersion Gold PCB for Radar & Microwave Systems
January 14, 2026
A high-frequency PTFE/woven glass PCB using Taconic TLX-7 material with immersion gold finish, designed for radar systems and phased array antennas requiring stable electrical performance up to millimeter-wave frequencies.
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Rogers TMM13i 2-Layer 15mil High-Dk Thermoset PCB with ENIG Finish
January 15, 2026
The Rogers TMM13i 2-layer 15mil PCB is a high-dielectric-constant isotropic thermoset composite laminate designed for high-reliability RF and microwave applications, offering superior plated through-hole integrity and compatibility with standard PCB processes.
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TLX-8 0.8mm Double-Sided PCB with ENIG Finish for RF and Microwave Applications
January 16, 2026
This double-sided TLX-8 PCB with ENIG finish delivers stable electrical performance and mechanical reliability for RF and microwave designs.
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Isola FR408HR 4-Layer and 6-Layer PCBs with ENIG Finish
January 17, 2026
These 4-layer and 6-layer PCBs feature Isola's FR408HR mid-loss laminate, 1oz copper per layer, ENIG finish, and advanced via processes for high-reliability multilayer applications.
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Rogers RO4003C 6-Layer PCB with Back Drilling and ENIG Finish
January 18, 2026
This 6-layer PCB features Rogers RO4003C hydrocarbon ceramic laminate and RO4450F prepreg with back drilling and ENIG finish, delivering stable high-frequency performance for RF and microwave applications.
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Rogers RO4003C 5.05mm 8-Layer PCB with ENIG Finish for High-Frequency Multilayer Applications
January 20, 2026
This 8-layer PCB features four Rogers RO4003C cores and RO4450F prepreg with ENIG finish, delivering stable high-frequency performance and reliable multilayer construction for demanding RF and microwave applications.
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Rogers RO3010 0.254mm Double-Sided PCB with ENIG Finish for High-Dk RF Applications
January 23, 2026
This double-sided PCB features Rogers RO3010 high-dielectric-constant ceramic-filled PTFE laminate with 0.254mm thickness, 1oz copper, and ENIG finish, delivering stable high-frequency performance for compact RF and microwave circuits.
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Rogers DiClad 870 2-Layer 5mil Low-Dk PTFE PCB with Immersion Silver
February 5, 2026
The Rogers DiClad 870 2-layer 5mil PCB is a low-dielectric-constant woven fiberglass PTFE composite designed for high-frequency applications including radar feed networks and base station antennas, offering excellent electrical stability and low moisture absorption.
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TSM-DS3 2-Layer 20mil Low-Loss Ceramic PCB with Immersion Gold
February 7, 2026
The TSM-DS3 2-layer 20mil PCB is a ceramic-filled, low-fiberglass content laminate designed for high-power and complex multilayer applications, offering exceptional thermal conductivity, dimensional stability, and low loss performance for demanding RF and mmWave systems.
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Rogers AD250C 4-Layer 60mil Hybrid PCB with Immersion Tin
February 8, 2026
The Rogers AD250C 4-layer 60mil hybrid PCB combines AD250C antenna-grade laminate with FR-4 materials to deliver excellent low-loss RF performance, dimensional stability, and low PIM characteristics for cellular infrastructure and automotive antenna applications.
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Rogers RO3010 2-Layer 20mil High-Dk Ceramic PTFE PCB with Immersion Silver
February 9, 2026
The Rogers RO3010 2-layer 20mil PCB is a high-dielectric-constant ceramic-filled PTFE laminate designed for circuit miniaturization and high-frequency applications including automotive radar, GPS antennas, and power amplifiers.
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Taconic RF-60A 2-Layer 50mil Organic-Ceramic PCB with Pure Gold Plating
February 11, 2026
The Taconic RF-60A 2-layer 50mil PCB is a woven glass-reinforced organic-ceramic laminate designed for high-frequency applications including power amplifiers and miniaturized antennas, offering excellent interlaminar bond strength, low moisture absorption, and dimensional stability.
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Rogers AD300D 2-Layer 40mil Low-Loss PTFE PCB with EPIG Nickel-Free Finish
February 12, 2026
The Rogers AD300D 2-layer 40mil PCB is a ceramic-filled, glass-reinforced PTFE laminate engineered for wireless antenna applications, offering controlled dielectric constant, low loss performance, and excellent PIM characteristics for cellular and automotive telematics systems.
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Rogers Kappa 438 2-Layer 30mil High-Frequency PCB with ENIG Finish
February 13, 2026
The Rogers Kappa 438 2-layer 30mil PCB is a glass-reinforced hydrocarbon ceramic laminate designed to deliver superior high-frequency performance while maintaining compatibility with standard FR-4 fabrication processes, ideal for wireless infrastructure and IoT applications.
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Rogers RO4003C LoPro 2-Layer 16.7mil Low-Loss PCB with ENEPIG Finish
February 14, 2026
The Rogers RO4003C LoPro 2-layer 16.7mil PCB combines low-profile reverse treated copper foil with RO4003C hydrocarbon ceramic dielectric to deliver superior signal integrity, reduced conductor loss, and excellent high-frequency performance for applications up to 40 GHz and beyond.
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Rogers RT/duroid 6035HTC 2-Layer 30mil High Thermal Conductivity PCB with Immersion Silver
February 15, 2026
The Rogers RT/duroid 6035HTC 2-layer 30mil PCB is a ceramic-filled PTFE composite with 2.4x higher thermal conductivity than standard RT/duroid 6000 series, specifically engineered for high power RF and microwave amplifier applications requiring excellent heat dissipation and low loss performance.
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Taconic TLX-0 2-Layer 20mil Low-Dk PTFE PCB with HASL Finish
February 16, 2026
The Taconic TLX-0 2-layer 20mil PCB is a versatile PTFE fiberglass composite laminate with a low dielectric constant of 2.45, designed for reliable performance in extreme environments including aerospace, defense, and microwave communication applications.
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2W/mK Double-Sided Aluminum Core PCB with ENIG Finish for High-Power Thermal Management
February 18, 2026
This double-sided aluminum core PCB features a 1.4mm aluminum core sandwiched between two 2W/mK prepreg layers with 1oz copper and ENIG finish, delivering excellent thermal dissipation for high-power applications requiring dual-side circuit layout.
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Rogers RO4350B + High Tg FR-4 4-Layer Hybrid PCB with ENIG Finish for RF and Mixed-Signal Applications
February 20, 2026
This 4-layer hybrid PCB combines Rogers RO4350B high-frequency laminates with High Tg FR-4 cores, featuring blind vias, ENIG finish, and 50Ω impedance control for demanding RF and mixed-signal applications requiring both high-frequency performance and cost-effective construction.
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Rogers RT/duroid 5880 + High Tg FR-4 4-Layer Hybrid PCB with Step Cavity and ENIG Finish
February 21, 2026
This 4-layer hybrid PCB combines a 1.575mm RT/duroid 5880 core with a 0.5mm High Tg FR-4 layer, featuring step cavity construction and ENIG finish for ultra-low loss RF/microwave applications requiring mixed-material integration.
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Isola I-Tera MT40 6-Layer PCB with Resin-Filled Vias, Edge Plating, and ENIG Finish
February 23, 2026
This 6-layer PCB features Isola's I-Tera MT40 low-loss laminate with RO4450F prepreg, 50Ω single-ended impedance control, resin-filled vias, edge plating, and ENIG finish for high-speed digital and RF/microwave applications requiring superior signal integrity.
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Taconic TC350 + Isola FR408HR 8-Layer Hybrid PCB with Resin-Filled Vias, Edge Plating, and ENIG Finish
February 25, 2026
This 8-layer hybrid PCB combines Taconic TC350 high-thermal-conductivity laminates with Isola FR408HR mid-loss cores, featuring blind vias, resin-filled and capped vias, edge plating, and ENIG finish for high-reliability RF/microwave and high-speed digital applications requiring enhanced thermal management.
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Rogers RO3010 2-Layer 50mil High-Dk Ceramic PTFE PCB with EPIG Nickel-Free Finish
March 2, 2026
The Rogers RO3010 2-layer 50mil PCB is a high-dielectric-constant ceramic-filled PTFE laminate designed for circuit miniaturization, automotive radar, GPS antennas, and power amplifiers, offering exceptional electrical and mechanical stability across a wide frequency range.
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TMM10 2-Layer 0.5mm ENEPIG PCB – Microwave PCB for Antenna & Satellite
March 4, 2026
This 2-layer TMM10 PCB features 0.5mm thickness, ENEPIG surface finish, and thermoset microwave properties, delivering reliable high-frequency performance for satellite, GPS antenna, and chip tester applications.
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Wangling WL-CT330 4-Layer 2.7mm Immersion Gold PCB – 5G, Radar & Satellite
March 6, 2026
This 4-layer WL-CT330 PCB features 2.7mm thickness, immersion gold finish, and a hybrid stackup with high-Tg FR-4, delivering stable high-frequency performance for 5G base stations, automotive radar, satellite communication, and aerospace applications.
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Taconic RF-30A 2-Layer 0.6mm ENIG PCB – RF/Microwave Communication
March 8, 2026
This 2-layer RF-30A PCB features 0.6mm thickness, ENIG surface finish, and ultra-low loss RF-grade laminate, delivering reliable high-frequency performance for 5G/6G base stations, radar systems, satellite communication, and aerospace applications.
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Rogers RT/duroid 6002 2-Layer 0.8mm Immersion Silver PCB – Phased Array & Radar
March 9, 2026
This 2-layer Rogers RT/duroid 6002 PCB features 0.8mm thickness, immersion silver finish, and ultra-low loss ceramic-filled PTFE laminate, delivering stable high-frequency performance for phased array antennas, radar systems, GPS antennas, and space applications.
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Taconic TRF-45 2-Layer 0.9mm Immersion Gold PCB – Satellite & GPS Antenna
March 10, 2026
This 2-layer Taconic TRF-45 PCB features 0.9mm thickness, immersion gold finish, and low-loss ceramic-filled PTFE laminate, delivering stable high-frequency performance for satellite radio antennas, RFID antennas, and GPS applications.
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Rogers TMM13i 2-Layer 3.9mm OSP PCB for Chip Tester & Satellite Communication
March 11, 2026
This 2-layer Rogers TMM13i PCB features 3.9mm thickness, OSP surface finish, and high-Dk thermoset microwave laminate, delivering stable high-frequency performance for chip testers, dielectric polarizers, satellite communication systems, and RF microwave circuitry.
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Rogers RT/duroid 5870 2-Layer 0.3mm ENIG PCB – Microstrip & Radar Applications
March 13, 2026
This 2-layer Rogers RT/duroid 5870 PCB features 0.3mm thickness, ENIG surface finish, and glass microfiber reinforced PTFE laminate, delivering exceptional dielectric constant uniformity and low-loss performance for microstrip circuits, radar systems, and millimeter wave applications.
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Wangling TF600 2-Layer 0.7mm ENIG PCB for 5G Antenna & Radar Applications
March 14, 2026
This 2-layer Wangling TF600 PCB features 0.7mm thickness, ENIG surface finish, and ceramic-filled PTFE laminate with no glass fiber cloth, delivering ultra-low dielectric loss and stable DK for 5G/6G MIMO antennas, radar systems, satellite communications, and high-power RF amplifiers.
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