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| Factory Process Capability (2025) | |
| Substrate Types | Standard FR-4, High Tg FR-4, High Frequency Materials, Rigid Polyimide, Flexible Polyimide, Transparent PET Materials, AL2O3 Ceramic, ZrO2 Ceramic etc. |
| Substrate Brands | Shengyi, ITEQ, KB, Isola, Taiwan Union, Rogers Corp. Taconic, Wangling, Panasonic etc |
| Board Types | Rigid PCB, Flexible Circuits, Rigid-Flex PCB, Hybrid PCB, HDI PCB, Heavy Copper, High Speed, High frequency etc. |
| Copper Clad Laminates(CCL) | High Tg FR-4: S1000-2M, TU-872 SLK, TU-768, TU-883, IT-180A, FR408HR, 370HR, High CTI FR-4: S1600L, ST115 High speed: M6 (R5775G Core / R-5670 Prepreg) |
| Rogers Corp: RO4350B, RO4003C, RO4725JXR, RO4730G3, RO4360G2, RO4533, RO4534, RO4535, RO4830, RO4835, RO3003, RO3006, RO3010, RO3035, RO3203, RO3210; RT/Duriod 5880; RT/Duriod 5870, RT/Duriod 6002, RT/duroid 6006, RT/Duroid 6010.2LM, RT/duroid 6035HTC; RT/duroid 5880LZ, RT/duroid 6202; TMM3, TMM4, TMM6, TMM10, TMM10i, TMM13i, Kappa 438; AD250C, AD255C, AD300D, AD350A, AD450, AD600, AD1000, TC350; TC600; DiClad 880, DiClad 870, DiClad 527; IsoClad 917, IsoClad 933; CLTE-XT, CLTE-AT, CLTE-MW; CuClad 217, CuClad 233, CuClad 250. | |
| Taconic: TLF-35; RF-35TC, RF-60A, RF-60TC, RF-35A2,RF-30, RF-35, RF-45, RF-10, TRF-45; TLX-0, TLX-6, TLX-7, TLX-8; TLX-9, TLY-3, TLY-5, TLY-5Z; CER-10; TSM-DS3 | |
| Wangling: F4BM217, F4BM220, F4BM233, F4BM245, F4BM255, F4BM265, F4BM275, F4BM294, F4BM300; F4BME217, F4BME220, F4BME233, F4BME245, F4BME255, F4BME265, F4BME275, F4BME294, F4BME300; F4BTM298, F4BTM300, F4BTM320, F4BTM350; F4BTME298, F4BTME300, F4BTME320, F4BTME350; TP300, TP440, TP600, TP615, TP960, TP1020, TP1100, TP1600, TP2000, TP2200, TP2500; TF300, TF440, TF600, TF960, TF1020, TF1600; F4BTMS220, F4BTMS233, F4BTMS255, F4BTMS265, F4BTMS294, F4BTMS300, F4BTMS350, F4BTMS430, F4BTMS450, F4BTMS615, F4BTMS1000; TFA294, TFA300, TFA615, TFA1020; WL-CT300, WL-CT330, WL-CT330Z, WL-CT338, WL-CT350, WL-CT440, WL-CT615. |
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| Maximum Delivery Size | 1200mm x 572 mm |
| Minimum Finished Board Thickness | L≤2L: 0.15mm; 4L: 0.4mm |
| Maximum Finished Board Thickness | 10.0 mm |
| Blind Buried Holes (Non-crossing) | 0.1mm |
| Maximum Hole Aspect Ratio | 15:01:00 |
| Minimum Mechanical Drill Hole Diameter | 0.1 mm |
| Through-hole Tolerance | +/- 0.0762 mm |
| Press-fit Hole Tolerance | +/- 0.05mm |
| Non-plated Copper Hole Tolerance | +/- 0.05mm |
| Maximum Number of Layers | 32 |
| Internal and External Layer Maximum Copper Thickness | 12Oz |
| Minimum Drill Hole Tolerance | +/- 2mil |
| Minimum Layer-to-Layer Tolerance | +/- 3mil |
| Minimum Line Width/Spacing | 3mil/3mil |
| Minimum BGA Diameter | 8mil |
| Impedance Tolerance | < 50Ω ±5Ω; ≥50Ω±10% |
| Surface Treatment Processes | Leaded/Lead-free HASL, Immersion Gold, Immersion Silver, Immersion Tin, OSP, ENIG, ENEPIG, Pure gold, Carbon Ink, Peelable Mask, Gold Finger, etc. |