RO4003C LoPro Circuit Board Rogers 32.7mil Reverse Treated Foil PCB for Cellular Base Station Antennas
(Printed Circuit Boards are custom-made products; the images and specifications shown are for reference only.)
Product Description
RO4003C LoPro laminates utilize proprietary Rogers technology, allowing reverse treated foil to bond effectively with standard RO4003C dielectric. This results in a laminate characterized by low conductor loss, enhancing insertion loss and signal integrity while maintaining all other desirable attributes of the standard RO4003C laminate system.
Features and Benefits
RO4003C materials are reinforced hydrocarbon/ceramic laminates with very low profile reverse treated foil, offering numerous advantages:
Lower Insertion Loss: Improves signal transmission efficiency.
Low Passive Intermodulation (PIM): Enhances overall performance in RF applications.
Increased Signal Integrity: Ensures clearer and more reliable signal transmission.
High Circuit Density: Supports complex circuit designs without compromising performance.
Thermal and Design Characteristics
Low Z-axis Coefficient of Thermal Expansion: Enables multi-layer board capability and greater design flexibility.
Lead-Free Process Compatible: Supports high-temperature processing and adheres to environmental regulations.
CAF Resistant: Increases reliability in harsh environments.
Typical Applications
1. Digital applications such as servers, routers, and high-speed backplanes
2. Cellular base station antennas and power amplifiers
3. LNBs for direct broadcast satellites
4. RF Identification Tags
Typical Properties of RO4003C LoPro
| Property | Typical Value | Direction | Units | Condition | Test Method |
|---|---|---|---|---|---|
| Dielectric Constant, Process | 3.38 ± 0.05 | z | -- | 10 GHz/23°C | IPC-TM-650 2.5.5.5 |
| Dielectric Constant, Design | 3.5 | z | -- | 8 to 40 GHz | Differential Phase Length Method |
| Dissipation Factor tan δ | 0.0027 | z | -- | 10 GHz/23°C | IPC-TM-650 2.5.5.5 |
| Thermal Coefficient of εr | 40 | z | ppm/°C | -50°C to 150°C | IPC-TM-650 2.5.5.5 |
| Volume Resistivity | 1.7 x 10¹⁰ | -- | MΩ·cm | COND A | IPC-TM-650 2.5.17.1 |
| Surface Resistivity | 4.2 x 10⁹ | -- | MΩ | COND A | IPC-TM-650 2.5.17.1 |
| Electrical Strength | 31.2 (780) | z | KV/mm (V/mil) | 0.51mm (0.020") | IPC-TM-650 2.5.6.2 |
| CTE (x) | 11 | x | ppm/°C | -55 to 288°C | IPC-TM-650 2.1.41 |
| CTE (y) | 14 | y | ppm/°C | -55 to 288°C | IPC-TM-650 2.1.41 |
| CTE (z) | 46 | z | ppm/°C | -55 to 288°C | IPC-TM-650 2.1.41 |
| Tg | >280 | -- | °C TMA | A | IPC-TM-650 2.4.24.3 |
| Td | 425 | -- | °C TGA | -- | ASTM D3850 |
| Thermal Conductivity | 0.64 | -- | W/m/°K | 80°C | ASTM C518 |
| Moisture Absorption | 0.06 | -- | % | 48 hrs immersion | ASTM D570 |
| Density | 1.79 | -- | gm/cm³ | 23°C | ASTM D792 |
| Copper Peel Strength | 1.05 (6.0) | -- | N/mm (pli) | after solder float | IPC-TM-650 2.4.8 |
| Lead-Free Process Compatible | Yes | -- | -- | -- | -- |
Why Partner With Us?
1.Certified Quality: We are ISO9001, ISO14001, IATF16949, ISO13485, and UL certified, ensuring the highest quality standards.
2.18+ Years of Experience: With over 18 years of experience in high-frequency PCB manufacturing, we deliver reliable and innovative solutions.
3.No MOQ Required: We accept small quantity orders with no minimum order quantity (MOQ).
4.On-Time Delivery: Our on-time delivery rate exceeds 98%, with a customer complaint rate of less than 1%.
5.Robust Production Capacity: Our 16,000㎡ workshop produces 30,000㎡ of PCBs monthly, supporting over 8,000 types of PCBs.
Frequently Asked Questions (FAQs)
Do We Deliver Worldwide?
All PCBs available through Bicheng Ltd can be shipped worldwide. We partner with DHL, FedEx, TNT, UPS, EMS, and Aramex.
Is the Rogers RO4003C LoPro Material in Stock?
We maintain stock of Rogers RO4003C LoPro laminates. Please consult our sales team for availability and volume pricing.
How Much Will It Cost for Delivery?
We offer various carriers. Typically, we select the most cost-effective option. For urgent orders, faster delivery can be arranged.
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