Shenzhen Bicheng Electronics Technology Co., Ltd 86-755-27374946-Working time sales25@bichengpcb.com
Rogers RO4360G2 20mil Double Sided High Frequency PCB With Immersion Gold for Patch Antennas

Rogers RO4360G2 20mil Double Sided High Frequency PCB With Immersion Gold for Patch Antennas

  • NUMBER OF LAYERS
    2
  • GLASS EPOXY
    RO4360G2
  • FINAL HEIGHT OF PCB
    0.8mm
  • FINAL FOIL EXTERNAL
    1.0oz
  • SURFACE FINISH
    Immersion Gold
  • SOLDER MASK COLOR
    Green
  • COLOUR OF COMPONENT LEGEND
    White
  • TEST
    100% Electrical Test Prior Shipment
  • Place of Origin
    China
  • Brand Name
    Bicheng Technologies Limited
  • Certification
    UL
  • Model Number
    BIC-0116-N0.116
  • Minimum Order Quantity
    1
  • Price
    USD9.99-99.99
  • Packaging Details
    Vacuum
  • Delivery Time
    10 working days
  • Payment Terms
    T/T/Paypal
  • Supply Ability
    50000 pieces per month

Rogers RO4360G2 20mil Double Sided High Frequency PCB With Immersion Gold for Patch Antennas

Rogers RO4360G2 20mil Double Sided High Frequency PCB With Immersion Gold for Patch Antennas

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

RO4360G2 laminates of Rogers Corporation are 6.15 Dk, low loss, glass-reinforced, hydrocarbon ceramic-filled

thermoset materials that provide the ideal balance of performance and processing ease. RO4360G2 laminates

extend Rogers' portfolio of high performance materials by providing customers with a product that is lead-free

process capable and offers better rigidity for improved processability in multi-layer board constructions, while

reducing material and fabrication costs.

 

RO4360G2 laminates process similar to FR-4 and are automated assembly compatible. They have a low Z-axis

CTE for design flexibility and have the same high Tg as all of the RO4000 product line. RO4360G2 laminates can

be paired with RO4450F prepreg and lower-Dk RO4000 laminate in multi-layer designs.

 

RO4360G2 laminates, with a Dk of 6.15 (Design Dk 6.4), allow designers to reduce circuit dimensions in applications

where size and cost are critical. They are the best value choice for engineers working on designs including power

amplifiers, patch antennas, ground-based radar, and other general RF applications.

 

 

Features and benefits:

1. Thermoset resin system specially formulated to meet 6.15 Dk

1). Ease of fabrication / processes similar to FR-4

2). Material repeatability

3). Low loss

4). High thermal conductivity

5). Lower total PCB cost solution than competing PTFE products,

 

2. Low Z-axis CTE / High Tg

1). Design flexibility

2). Plated through-hole reliability

3). Automated assembly compatible

 

3. Environmentally friendly

1.) Lead free process compatible

 

4. Regional finished goods inventory

1). Short lead times / quick inventory turns

2). Efficient supply chain

 

 

Some Typical Applications:

1. Base Station Power Amplifiers

2. Small Cell Transceivers

3. Patch antennas

4. Ground-based Radar

 

PCB Capability

 

PCB Material: Hydrocarbon Ceramic-filled Thermoset Materials
Designation: RO4360G2
Dielectric constant: 6.15 ±0.15
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 8mil (0.203mm), 12mil (0.705mm), 16mil (0.406mm), 20mil(0.508mm), 24mil (0.610mm), 32mil (0.813mm), 60mil(1.524mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, OSP etc..

 

 

Data Sheet of RO4360G2

 

Property RO4360G2 Direction Units Condition Test Method
Dielectric Constant,εProcess 6.15±0.15 Z   10 GHz/23 IPC-TM-650 2.5.5.5
2.5 GHz/23
Dissipation Factor,tanδ 0.0038 Z   10 GHz/23 IPC-TM-650 2.5.5.5
Thermal Conductivity 0.75   W/mK 50 ASTM D-5470
Volume Resistivity 4.0 X 1013   Ω.cm Elevated T IPC-TM-650 2.5.17.1
Surface Resistivity 9.0 X 1012   Ω Elevated T IPC-TM-650 2.5.17.1
Electrical Strength 784 Z V/mil   IPC-TM-650 2.5.6.2
Tensile Strength 131 (19) 97(14) X Y MPa (kpsi) 40 hrs 50%RH/23 ASTM D638
Flexural Strength 213(31) 145(21) X Y Mpa (kpsi) 40 hrs 50%RH/23 IPC-TM-650, 2.4.4
Coefficient of Thermal Expansion 13 14 28 X Y Z ppm/ -50 to 288 After Replicated Heat Cycle IPC-TM-650, 2.1.41
Tg >280   ℃ TMA   IPC-TM-650 2.4.24.3
Td 407     ASTM D3850 using TGA
T288 >30 Z min 30 min / 125 Prebake IPC-TM-650 2.2.24.1
Moisure Absorption 0.08   % 50/48hr IPC-TM-650 2.6.2.1 ASTM D570
Thermal Coefficient of er -131 @10 GHz Z ppm/℃ -50 to 150 IPC-TM-650, 2.5.5.5
Density 2.16   gm/cm3 RT ASTM D792
Copper Peel Stength 5.2 (0.91)   pli (N/mm) Condtion B IPC-TM-650 2.4.8
Flammability V-0       UL 94 File QMTS2. E102765


Rogers RO4360G2 20mil Double Sided High Frequency PCB With Immersion Gold for Patch Antennas 0

 

Rogers RO4360G2 20mil Double Sided High Frequency PCB With Immersion Gold for Patch Antennas 1