Assembly of Taconic TRF-45 High Frequency PCB with HASL Finish and 1 oz of copper on 32 mil
0.813 mm substrates
Introducing the TRF-45 PCB, a cutting-edge solution tailored to meet your electronic design needs. Crafted
with glass reinforced PTFE ceramic composites, this advanced material offers exceptional performance and
reliability across a range of applications.
Featuring a Dielectric Constant (Dk) of 4.5 at 10 GHz, the TRF-45 ensures precise signal transmission and
optimal performance. With a Dissipation Factor of 0.0035 at 10 GHz/23°C, it minimizes signal loss and maintains
excellent signal integrity. Operating seamlessly in temperatures ranging from -40℃ to +85℃, it guarantees reliable functionality in diverse environments. Furthermore, the material demonstrates exceptional dimensional stability,
with an X-CTE and Y-CTE of 9 ppm/°C and a Z-CTE of 40 ppm/°C, ensuring consistent performance and compatibility
with various assembly processes.
The TRF-45 PCB offers a multitude of benefits. It boasts low-loss properties, ensuring minimal signal degradation
and superior signal integrity. With high thermal conductivity, it effectively dissipates heat, maintaining optimal operating temperatures. The material maintains stable Dk over temperature and frequency variations, allowing for precise control
and reliable performance. Additionally, it exhibits a very low z-axis Coefficient of Thermal Expansion (CTE), guaranteeing excellent dimensional stability and reliability.
This TRF-45 PCB is designed as a 2-layer rigid PCB, consisting of copper_layer_1 (35 μm), the Taconic Core TRF-45
(0.813 mm or 32mil), and copper_layer_2 (35 μm). This construction ensures optimal performance, reliability, and ease
of manufacturing for your circuit designs.
The board dimensions measure 65.53mm x 45.33mm (± 0.15mm), providing ample space to accommodate your design requirements. With a minimum Trace/Space of 6/8 mils, you can achieve intricate and precise circuit layouts. The minimum Hole Size of 0.35mm offers versatility in component mounting. The absence of Blind vias simplifies the design and manufacturing processes. The PCB has a finished thickness of 0.9mm, striking the perfect balance between durability and space efficiency. The outer layers have a finished Cu weight of 1 oz (1.4 mils), ensuring excellent conductivity. Reliable electrical connections are guaranteed with a via plating thickness of 20 μm. The surface finish of HASL lead-free provides corrosion resistance and a solderable surface. The absence of Top and Bottom Silkscreen and Solder Masks contributes
to a clean and professional appearance. Each PCB undergoes a comprehensive 100% electrical test before shipment, ensuring optimal performance and reliability.
The TRF-45 PCB complies with the IPC-Class-2 quality standard, ensuring reliable performance and meeting stringent requirements. Our TRF-45 PCB is available worldwide, ensuring access to its advanced features and benefits.
The TRF-45 finds applications in various fields, including Satellite Radio and RFID, thanks to its versatility and exceptional performance.
For any technical inquiries or further information, please contact us at sales@bicheng-enterprise.com. Our knowledgeable team is dedicated to providing exceptional support and guiding you towards the perfect solution for your specific requirements.
| Item |
Value |
| PCB Material |
TRF-45 PCB Material |
| |
Glass Reinforced PTFE Ceramic Composites |
| |
Dielectric Constant (Dk) at 10 GHz: 4.5 |
| |
Dissipation Factor at 10 GHz/23°C: 0.0035 |
| |
X-CTE: 9 ppm/°C |
| |
Y-CTE: 9 ppm/°C |
| |
Z-CTE: 40 ppm/°C |
| |
-40°C to +85°C operation |
| Benefits |
- Low Loss Properties |
| |
- High thermal conductivity |
| |
- Stable Dk over temperature |
| |
- Stable Dk over frequency |
| |
- Very low z-axis CTE |
| Stackup |
2-layer rigid PCB |
| |
Copper_layer_1: 35 μm |
| |
Taconic Core TRF-45: 0.813 mm (32 mil) |
| |
Copper_layer_2: 35 μm |
| Construction Details |
Board Dimensions: 65.53 mm x 45.33 mm (1 PCS), +/- 0.15 mm |
| |
Minimum Trace/Space: 6/8 mils |
| |
Minimum Hole Size: 0.35 mm |
| |
No Blind Vias |
| |
Finished Board Thickness: 0.9 mm |
| |
Finished Cu Weight: 1 oz (1.4 mils) outer layers |
| |
Via Plating Thickness: 20 μm |
| |
Surface Finish: HASL lead free |
| |
Top Silkscreen: No |
| |
Bottom Silkscreen: No |
| |
Top Solder Mask: No |
| |
Bottom Solder Mask: No |
| |
100% Electrical Test Used Prior to Shipment |
| PCB Statistics |
Components: 29 |
| |
Total Pads: 70 |
| |
Thru Hole Pads: 47 |
| |
Top SMT Pads: 23 |
| |
Bottom SMT Pads: 0 |
| |
Vias: 51 |
| |
Nets: 2 |
| Type of Artwork Supplied |
Gerber RS-274-X |
| Accepted Standard |
IPC-Class-2 |
| Availability |
Worldwide |
| Some Typical Applications |
- Satellite radio |
| |
- RFID |
