Wangling TP2000 High Dk PCB Using Immersion Gold and 1 oz of Copper Built on 10mm Substrates
Introducing the TP2000 PCB, a cutting-edge solution that combines the benefits of ceramic and polyphenylene
ether resin without glass fiber reinforcement. This unique composition offers exceptional electrical performance
and mechanical strength, making it an ideal choice for high-frequency applications.
The TP2000 material boasts remarkable properties, including a Dielectric Constant of 20 at 5GHz and a Dissipation
Factor of 0.002 at 5GHz. These characteristics ensure low signal loss and high signal integrity, guaranteeing optimal performance in high-frequency scenarios.
One of the standout features of the TP2000 PCB is its outstanding thermal stability. With a Thermal Coefficient of
DK (TCDK) of -55 ppm/°C, this material maintains consistent electrical performance across a wide temperature range. Additionally, it exhibits low coefficients of thermal expansion (CTE) in all directions (x, y, and z), providing exceptional dimensional stability and reliability.
The TP2000 PCB offers a plethora of benefits for your designs. With a long-term use temperature range of -100℃
to +150℃, it excels in extreme temperature environments and demonstrates excellent resistance to low temperatures. Moreover, the material is resistant to irradiation and features low exhaust, making it suitable for applications with stringent environmental requirements.
When it comes to manufacturability, the TP2000 PCB Material is highly user-friendly. It can be easily machined through drilling, turning, grinding, shearing, and engraving, offering flexibility in the manufacturing process and enabling precise customization for your specific design needs. This ease of machining ensures efficient production and reduces time-to-market.
Now, let's delve into the construction details of this 2-layer rigid PCB utilizing the TP2000 material. With a board dimension
of 92mm x 350mm (± 0.15mm), this PCB provides ample space for your high-performance designs. The minimum Trace/Space of 8/9 mils allows for precise routing, ensuring signal integrity and minimizing crosstalk. Furthermore, the minimum Hole Size of 1.0mm provides versatility in component mounting.
The TP2000 PCB features a core thickness of 394mil (10mm), providing excellent structural integrity and mechanical strength. The outer layers boast a finished Cu weight of 1oz (1.4 mils), ensuring optimal conductivity. The via plating thickness of 20 μm guarantees reliable interconnections between layers. Additionally, the surface finish of Immersion
Gold offers a solderable surface and enhances the durability of the PCB.
To maintain a streamlined design, this TP2000 PCB does not require top or bottom Silkscreen or Solder Mask. However,
rest assured that each PCB undergoes a comprehensive 100% electrical test prior to shipment, ensuring optimal performance and reliability.
The PCB Statistics for this specific design include 33 components, with a total of 61 pads. Among these pads, there
are 36 thru-hole pads and 25 top SMT pads. The PCB features 41 vias and 4 nets, providing the necessary connectivity
for your circuitry.
Our TP2000 PCB adheres to the widely accepted Gerber RS-274-X artwork standard and meets the stringent IPC
-Class-2 quality standard. By complying with these industry requirements, we ensure reliable performance and
adherence to industry standards. Our TP2000 PCB is available worldwide, allowing customers from all regions
to access its advanced features and benefits.
The TP2000 PCB finds its application in various industries. It is particularly suitable for Beidou, bullet load, fuze,
and miniaturized antenna designs. With its exceptional electrical properties, mechanical strength, and resistance
to extreme temperatures, the TP2000 PCB provides a reliable solution for demanding applications.
For any technical inquiries or further information, please don't hesitate to contact us at sales@bicheng-enterprise.com.
Our dedicated team is ready to assist you with any questions and guide you towards the perfect solution for your
specific PCB design requirements.
| Item |
Value |
| TP2000 PCB Material |
- Ceramic / polyphenylene ether resin (PPO), No glass fiber reinforcement |
| |
- Dielectric Constant at 5 GHz: 20 |
| |
- Dissipation Factor at 5 GHz: 0.002 |
| |
- Thermal Coefficient of DK (TCDK): -55 ppm/°C |
| |
- x CTE: 35 ppm/°C |
| |
- y CTE: 35 ppm/°C |
| |
- z CTE: 40 ppm/°C |
| Stackup |
2-layer rigid PCB |
| |
Copper_layer_1: 35 μm (1oz) |
| |
TP2000 Core: 394 mil (10mm) |
| |
Copper_layer_2: 35 μm (1oz) |
| Construction Details |
Board Dimensions: 92 mm x 350 mm (1 PCS), +/- 0.15 mm |
| |
Minimum Trace/Space: 8/9 mils |
| |
Minimum Hole Size: 1.0 mm |
| |
No Blind Vias |
| |
Finished Board Thickness: 10 mm |
| |
Finished Cu Weight: 1 oz (1.4 mils) outer layers |
| |
Via Plating Thickness: 20 μm |
| |
Surface Finish: Immersion Gold |
| |
Top Silkscreen: No |
| |
Bottom Silkscreen: No |
| |
Top Solder Mask: No |
| |
Bottom Solder Mask: No |
| |
100% Electrical Test Used Prior to Shipment |
| PCB Statistics |
Components: 33 |
| |
Total Pads: 61 |
| |
Thru Hole Pads: 36 |
| |
Top SMT Pads: 25 |
| |
Bottom SMT Pads: 0 |
| |
Vias: 41 |
| |
Nets: 4 |
| Type of Artwork Supplied |
Gerber RS-274-X |
| Quality Standard |
IPC-Class-2 |
| Availability |
Worldwide |
| Features |
- Long-term use temperature of -100°C to +150°C, excellent resistance to low temperature |
| |
- Resistant to irradiation, low exhaust |
| |
- Easy to be machined and can be drilled, turned, ground, sheared, engraved |
| Applications |
- Ideal material for Beidou, bullet load, fuze, miniaturized antenna |
