10 Layer High Frequency PCB Built on 5 Cores of 10mil RO4350B with 4mil RO4450F for Broadband Wireless Solutions
(PCBs are custom-made products; the images and specifications shown are for reference only.)
Introduction
Hello Everyone,
Good day!
In previous discussions, we covered 4 layer and 6 layer RF PCBs. As we know, Rogers multilayer PCBs utilize various core materials. Now, creating a 10-layer RF PCB is straightforward.
This 10 layer RF PCB is constructed using 5 cores of Rogers material. To maintain a manageable thickness, thinner cores are typically employed, such as 6.6mil RO4350B, 10mil RO4350B, 13.3mil RO4350B, 8mil RO4003C, and 12mil RO4003C.
Today, we present a 10 layer PCB made with 5 cores of 10mil RO4350B, combined with RO4450F prepreg. This board is designed for broadband wireless solutions. It has a thickness of 2.0 mm, and the pads are finished with immersion gold plating. The PCB is manufactured according to IPC 6012 Class 2 standards using the provided Gerber data, with each shipment containing 10 boards.
Features and Benefits
1.Exceptional Dimensional Stability: Ensures reliability in various applications.
2.Temperature Resistance: Capable of withstanding extreme temperatures from -192℃ to 260℃.
3.Superior Surface Planarity: Immersion gold finish enhances surface planarity, especially beneficial for PCBs with BGA packages or CSP-mounted components, reducing failure rates during assembly and soldering.
4.Proactive Engineering Design: Prevents issues during preproduction phases.?
5.Cost-Effective Shipping: DDU (Door-to-Door) shipping with competitive rates.
6.Flexible Ordering: No minimum order quantity (MOQ), making it affordable for prototypes and samples.
Applications
RF Transceivers
Communication Relays
Low Noise Blocks
Splitter Modules
PCB Data Sheet
PCB SIZE |
115 x 110mm=1PCS=1design |
BOARD TYPE |
High Frequency PCB, Multilayer PCB |
Number of Layers |
10 layers |
Surface Mount Components |
YES |
Through Hole Components |
NO |
LAYER STACKUP |
TOP Layer: signal - 1/2oz foil + 25μm Cu |
Core RO4350B -0.254mm |
|
INT 1: mixed - 1/2oz foil |
|
Prepreg RO4450F -0.202mm (2 x 0.101) |
|
INT 2: mixed - 1/2oz foil |
|
Core RO4350B -0.254mm |
|
INT 3: mixed - 1/2oz foil |
|
Prepreg RO4450F -0.202mm (2 x 0.101) |
|
INT 4: mixed - 1/2oz foil |
|
Core RO4350B -0.254mm |
|
INT 5: mixed - 1/2oz foil |
|
Prepreg RO4450F -0.202mm (2 x 0.101) |
|
INT 6: mixed - 1/2oz foil |
|
Core RO4350B -0.254mm |
|
INT 7: mixed - 1/2oz foil |
|
Prepreg RO4450F -0.202mm (2 x 0.101) |
|
INT 8: mixed - 1/2oz foil |
|
Core RO4350B -0.254mm |
|
BOT Layer: signal - 1/2oz foil + 25μm Cu |
|
TECHNOLOGY |
|
Minimum Trace and Space: |
5.5mil/5mil |
Minimum / Maximum Holes: |
0.3/2.0mm |
Number of Different Holes: |
9 |
Number of Drill Holes: |
7505 |
Number of Milled Slots: |
0 |
Number of Internal Cutouts: |
0 |
Impedance Control |
NO |
BOARD MATERIAL |
|
Glass Epoxy: |
RO4350B core 0.254mm(10mil), RO4450B PP 0.1mm(4mil) |
Final foil external: |
1oz |
Final foil internal: |
0.5oz |
Final height of PCB: |
2.0mm ±10% |
PLATING AND COATING |
|
Surface Finish |
Electroless nickel over Immersion Gold (ENIG)( 0.05µm over 3µm nickel) |
Solder Mask Apply To: |
N/A |
Solder Mask Color: |
N/A |
Solder Mask Type: |
N/A |
CONTOUR/CUTTING |
Routing |
MARKING |
|
Side of Component Legend |
N/A |
Colour of Component Legend |
N/A |
Manufacturer Name or Logo: |
N/A |
VIA |
Plated Through Hole(PTH), via tented. BGA package |
FLAMIBILITY RATING |
UL 94-V0 Approval MIN. |
DIMENSION TOLERANCE |
|
Outline dimension: |
0.0059" (0.15mm) |
Board plating: |
0.0030" (0.076mm) |
Drill tolerance: |
0.002" (0.05mm) |
TEST |
100% Electrical Test prior shipment |
TYPE OF ARTWORK TO BE SUPPLIED |
email file, Gerber RS-274-X, PCBDOC etc |
SERVICE AREA |
Worldwide, Globally. |