AD300D High Frequency PCB Low PIM Antenna Material Specifications and Applications

August 28, 2025

Introduction to AD300D High Frequency PCB

AD300D is a ceramic-filled, glass-reinforced PTFE-based laminate engineered for superior performance in wireless antenna applications. It delivers a controlled dielectric constant, low signal loss, and excellent passive intermodulation (PIM) performance. Compatible with standard PTFE circuit processing, this material offers a cost-effective solution with enhanced electrical and mechanical properties.

Key Features of AD300D

Outstanding PIM performance: -159 dBc (30 mil) and -163 dBc (60 mil)
Dielectric constant: 2.94 @ 10 GHz
Low dissipation factor: 0.0021 @ 10 GHz
Thermal coefficient of Dk: -73 ppm/°C (0-100°C)
High thermal resilience: Td > 500°C
Low CTE: X/Y-axis 23-24 ppm/°C, Z-axis 98 ppm/°C
Excellent adhesion: >60 minutes to delamination at 288°C
Minimal moisture absorption: 0.04%

PCB Manufacturing Capabilities

We support single-sided, double-sided, multi-layer, and hybrid PCB designs using AD300D. Available copper weights include 1 oz and 2 oz. Dielectric thickness options range from 30 mil to 120 mil. Maximum board size is 400 mm x 500 mm. Solder mask colors include green, black, blue, yellow, and red. Surface finishes offered: Immersion Gold, HASL, Immersion Silver, Immersion Tin, OSP, ENEPIG, Bare Copper, and Pure Gold.

Applications

AD300D is ideal for cellular base station antennas, automotive telematics systems, and commercial satellite radio antennas.

Thank you for your interest.