Comparison and Application Selection of DPC, AMB, and DBC Copper-Clad Ceramic Substrate Technologies
December 28, 2025
In the field of electronic circuits, copper-clad ceramic substrates are widely used due to their excellent electrical and mechanical properties. Among them, DPC (Direct Plated Copper), AMB (Active Metal Brazing), and DBC (Direct Bonded Copper) are three mainstream copper-clad ceramic substrate technologies. This article will compare the characteristics, advantages, and application scenarios of these three technologies in detail to help enterprises better choose the copper-clad ceramic substrate that suits their needs.
1. Process Principles and Characteristics
(1) DPC (Direct Plated Copper)
Process Principle: DPC uses an electroplating process to deposit a copper layer on the ceramic surface, achieving ceramic surface metallization through methods such as magnetron sputtering and pattern electroplating.
Characteristics:
High Precision: DPC technology can produce fine circuits, making it suitable for fields that require high circuit complexity and compact space.
Thin: DPC substrates are typically thin, which facilitates the three-dimensional packaging and integration of electronic devices.
Low-Temperature Preparation: The DPC process is conducted below 300°C, avoiding the adverse effects of high temperatures on the substrate material and metal circuit layers.
(2) AMB (Active Metal Brazing)
Process Principle: AMB achieves metallurgical bonding between the copper layer and the ceramic through active metal solder, significantly enhancing the interface strength.
Characteristics:
High Reliability: AMB substrates have excellent resistance to thermal fatigue and thermal cycle life, making them suitable for high-temperature, high-vibration environments.
High Thermal Conductivity: AMB technology effectively reduces thermal resistance and improves heat dissipation performance.
High Bonding Strength: The copper layer bonding strength of AMB substrates is high, typically above 18 N/mm.
(3) DBC (Direct Bonded Copper)
Process Principle: DBC involves directly sintering copper foil onto the ceramic surface at high temperatures to form a composite substrate.
Characteristics:
Simple Structure: The DBC process is mature and easy for mass production.
Controllable Cost: Compared to AMB and DPC, the cost of DBC is relatively lower.
Balanced Performance: DBC substrates offer balanced thermal conductivity and electrical performance, making them suitable for medium to high-power scenarios.
2. Application Scenario Comparison
DPC
Application Fields: Lidar, high-precision sensors, 5G communication, industrial RF, high-power LEDs, hybrid integrated circuits, etc.
Advantage: DPC technology can meet the requirements of these fields for circuit complexity, compact space, and precision.
AMB
Application Fields: New energy vehicle electric drive systems, ultra-high voltage charging piles, rail transportation, wind power generation, photovoltaics, 5G communication, etc.
Advantage: The high reliability, high thermal conductivity, and thermal fatigue resistance of AMB substrates make them an ideal choice for these high-temperature, high-vibration, and high-power-density scenarios.
DBC
Application Fields: Industrial frequency converters, photovoltaic inverters, residential energy storage, etc.
Advantage: DBC substrates perform well in medium to high-power scenarios, and their cost is controllable, making them suitable for cost-sensitive projects.
3. Selection Recommendations
When selecting a copper-clad ceramic substrate, enterprises should comprehensively consider factors such as power level, environmental stress, and system integration level based on their own needs. For ultra-high voltage and high current scenarios, AMB substrates are the preferred choice; for medium to high power and cost-sensitive projects, DBC substrates are a good option; and for low-power, high-integration demand fields, DPC substrates offer greater advantages.
