CuClad 217 High Frequency PCBs Offer Superior Signal Integrity for Demanding RF Systems

September 28, 2025

In the world of high-frequency electronics, signal speed and purity are critical. Rogers CuClad 217 laminates deliver exactly that—combining woven fiberglass and precisely controlled PTFE in a cross-plied construction that ensures both electrical and mechanical consistency. With the lowest dielectric constant and dissipation factor among fiberglass-reinforced PTFE laminates, CuClad 217 enables faster signal propagation and improved signal-to-noise ratios, making it an ideal substrate for high-performance RF and microwave applications.

What Is CuClad 217?

CuClad 217 is a Rogers laminate engineered with a unique cross-plied construction that provides isotropic electrical and mechanical properties in the planar direction. Its low fiberglass-to-PTFE ratio results in a dielectric constant as low as 2.17–2.20—the lowest available in reinforced PTFE materials. This makes it especially valuable for high-speed, low-loss circuit designs.

Key Features & Benefits

1. Low Dielectric Constant

With a Dk of 2.17 or 2.20, CuClad 217 supports wider conductor widths and reduces insertion loss, simplifying impedance control and improving power handling.

2.Ultra-Low Dissipation Factor

A loss tangent of 0.0009 at 10 GHz minimizes circuit losses, preserving signal integrity in high-frequency and broadband applications.

3.Stable Performance Across Frequency

The material maintains consistent dielectric properties over a wide frequency range, ensuring reliable operation in varied operating conditions.

4.Low Moisture Absorption & Outgassing

CuClad 217 offers excellent dimensional stability and is suitable for use in sensitive or harsh environments, including aerospace and defense systems.

CuClad 217 PCB Capabilities

We support a full suite of manufacturing options for CuClad 217-based designs:

Board Types: Single-sided, double-sided, multilayer, and hybrid configurations
Copper Weight: 1 oz (35µm), 2 oz (70µm), and 3 oz (105µm)
Dielectric Thickness: 10 mil (0.254mm), 20 mil (0.508mm), 31 mil (0.787mm), and 62 mil (1.575mm)
Max. Board Size: Up to 400mm × 500mm
Solder Mask Colors: Green, black, blue, yellow, red, and more
Surface Finishes: ENIG, HASL, Immersion Silver, Immersion Tin, ENEPIG, OSP, Bare Copper, and Pure Gold

Application Areas

CuClad 217 is widely used in high-reliability RF and microwave systems, including:

Radar Systems
Electronic Countermeasures (ECM) and Electronic Support Measures (ESM)
Low-Noise Amplifiers (LNAs)
Filters and Couplers
Aerospace and Defense Communications
Test & Measurement Equipment

Why Choose CuClad 217?

CuClad 217 stands out for applications requiring the lowest possible signal loss and highest signal clarity. Its combination of ultra-low Dk, minimal dissipation, and reliable mechanical properties makes it a top choice for next-generation radar, EW, and communication systems.

Interested in designing with CuClad 217?
Contact us today for technical support or a project consultation.