RO4360G2 High Frequency Circuit Boards for RF and Microwave Applications

August 1,2025

Introduction

Rogers RO4360G2 laminates are advanced, glass-reinforced hydrocarbon ceramic materials offering superior high-frequency performance with FR-4-like processing. Ideal for cost-effective, multi-layer designs, these laminates combine high Dk, low loss, and excellent thermal management.

Key Features

High Dielectric Constant (Dk): 6.15 (Design Dk 6.4) for compact circuit designs.
Low Dissipation Factor: 0.0038 at 10GHz ensures minimal signal loss.
Thermal Management: High thermal conductivity (0.75 W/(m·K)) and low Z-axis CTE (28 ppm/°C).
Durability: High Tg (>280°C) for reliability in demanding environments.
Versatility: Compatible with RO4400 prepreg and RO4000 laminates for hybrid designs.

PCB Capabilities

Types: Double-layer, multi-layer, and hybrid PCBs.
Copper Weights: 1oz (35µm), 2oz (70µm).
Thickness Options: 8mil–60mil (0.203mm–1.524mm).
Panel Size: Up to 400mm × 500mm.
Customization: Multiple solder mask colors (green, black, blue, etc.) and surface finishes (ENIG, HASL, immersion silver, etc.).

Applications

Base station power amplifiers, small cell transceivers, and other high-frequency RF/microwave applications.

Call to Action

Upgrade your high-frequency designs with RO4360G2 PCBs—contact us for tailored solutions!